High current magnetic resin shielded smd power inductor LanTu Micro SNR8040-6R8MT with rohs and reach compliance
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Product Description
Product Overview
The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly compatible power inductors designed for high-performance applications. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, and a compact, space-saving footprint. These inductors are ideal for a wide range of electronic devices including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR8040 Series
- Construction: Magnetic Resin Shielded SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core (Metallization on Ferrite Core)
- Magnetic Circuit: Closed magnetic circuit design
Technical Specifications
| Part No. | Inductance (H) | L @ 100KHz, 1.0V Tol. | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|
| SNR8040-1R0M | 1.0 | 20% | 0.010 | 9.85 | 6.30 | 8.08.04.0 |
| SNR8040-1R5M | 1.5 | 20% | 0.013 | 8.15 | 5.65 | 8.08.04.0 |
| SNR8040-2R2M | 2.2 | 20% | 0.015 | 7.10 | 5.15 | 8.08.04.0 |
| SNR8040-3R3M | 3.3 | 20% | 0.022 | 6.50 | 4.40 | 8.08.04.0 |
| SNR8040-3R6M | 3.6 | 20% | 0.022 | 6.50 | 4.35 | 8.08.04.0 |
| SNR8040-4R7M | 4.7 | 20% | 0.024 | 5.90 | 4.10 | 8.08.04.0 |
| SNR8040-5R6M | 5.6 | 20% | 0.027 | 4.55 | 3.85 | 8.08.04.0 |
| SNR8040-6R8M | 6.8 | 20% | 0.031 | 4.55 | 3.60 | 8.08.04.0 |
| SNR8040-8R2M | 8.2 | 20% | 0.033 | 4.20 | 3.45 | 8.08.04.0 |
| SNR8040-100M | 10 | 20% | 0.037 | 3.60 | 3.30 | 8.08.04.0 |
| SNR8040-150M | 15 | 20% | 0.061 | 2.95 | 2.80 | 8.08.04.0 |
| SNR8040-180M | 18 | 20% | 0.068 | 2.70 | 2.40 | 8.08.04.0 |
| SNR8040-220M | 22 | 20% | 0.089 | 2.40 | 2.10 | 8.08.04.0 |
| SNR8040-270M | 27 | 20% | 0.101 | 2.15 | 2.00 | 8.08.04.0 |
| SNR8040-330M | 33 | 20% | 0.126 | 2.05 | 1.80 | 8.08.04.0 |
| SNR8040-390M | 39 | 20% | 0.139 | 1.95 | 1.70 | 8.08.04.0 |
| SNR8040-470M | 47 | 20% | 0.176 | 1.75 | 1.55 | 8.08.04.0 |
| SNR8040-680M | 68 | 20% | 0.254 | 1.45 | 1.25 | 8.08.04.0 |
| SNR8040-820M | 82 | 20% | 0.292 | 1.30 | 1.15 | 8.08.04.0 |
| SNR8040-101M | 100 | 20% | 0.377 | 1.15 | 1.00 | 8.08.04.0 |
| SNR8040-121M | 120 | 20% | 0.434 | 1.12 | 0.95 | 8.08.04.0 |
| SNR8040-151M | 150 | 20% | 0.553 | 1.10 | 0.85 | 8.08.04.0 |
| SNR8040-221M | 220 | 20% | 0.778 | 0.85 | 0.80 | 8.08.04.0 |
| SNR8040-331M | 330 | 20% | 1.155 | 0.68 | 0.64 | 8.08.04.0 |
| SNR8040-471M | 470 | 20% | 1.625 | 0.60 | 0.50 | 8.08.04.0 |
| SNR8040-681M | 680 | 20% | 2.652 | 0.50 | 0.45 | 8.08.04.0 |
| SNR8040-102M | 1000 | 20% | 3.640 | 0.40 | 0.35 | 8.08.04.0 |
| Inductance Tolerance Options | Packing Options |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| Environmental Data | Test Equipment |
|---|---|
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | Inductance (L): HP4284A, HP4285A LCR meter or equivalent |
| Current (Isat & Irms): HP4284+42841A or equivalent | |
| DC Resistance (DCR): Chroma 16502 or equivalent |
| Recommended Land Pattern (mm) | Part No. | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|---|
| SNR8040 | 8.00.3 | 8.00.3 | 4.0 Max | 4.00.3 | 6.30.3 | 2.2 Typ | 3.8 Typ | 7.5 Typ |
| Packaging Specifications | Tape Dimension (mm) | Reel Dimensions (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|
| SNR8040 | W: 16, P: 12, W1: 7.5 | 100, 13, 330 | 1000 | 3000 | 12,000 |
| Reliability Testing Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on sectional area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Applied force based on terminal diameter (0.35mm to >1.25mm); Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage; Wetting shall exceed 75% coverage. | Solder temperature: 2402; Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency varied between 10 and 55 Hz for 2 hours in 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, performed twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended reflow soldering curve
The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact SXN if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; the temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction due to overheating.
- Ensure sufficient thermal design margin as devices self-heat when powered on.
- For non-magnetic shielded types, careful layout is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina