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High durability LanTu Micro SNR5020-2R2MT power inductor with ferrite core metallization and ultra low buzz noise reduction

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Product Description

Product Overview

The SNR5020 Series are magnetic resin shielded SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. These automatic assembly compatible inductors are designed to significantly reduce buzz noise to ultra-low levels due to their magnetic-resin shielded construction. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, and metallization on the ferrite core for excellent shock resistance and durability. Their compact size saves PCB real estate and reduces power consumption. These inductors are widely used in applications such as LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: LANTU MICRO ELECTRIC
  • Series: SNR5020
  • Construction: Magnetic Resin Shielded, Automatic Assembly
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Core Material: Ferrite (Metallized electrodes)

Technical Specifications

Part No. Inductance (H) Inductance Tolerance DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH mm)
SNR5020-R47M 0.47 20% 0.017 0.021 4.50 4.60 5.05.02.0
SNR5020-1R0M 1.0 20% 0.020 0.025 4.10 3.80 5.05.02.0
SNR5020-1R5M 1.5 20% 0.026 0.032 3.80 3.20 5.05.02.0
SNR5020-2R2M 2.2 20% 0.032 0.040 3.20 2.90 5.05.02.0
SNR5020-3R3M 3.3 20% 0.043 0.054 2.55 2.50 5.05.02.0
SNR5020-3R9M 3.9 20% 0.043 0.054 2.30 2.50 5.05.02.0
SNR5020-4R7M 4.7 20% 0.057 0.074 2.40 2.20 5.05.02.0
SNR5020-6R8M 6.8 20% 0.083 0.107 2.05 1.80 5.05.02.0
SNR5020-8R2M 8.2 20% 0.098 0.125 1.85 1.65 5.05.02.0
SNR5020-100M 10 20% 0.110 0.140 1.70 1.55 5.05.02.0
SNR5020-120M 12 20% 0.140 0.180 1.50 1.40 5.05.02.0
SNR5020-150M 15 20% 0.165 0.210 1.35 1.25 5.05.02.0
SNR5020-220M 22 20% 0.226 0.290 1.15 1.10 5.05.02.0
SNR5020-330M 33 20% 0.390 0.500 0.95 0.90 5.05.02.0
SNR5020-470M 47 20% 0.523 0.670 0.77 0.77 5.05.02.0
SNR5020-680M 68 20% 0.740 1.050 0.72 0.64 5.05.02.0
SNR5020-820M 82 20% 1.000 1.280 0.66 0.50 5.05.02.0
SNR5020-101M 100 20% 1.100 1.480 0.57 0.53 5.05.02.0
SNR5020-121M 120 20% 1.350 1.700 0.49 0.40 5.05.02.0

Environmental Data

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance: HP4284A, HP4285A LCR meter or equivalent
  • Saturation & Temperature Rise Current: HP4284+42841A or equivalent
  • DCR: Chroma 16502 or equivalent

Product Identification

Example: SNR 5020 470 M T

  • Type: SNR (Shielded SMD Power Inductors)
  • Series: 5020 (5.05.02.0 mm)
  • Inductance: 470 (47 H)
  • Inductance Tolerance: M (20%) (Other tolerances: J:5%, K: 10%, L: 15%, P: 25%, N: 30%)
  • Packing: T (Tape & Reel) (Other packing: B: Bulk Package)

Shape and Dimensions

Item A B C (Max) D E F (Typ) G (Typ) H (Typ)
SNR5020 5.00.3 5.00.3 2.0 2.50.2 4.00.2 1.4 2.3 4.2

(Dimensions are in mm)

Packaging Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SNR5020 12 8 5.5 12.4 100 13 330 3000 12,000 48,000

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on GB/T 2423.60-2008. Solder with lead-free solder. Apply force: 5N to 20N depending on terminal area, duration: 10-30 sec. Solder paste thickness: 0.12mm.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pulling test based on GB/T 2423.60-2008. Apply force: 5N to 40N depending on terminal diameter, duration: 10 sec.
Resistance to Flexure No visible mechanical damage. JIS C 5321:1997. Solder to jig, apply flexure of 2mm at 0.5mm/sec for 30 sec.
Dropping No case deformation or change in appearance. No short and no open. GB/T 2423.7-2018. Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. GB/T 2423.28-2005. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.10-2019. Solder to jig. Simple harmonic motion, amplitude 1.5mm, frequency 10-55 Hz (1 min cycle) for 2 hours in 3 directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.22-2012 Method Na. 100 cycles of -40 to +125 (T time each). Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.1-2008 Method Ab. Temperature: -402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.2-2008 Method Bb. Temperature: 852. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.3-2016. Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. GJB 360B-2009. Perform reflow twice according to recommended curve. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. IEC 68-2-45:1993. Dip in IPA solvent for 50.5 min, dry for 5 min, brush 10 times.
Overload test During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. JIS C5311-6.13. Apply twice rated current for 5 minutes (twice).
Voltage resistance test During test: no breakdown. Characteristics normal after test. MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils).

Recommended Reflow Soldering Curve

A graphical representation of the recommended reflow soldering curve is provided, indicating temperature profiles over time for optimal soldering. Users are advised to adjust and confirm conditions based on their specific equipment and environment.

Reminders for Using These Products

  • Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH or less.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage from dropping or improper removal. Avoid excessive bending of terminals.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose to magnets or magnetic fields.
  • Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions; overheating may cause issues.
  • Thermal Design: Allow sufficient margin for self-heating when power is ON.
  • Non-Magnetic Shield Type: Consider coil layout in board design to prevent malfunction due to magnetic interference (Note: SNR5020 is magnetic shielded).

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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