Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR4030-3R3MT with Low DCR and EMI Resistance
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Product Description
Product Overview
The SNR4030 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors featuring magnetic resin shielding to significantly reduce buzz noise to ultra-low levels. They offer large current handling capability with low DCR, excellent shock resistance due to metallization on the ferrite core, and strong EMI resistance due to a closed magnetic circuit design. These space-saving and power-efficient inductors are widely used in applications such as LED backlights, flat-screen TVs, notebooks, servers, graphic cards, automotive products, and DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SNR4030
- Construction: Magnetic Resin Shielded, Automatic Assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
General Dimensions:
| Part No | L (mm) | W (mm) | H (mm) | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (Typ) (mm) | G (Typ) (mm) | H (Typ) (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 4.0 0.3 | 4.0 0.3 | 3.0 Max | 2.1 0.2 | 3.3 0.2 | 1.1 | 1.9 | 3.7 | - | - | - |
Electrical Characteristics:
| Part No | Inductance (H) | Inductance Tolerance | Frequency (100KHz) | Voltage (1.0V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.014 | 0.018 | 5.26 | 4.15 |
| SNR4030-1R2M | 1.2 | 20% | 100KHz | 1.0V | 0.015 | 0.020 | 5.26 | 3.82 |
| SNR4030-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.020 | 0.026 | 4.84 | 3.34 |
| SNR4030-1R8M | 1.8 | 20% | 100KHz | 1.0V | 0.025 | 0.033 | 4.84 | 3.20 |
| SNR4030-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 4.40 | 2.95 |
| SNR4030-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.040 | 0.050 | 3.30 | 2.40 |
| SNR4030-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.060 | 0.076 | 2.90 | 2.00 |
| SNR4030-5R6M | 5.6 | 20% | 100KHz | 1.0V | 0.073 | 0.091 | 2.75 | 1.90 |
| SNR4030-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.090 | 0.115 | 2.60 | 1.60 |
| SNR4030-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.095 | 0.122 | 2.10 | 1.60 |
| SNR4030-100M | 10 | 20% | 100KHz | 1.0V | 0.100 | 0.130 | 1.95 | 1.50 |
| SNR4030-120M | 12 | 20% | 100KHz | 1.0V | 0.135 | 0.172 | 1.70 | 1.30 |
| SNR4030-150M | 15 | 20% | 100KHz | 1.0V | 0.190 | 0.230 | 1.65 | 1.11 |
| SNR4030-220M | 22 | 20% | 100KHz | 1.0V | 0.225 | 0.290 | 1.30 | 1.00 |
| SNR4030-330M | 33 | 20% | 100KHz | 1.0V | 0.330 | 0.420 | 1.10 | 0.84 |
| SNR4030-470M | 47 | 20% | 100KHz | 1.0V | 0.445 | 0.570 | 0.95 | 0.72 |
| SNR4030-680M | 68 | 20% | 100KHz | 1.0V | 0.868 | 1.100 | 0.72 | 0.52 |
| SNR4030-820M | 82 | 20% | 100KHz | 1.0V | 1.060 | 1.280 | 0.66 | 0.47 |
| SNR4030-101M | 100 | 20% | 100KHz | 1.0V | 1.150 | 1.480 | 0.60 | 0.45 |
| SNR4030-121M | 120 | 20% | 100KHz | 1.0V | 1.350 | 1.700 | 0.55 | 0.42 |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Environmental Data:
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
Test Equipment:
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Packaging Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test (force varies by terminal cross-sectional area), Solder paste thickness: 0.12mm, Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pull Force (force varies by terminal diameter), Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in shown direction, Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig, subjected to simple harmonic motion (10 to 55 Hz), 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Start at (85~125) for T time, rush to (-55~40) for T time as one cycle, 100 cycles. Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve: Please refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products:
- Storage period: within 12 months under conditions (5~40C, 35~65% RH).
- Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Do not touch electrodes directly with bare hands.
- Handle products carefully to prevent damage.
- Do not bend terminals excessively.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specifications. Overheating may cause issues.
- Allow sufficient thermal design margin for self-heating during operation.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina