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Shielded SMD Power Inductors LanTu Micro SDRI129-151MT with Low DCR and High Saturation Current

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Product Description

Product Overview

The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current, and low DCR for efficient operation. Their highly accurate dimensions ensure suitability for automatic mounting. Compliant with RoHS, Halogen Free, and REACH standards, they are ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: SDRI129 Series
  • Type: Shielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Magnetic Circuit Design: Closed magnetic circuit
  • Mounting Type: SMD (Surface Mount Device)

Technical Specifications

Part No. Inductance (H) Tolerance Test Frequency DCR () Max @ 0A Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH) (mm)
SDRI129-1R0N 1.0 30% 100KHz 0.0060 19.90 11.60 12.512.510.0
SDRI129-1R8N 1.8 30% 100KHz 0.0075 13.40 11.00 12.512.510.0
SDRI129-2R2N 2.2 30% 100KHz 0.0090 12.20 10.30 12.512.510.0
SDRI129-3R3N 3.3 30% 100KHz 0.010 12.00 9.00 12.512.510.0
SDRI129-4R7N 4.7 30% 100KHz 0.012 10.08 8.50 12.512.510.0
SDRI129-5R6N 5.6 30% 100KHz 0.014 9.50 8.00 12.512.510.0
SDRI129-6R8N 6.8 30% 100KHz 0.015 8.56 7.90 12.512.510.0
SDRI129-8R2N 8.2 30% 100KHz 0.017 8.48 7.30 12.512.510.0
SDRI129-100M 10 20% 1KHz 0.018 7.12 6.95 12.512.510.0
SDRI129-120M 12 20% 1KHz 0.022 7.04 6.20 12.512.510.0
SDRI129-150M 15 20% 1KHz 0.032 5.84 5.22 12.512.510.0
SDRI129-180M 18 20% 1KHz 0.035 5.50 5.10 12.512.510.0
SDRI129-220M 22 20% 1KHz 0.038 5.12 4.95 12.512.510.0
SDRI129-270M 27 20% 1KHz 0.040 5.00 4.20 12.512.510.0
SDRI129-330M 33 20% 1KHz 0.052 4.25 3.60 12.512.510.0
SDRI129-390M 39 20% 1KHz 0.066 4.20 3.50 12.512.510.0
SDRI129-470M 47 20% 1KHz 0.072 3.60 3.45 12.512.510.0
SDRI129-560M 56 20% 1KHz 0.090 2.85 2.95 12.512.510.0
SDRI129-680M 68 20% 1KHz 0.102 2.76 2.85 12.512.510.0
SDRI129-820M 82 20% 1KHz 0.112 2.62 2.60 12.512.510.0
SDRI129-101M 100 20% 1KHz 0.126 2.31 2.45 12.512.510.0
SDRI129-121M 120 20% 1KHz 0.154 2.05 2.20 12.512.510.0
SDRI129-151M 150 20% 1KHz 0.174 1.80 1.90 12.512.510.0
SDRI129-181M 180 20% 1KHz 0.191 1.66 1.86 12.512.510.0
SDRI129-221M 220 20% 1KHz 0.246 1.64 1.72 12.512.510.0
SDRI129-271M 270 20% 1KHz 0.330 1.35 1.50 12.512.510.0
SDRI129-331M 330 20% 1KHz 0.386 1.28 1.28 12.512.510.0
SDRI129-391M 390 20% 1KHz 0.440 1.20 1.27 12.512.510.0
SDRI129-471M 470 20% 1KHz 0.471 1.06 1.25 12.512.510.0
SDRI129-561M 560 20% 1KHz 0.650 1.01 0.98 12.512.510.0
SDRI129-681M 680 20% 1KHz 0.730 0.83 0.96 12.512.510.0
SDRI129-821M 820 20% 1KHz 0.824 0.81 0.94 12.512.510.0
SDRI129-102M 1000 20% 1KHz 1.220 0.70 0.78 12.512.510.0
SDRI129-122M 1200 20% 1KHz 1.330 0.64 0.79 12.512.510.0
SDRI129-152M 1500 20% 1KHz 1.990 0.56 0.58 12.512.510.0
SDRI129-182M 1800 20% 1KHz 2.180 0.48 0.54 12.512.510.0
SDRI129-222M 2200 20% 1KHz 2.580 0.43 0.52 12.512.510.0

Environmental Data:

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

  • Inductance (L): HP4284A or HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284A+42841A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification: SDRI 129 220 M T

  • Type: SDRI (Shielded SMD Power Inductors)
  • Dimensions: 129 (12.512.510.0 mm)
  • Inductance: e.g., 220 (22 H)
  • Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • Packing: T (Tape & Reel), B (Bulk Package)

Packaging:

Part No. Tape Dimension (mm) W Tape Dimension (mm) P Tape Dimension (mm) H Reel Dimensions (mm) A Reel Dimensions (mm) B Reel Dimensions (mm) C Reel Dimensions (mm) D REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRI129 24 16 11.5 24.4 330 400 800 3200 100 13

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test with specified forces based on terminal area. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pull Force applied gradually to terminal for 10 seconds, with force varying based on terminal diameter.
Resistance to Flexure No visible mechanical damage. Solder to test jig, apply force in specified direction. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in specified angles/surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Solder to testing jig. Subject to harmonic motion (10 to 55 Hz, 1.5mm amplitude) for 2 hours in 3 perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. 100 cycles of temperature shock between specified high and low temperatures. Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring.
High temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Refer to recommended reflow curve, go through reflow twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times.
Overload test During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During the test no breakdown. The characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended reflow soldering curve:

The recommended reflow conditions are set according to soldering equipment. Adjust and confirm according to user's environment/equipment.

Reminders for Using These Products:

  • Storage Period: Within 12 months. Storage Conditions: temperature 5~40C, humidity 35~65% RH or less.
  • Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions affecting soldering.
  • Handle products carefully to prevent damage from dropping or inappropriate removing.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils by yourself; contact SXN if necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering. Temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuit, performance deterioration, or lifespan shortening.
  • Allow sufficient margin for thermal design due to self-heating when power is ON.
  • For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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