Molding SMD Power Inductors - SMS1050 Series
Product Overview
The SMS1050 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors with a thin design, low DC resistance, and magnetic shielding for strong anti-electromagnetic interference. These inductors are ideal for high-density installations and feature high reliability with excellent vibration resistance due to their integral construction. The composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. They operate at frequencies up to 3MHz and are suitable for various applications including PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS1050
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications
| Parameter | Value |
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Absolute Maximum Voltage | 30VDC |
| Frequency Capability | Up to 3MHz |
Electrical Characteristics (at 25)
| Part No. | Inductance (H) @ 0A | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
| SMS1050-R82M | 0.82 | 20% | 2.5 | 3.2 | 39.00 | 22.00 |
| SMS1050-1R0M | 1.0 | 20% | 2.8 | 3.5 | 30.00 | 20.30 |
| SMS1050-1R2M | 1.2 | 20% | 2.8 | 3.5 | 28.00 | 18.00 |
| SMS1050-1R5M | 1.5 | 20% | 3.9 | 4.8 | 25.00 | 16.00 |
| SMS1050-2R2M | 2.2 | 20% | 6.5 | 8.2 | 20.00 | 13.00 |
| SMS1050-3R3M | 3.3 | 20% | 9.2 | 12.0 | 18.00 | 10.00 |
| SMS1050-4R7M | 4.7 | 20% | 12.4 | 18.0 | 14.00 | 9.50 |
| SMS1050-5R6M | 5.6 | 20% | 18.9 | 25.0 | 13.00 | 8.50 |
| SMS1050-6R8M | 6.8 | 20% | 20.6 | 28.0 | 12.00 | 8.00 |
| SMS1050-8R2M | 8.2 | 20% | 27.4 | 35.0 | 10.00 | 7.00 |
| SMS1050-100M | 10 | 20% | 30.2 | 40.0 | 8.50 | 5.50 |
| SMS1050-150M | 15 | 20% | 48.0 | 55.0 | 7.00 | 4.50 |
| SMS1050-220M | 22 | 20% | 60.0 | 72.0 | 5.50 | 4.00 |
| SMS1050-330M | 33 | 20% | 89.0 | 105.0 | 5.50 | 3.50 |
| SMS1050-470M | 47 | 20% | 110.0 | 130.0 | 4.50 | 3.00 |
| SMS1050-680M | 68 | 20% | 190.0 | 210.0 | 3.00 | 2.00 |
Inductance Tolerance Codes
| Code | Tolerance |
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Shape and Dimensions (mm)
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
| SMS1050 | 11.50 | 10.00 | 5.00 | 3.00 | 2.00 | 5.40 | 13.60 | 4.10 |
Product Identification Example
SMS 1050 100 M T
- SMS: Type
- 1050: External Dimensions (LWH) (mm) 11.510.05.0
- 100: Inductance 10 uH
- M: Inductance Tolerance (20%)
- T: Packing Type (Tape & Reel)
Packaging
| Packing Type | Description |
| Bulk Package | |
| Tape & Reel | |
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Current (Isat & Irms): WK3260B + WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reminders for Using These Products
- Storage period is within 12 months under conditions (5~40C, 35~65% RH).
- Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Do not touch terminals directly with bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
- Ensure sufficient thermal design margin for self-heating when power is ON.
- For non-magnetic shield types, careful layout is needed to prevent malfunction due to magnetic interference.
