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Low DC Resistance Molding SMD Power Inductors LanTu Micro SMS0850-1R0MT for Compact Electronic Devices

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Product Description

Molding SMD Power Inductors - SMS0850 Series

Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0850 Series are ultra-high current SMD power inductors designed for high-density installations. These thin, magnetically shielded inductors offer low DC resistance and exceptional anti-electromagnetic interference capabilities. Their integral construction ensures high reliability and superior vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, they achieve low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. These inductors are suitable for frequencies up to 1-2MHz and have an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS0850
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency Test Voltage DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS0850-R56M 0.56 20% 100KHz 1.0V 3.0 4.5 30.00 24.00
SMS0850-R68M 0.68 20% 100KHz 1.0V 3.6 6.0 25.00 23.00
SMS0850-1R0M 1.0 20% 100KHz 1.0V 4.1 5.5 20.00 19.00
SMS0850-1R5M 1.5 20% 100KHz 1.0V 5.0 7.0 19.00 17.00
SMS0850-2R2M 2.2 20% 100KHz 1.0V 8.2 12.0 16.00 14.00
SMS0850-3R3M 3.3 20% 100KHz 1.0V 11.0 15.0 13.00 12.00
SMS0850-4R7M 4.7 20% 100KHz 1.0V 15.0 20.0 12.00 9.50
SMS0850-5R6M 5.6 20% 100KHz 1.0V 25.0 28.5 11.00 9.00
SMS0850-100M 10 20% 100KHz 1.0V 35.0 45.0 8.00 6.20
SMS0850-150M 15 20% 100KHz 1.0V 55.0 65.0 7.00 5.40
SMS0850-220M 22 20% 100KHz 1.0V 78.0 88.0 5.50 4.80
SMS0850-330M 33 20% 100KHz 1.0V 120.0 140.0 6.00 3.50
SMS0850-470M 47 20% 100KHz 1.0V 177.0 190.0 4.00 2.90
SMS0850-560M 56 20% 100KHz 1.0V 188.0 226.0 3.00 2.50
SMS0850-680M 68 20% 100KHz 1.0V 280.0 310.0 2.80 2.00
Inductance Tolerance Codes Description
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%
Packing Codes Description
B Bulk Package
T Tape & Reel
General Specifications Value
Operating Temperature -55 to +125 (Including coils self-temperature rise)
Absolute Maximum Voltage 30VDC
Frequency Capability Up to 1-2MHz
Dimensions (LWH) 0850: 8.58.05.0 mm

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance: WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification Example

SMS 0850 100 M T

  • SMS: Type
  • 0850: External Dimensions (LWH) (mm)
  • 100: Inductance (e.g., 10 H)
  • M: Inductance Tolerance (20%)
  • T: Packing (Tape & Reel)

Shape and Dimensions

Part No. A (0.50) B (0.30) C (Max) D (0.30) E (0.30) F G H
SMS0850 8.5 8.0 5.00 3.0 1.8 4.5 9.5 3.5

(Dimensions are in mm)

Recommended Land Pattern

(Refer to datasheet for visual representation)

Packaging Specifications

Tape and Reel Specifications:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS0850 24.0 12.0 11.5 24.4 100 13 330 1000 2000 8000

(Dimensions are in mm)

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

(Detailed test items, requirements, and methods are available in the full datasheet.)

Recommended Reflow Soldering Curve

(Refer to datasheet for visual representation of the recommended reflow curve.)

Reminders for Using These Products

  • Storage: Within 12 months. Conditions: Temperature 5~40C, Humidity 35~65% RH or less.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oils affecting solderability. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils. Contact manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is on.
  • Layout: For non-magnetic shield types, carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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