High Precision LanTu Micro SDRH105R-102MT Shielded SMD Power Inductors with Closed Magnetic Circuit Design
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Product Description
Product Overview
The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR, featuring a closed magnetic circuit to minimize leakage. These inductors offer high-accuracy dimensions suitable for automatic mounting, a wide range of package sizes, and inductance values. They are RoHS, Halogen Free, and REACH compliant, making them ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRH105R
- Type: Shielded SMD Power Inductors
- Origin: SHENZHEN, CHINA
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
Technical Specifications
General Specifications:
| Attribute | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coil self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
| Component | Description |
|---|---|
| Type | SDRH |
| Series | 105R |
| Inductance | e.g., 100 (10 H) |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | T: Tape & Reel, B: Bulk Package |
Dimensions:
| Part No. | External Dimensions (LWH) (mm) |
|---|---|
| SDRH105R | 10.3 10.5 5.0 |
Recommended Land Pattern (mm):
| ITEM | A | B | C | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 10.3 Max | 10.5 Max | 5.0 Max | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
Electrical Characteristics (at 25):
| Part No. | Inductance (H) | Tolerance | Test Freq. | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SDRH105R-3R3N | 3.3 | 30% | 100KHz | 0.013 | 9.50 | 6.50 |
| SDRH105R-4R7N | 4.7 | 30% | 100KHz | 0.016 | 9.20 | 6.30 |
| SDRH105R-6R8N | 6.8 | 30% | 1 | 0.020 | 7.00 | 6.00 |
| SDRH105R-8R2N | 8.2 | 30% | 100KHz | 0.023 | 5.50 | 5.00 |
| SDRH105R-100N | 10 | 30% | 100KHz | 0.250 | 5.10 | 4.40 |
| SDRH105R-120N | 12 | 30% | 100KHz | 0.032 | 4.90 | 4.00 |
| SDRH105R-150N | 15 | 30% | 100KHz | 0.040 | 4.20 | 3.60 |
| SDRH105R-180M | 18 | 20% | 100KHz | 0.046 | 3.70 | 3.40 |
| SDRH105R-220M | 22 | 20% | 100KHz | 0.058 | 3.30 | 3.20 |
| SDRH105R-270M | 27 | 20% | 100KHz | 0.650 | 3.20 | 3.00 |
| SDRH105R-330M | 33 | 20% | 100KHz | 0.810 | 2.70 | 2.60 |
| SDRH105R-390M | 39 | 20% | 100KHz | 0.103 | 2.48 | 2.50 |
| SDRH105R-470M | 47 | 20% | 100KHz | 0.122 | 2.35 | 2.30 |
| SDRH105R-560M | 56 | 20% | 100KHz | 0.144 | 2.30 | 2.10 |
| SDRH105R-680M | 68 | 20% | 100KHz | 0.193 | 2.00 | 1.90 |
| SDRH105R-820M | 82 | 20% | 100KHz | 0.219 | 1.80 | 1.60 |
| SDRH105R-101M | 100 | 20% | 100KHz | 0.247 | 1.50 | 1.35 |
| SDRH105R-121M | 120 | 20% | 100KHz | 0.298 | 1.40 | 1.18 |
| SDRH105R-151M | 150 | 20% | 100KHz | 0.355 | 1.30 | 1.10 |
| SDRH105R-181M | 180 | 20% | 100KHz | 0.393 | 1.20 | 1.00 |
| SDRH105R-221M | 220 | 20% | 100KHz | 0.483 | 1.08 | 0.94 |
| SDRH105R-271M | 270 | 20% | 100KHz | 0.632 | 0.88 | 0.80 |
| SDRH105R-331M | 330 | 20% | 100KHz | 0.780 | 0.85 | 0.73 |
| SDRH105R-391M | 390 | 20% | 100KHz | 0.957 | 0.78 | 0.70 |
| SDRH105R-471M | 470 | 20% | 100KHz | 1.220 | 0.71 | 0.54 |
| SDRH105R-561M | 560 | 20% | 100KHz | 1.352 | 0.65 | 0.52 |
| SDRH105R-681M | 680 | 20% | 100KHz | 1.519 | 0.59 | 0.51 |
| SDRH105R-821M | 820 | 20% | 100KHz | 1.694 | 0.51 | 0.48 |
| SDRH105R-102M | 1000 | 20% | 100KHz | 1.946 | 0.49 | 0.42 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 800 | 1600 | 6400 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test: Force varies by terminal sectional area (5N to 20N). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pull Force: Applied gradually to the terminal and maintained for 10 seconds. Force varies by terminal diameter (5N to 40N). |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force (2mm flexure), Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high (1 angle, 3 ridges, 6 surfaces, twice each direction). |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to test jig, subjected to simple harmonic motion (1.5mm amplitude, 10-55 Hz), 2 hours in 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles of temperature change between (85~125) and (-55~40). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: 30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm conditions based on their specific equipment and process.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate after storage period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheating is required before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil placement is required in PCB design to prevent malfunctions due to magnetic interference.
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Contact Person
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