Compact magnetic resin shielded power inductor LanTu Micro SNR5030-4R7NT with low DCR and enhanced EMI resistance
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Delivery Time:
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SNR5030 Series are magnetic resin shielded SMD power inductors designed for automatic assembly. These inductors feature a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels. They offer large current handling capabilities with low DCR, and a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance. The compact size saves PCB space and reduces power consumption. These inductors are widely used in applications such as LED backlights, flat-screen TVs, notebooks, desktop computers, servers, graphics cards, portable gaming devices, personal multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR5030
- Construction: Magnetic Resin Shielded SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Assembly: Automatic Assembly
- Magnetic Circuit: Closed
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SNR5030-1R0M | 1.0 | 20% | 0.016 | 0.020 | 7.00 | 4.00 | 5.05.03.0 |
| SNR5030-1R5N | 1.5 | 30% | 0.019 | 0.024 | 5.50 | 3.60 | 5.05.03.0 |
| SNR5030-2R2N | 2.2 | 30% | 0.025 | 0.031 | 4.50 | 3.20 | 5.05.03.0 |
| SNR5030-3R3N | 3.3 | 30% | 0.032 | 0.039 | 4.00 | 2.80 | 5.05.03.0 |
| SNR5030-4R7M | 4.7 | 20% | 0.052 | 0.065 | 3.00 | 2.20 | 5.05.03.0 |
| SNR5030-5R6N | 5.6 | 30% | 0.056 | 0.070 | 3.00 | 2.10 | 5.05.03.0 |
| SNR5030-6R8M | 6.8 | 20% | 0.060 | 0.075 | 2.80 | 2.00 | 5.05.03.0 |
| SNR5030-100M | 10 | 20% | 0.080 | 0.100 | 2.10 | 1.80 | 5.05.03.0 |
| SNR5030-150M | 15 | 20% | 0.125 | 0.156 | 1.70 | 1.40 | 5.05.03.0 |
| SNR5030-220M | 22 | 20% | 0.210 | 0.260 | 1.60 | 1.10 | 5.05.03.0 |
| SNR5030-330M | 33 | 20% | 0.330 | 0.410 | 1.20 | 0.85 | 5.05.03.0 |
| SNR5030-470M | 47 | 20% | 0.375 | 0.468 | 0.90 | 0.80 | 5.05.03.0 |
| SNR5030-101M | 100 | 20% | 0.800 | 0.988 | 0.75 | 0.56 | 5.05.03.0 |
| SNR5030-151M | 150 | 20% | 1.180 | 1.470 | 0.55 | 0.46 | 5.05.03.0 |
| SNR5030-221M | 220 | 20% | 1.700 | 2.080 | 0.45 | 0.39 | 5.05.03.0 |
| SNR5030-331M | 330 | 20% | 2.800 | 3.500 | 0.35 | 0.30 | 5.05.03.0 |
| SNR5030-471M | 470 | 20% | 3.800 | 4.700 | 0.30 | 0.26 | 5.05.03.0 |
| SNR5030-102M | 1000 | 20% | 8.700 | 10.800 | 0.20 | 0.17 | 5.05.03.0 |
| Inductance Tolerance Codes | Description |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
| Packing Codes | Description |
|---|---|
| B | Bulk Package |
| T | Tape & Reel |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment | Instrument |
|---|---|
| Inductance (L) | HP4284A, HP4285A LCR meter or equivalent |
| Current (Isat & Irms) | HP4284+42841A or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
| Shape and Dimensions | Value (mm) |
|---|---|
| L | 5.0 0.3 |
| W | 5.0 0.3 |
| H | 3.0 Max |
| A (Land Pattern) | 2.5 0.2 |
| B (Land Pattern) | 4.0 0.2 |
| C (Land Pattern) | 1.4 Typ |
| D (Land Pattern) | 2.3 Typ |
| E (Land Pattern) | 4.2 Typ |
| Packaging Quantity | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|
| SNR5030 | 2000 | 8000 | 32,000 |
| Reliability Test Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Applied force based on terminal diameter (5N to 40N); Duration: 10sec |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec |
| Dropping Test | No case deformation or change in appearance; No short and no open | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice each direction |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol |
| Vibration Test | Inductance change: Within 10%; Q factor change: Within 20% | Amplitude 1.5mm, frequency 10-55 Hz, 2 hours in 3 perpendicular directions |
| Thermal Shock | Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20% | 100 cycles of temperature cycling between high (85~125) and low (-55~40); Transforming interval: Max. 20 sec |
| Low Temperature Storage | Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20% | Temperature: -55~-402; Duration: 962 hours |
| High Temperature Storage | Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20% | Temperature: 125~852; Duration: 962 hours |
| Damp Heat (Steady States) | Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20% | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours |
| Heat endurance of Reflow soldering | L/L10% (Mn-Zn: L/L30%); Q/Q30%; DCR/DCR10% | Peak temperature: 260+0/-5, twice reflow |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times |
| Overload test | No smoke, smell, fire; Characteristic normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | No breakdown; Characteristic normal after test | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils) |
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35-65% RH or less.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions; overheating may cause issues.
- Thermal Design: Allow sufficient margin for self-heating when power is on.
- Layout: For non-magnetic shielded types, consider coil placement to avoid malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina