Unshielded SMD Power Inductors LanTu Micro SSD0804-221MT Compliant with RoHS Halogen Free and REACH Standards
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Product Description
Unshielded SMD Power Inductors - SSD0804 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0804 Series offers high-power, unshielded SMD power inductors designed for surface mounting applications. These inductors feature high saturation and low DC resistance, making them suitable for various electronic devices including laptop computers, LCD televisions, and DC/DC converters. They are available in multiple package sizes and a wide inductance range, with RoHS, Halogen Free, and REACH compliance.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SSD0804
- Type: Unshielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
Product Identification: SSD 0804 [Inductance] [Tolerance] [Packing]
Example: SSD0804-100M T
General Specifications
| Parameter | Description |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (SRF) | Agilent E4991A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Dimensions
| Part No. | External Dimensions (LWH) (mm) | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 12.959.45.21 | 12.95 | 9.4 | 5.21 | 7.62 | 2.54 | 2.54 | 2.79 | 2.92 | 7.37 |
Electrical Characteristics
| Part No. | Inductance (H) | Tolerance | Test Freq (KHz) | SRF @0A (MHz) Typ | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SSD0804-1R0M | 1.0 | 20% | 100KHz | 100 | 0.009 | 9.00 | 6.80 |
| SSD0804-1R5M | 1.5 | 20% | 100KHz | 90 | 0.010 | 8.00 | 6.40 |
| SSD0804-2R2M | 2.2 | 20% | 100KHz | 80 | 0.012 | 7.00 | 6.10 |
| SSD0804-3R3M | 3.3 | 20% | 100KHz | 65 | 0.015 | 6.40 | 5.40 |
| SSD0804-4R7M | 4.7 | 20% | 100KHz | 45 | 0.018 | 5.40 | 4.80 |
| SSD0804-6R8M | 6.8 | 20% | 100KHz | 38 | 0.027 | 4.60 | 4.40 |
| SSD0804-100M | 10 | 20% | 100KHz | 30 | 0.038 | 3.80 | 3.90 |
| SSD0804-150M | 15 | 20% | 100KHz | 27 | 0.046 | 3.50 | 3.10 |
| SSD0804-220M | 22 | 20% | 100KHz | 19 | 0.085 | 3.00 | 2.70 |
| SSD0804-330M | 33 | 20% | 100KHz | 15 | 0.100 | 2.60 | 2.10 |
| SSD0804-470M | 47 | 20% | 100KHz | 12 | 0.140 | 2.00 | 1.60 |
| SSD0804-680M | 68 | 20% | 100KHz | 10 | 0.200 | 1.60 | 1.40 |
| SSD0804-101M | 100 | 20% | 100KHz | 9 | 0.280 | 1.40 | 1.20 |
| SSD0804-151K | 150 | 10% | 100KHz | 6 | 0.400 | 1.20 | 1.00 |
| SSD0804-221K | 220 | 10% | 100KHz | 5 | 0.610 | 1.00 | 0.80 |
| SSD0804-331K | 330 | 10% | 100KHz | 4.5 | 1.020 | 0.60 | 0.60 |
| SSD0804-471K | 470 | 10% | 100KHz | 3.5 | 1.270 | 0.50 | 0.50 |
| SSD0804-681K | 680 | 10% | 100KHz | 2.5 | 2.020 | 0.40 | 0.40 |
| SSD0804-102K | 1000 | 10% | 100KHz | 2.0 | 3.000 | 0.30 | 0.30 |
Definitions
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging
| Packing Type | Description |
|---|---|
| Bulk Package | B |
| Tape & Reel | T |
Tape and Reel Specifications
| Part No. | Tape Dimension W (mm) | P (mm) | W1 (mm) | Reel Dimensions A (mm) | B (mm) | C (mm) | D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Reliability Testing Summary
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without loose terminal | GB/T 2423.60-2008 (SMT & DIP) |
| Resistance to Flexure | No visible mechanical damage | JIS C 5321:1997 |
| Dropping | No case deformation, short, or open | GB/T 2423.7-2018 |
| Solderability | Wetting > 75% coverage, Terminals > 95% solder coverage | GB/T 2423.28-2005 |
| Vibration | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.22-2012 Method Na |
| Low Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.1-2008 Method Ab |
| High Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.2-2008 Method Bb |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | No significant defects, L/L10%, Q/Q30%, DCR/DCR10% | GJB 360B-2009 |
| Resistance to solvent test | No case deformation or change in appearance | IEC 68-2-45:1993 |
| Overload test | No smoke, peculiar smell, fire; characteristics normal after test | JIS C5311-6.13 |
| Voltage resistance test | No breakdown; characteristics normal after test | MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Avoid use and storage in corrosive environments (salt, acid, alkali).
- Avoid direct contact with terminals by bare hands due to oil secretions.
- Handle carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
- Allow for sufficient thermal design margin due to self-heating when power is on.
- For non-magnetic shield types, careful PCB layout is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina