Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR5040-100MT with Low DCR and EMI Resistance
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The SNR5040 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors designed to reduce buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, offering large current handling capability with low DCR. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive products, and DC-DC converters. They are constructed with metallization on the ferrite core for excellent shock resistance and durability, and comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR5040
- Construction: Magnetic Resin Shielded SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification
| Component | Description |
|---|---|
| SNR | Shielded SMD Power Inductors (Closed magnetic circuit) |
| 5040 | External Dimensions (LWH) in mm: 5.0 4.0 4.0 |
| Inductance Value (e.g., 470) | Inductance in H (e.g., 47 H) |
| M | Inductance Tolerance (M: 20%) |
| T | Packing (T: Tape & Reel) |
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR5040 | 5.00.3 | 5.00.3 | 4.0 Max | 2.50.2 | 4.00.2 | 1.4 | 2.3 | 4.2 |
Electrical Characteristics
| Part No. | Inductance (H) | Tol. | L (100KHz, 1.0V) Typical () | DCR Max () | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|
| SNR5040-1R0M | 1.0 | 20% | 0.012 | 0.018 | 7.35 | 4.90 |
| SNR5040-1R2M | 1.2 | 20% | 0.016 | 0.021 | 6.50 | 4.30 |
| SNR5040-1R5M | 1.5 | 20% | 0.015 | 0.020 | 6.30 | 4.30 |
| SNR5040-2R2M | 2.2 | 20% | 0.019 | 0.025 | 4.90 | 3.80 |
| SNR5040-3R3M | 3.3 | 20% | 0.024 | 0.031 | 3.95 | 3.40 |
| SNR5040-4R7M | 4.7 | 20% | 0.030 | 0.039 | 3.50 | 3.00 |
| SNR5040-6R8M | 6.8 | 20% | 0.043 | 0.056 | 2.90 | 2.50 |
| SNR5040-8R2M | 8.2 | 20% | 0.050 | 0.070 | 2.70 | 2.30 |
| SNR5040-100M | 10 | 20% | 0.064 | 0.082 | 2.35 | 2.10 |
| SNR5040-120M | 12 | 20% | 0.077 | 0.102 | 2.20 | 2.00 |
| SNR5040-150M | 15 | 20% | 0.086 | 0.115 | 2.00 | 2.00 |
| SNR5040-220M | 22 | 20% | 0.129 | 0.167 | 1.60 | 1.50 |
| SNR5040-330M | 33 | 20% | 0.188 | 0.244 | 1.30 | 1.20 |
| SNR5040-470M | 47 | 20% | 0.272 | 0.353 | 1.10 | 1.00 |
| SNR5040-680M | 68 | 20% | 0.400 | 0.520 | 0.90 | 0.80 |
| SNR5040-820M | 82 | 20% | 0.560 | 0.660 | 0.80 | 0.75 |
| SNR5040-101M | 100 | 20% | 0.509 | 0.728 | 0.75 | 0.70 |
| SNR5040-121M | 120 | 20% | 0.665 | 0.864 | 0.70 | 0.65 |
| SNR5040-151M | 150 | 20% | 0.750 | 0.975 | 0.65 | 0.60 |
| SNR5040-221M | 220 | 20% | 1.400 | 1.820 | 0.48 | 0.40 |
| SNR5040-331M | 330 | 20% | 2.000 | 2.730 | 0.42 | 0.40 |
| SNR5040-471M | 470 | 20% | 3.000 | 3.900 | 0.37 | 0.35 |
| SNR5040-681M | 680 | 20% | 3.900 | 5.070 | 0.30 | 0.25 |
| SNR5040-102M | 1000 | 20% | 6.000 | 7.800 | 0.21 | 0.23 |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Packaging Specifications (Tape & Reel)
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) | Total Quantity per Carton |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SNR5040 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 1500 | 6000 | 24,000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area (e.g., A8mm, force5N, 30sec). Solder with lead-free solder. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on terminal diameter (e.g., 0.35d0.50mm, force:5N, 10sec). Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, apply force (2mm flexure), Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 perpendicular directions. |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature change (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252, Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L10%, Q/Q30% (SMD series only), DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm based on their specific reflow soldering equipment, process conditions, and environment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Failure to do so may lead to deterioration of terminal electrode solderability.
- Environment: Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands due to grease, which can reduce solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating (temperature increase) when the device is energized in thermal design.
- Non-Magnetic Shielded Type: For non-magnetic shielded types, careful layout on the circuit board is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina