Molding SMD Power Inductor LanTu Micro SMS1050-4R7MT Designed for and Low Parasitic Capacitance
Molding SMD Power Inductors - SMS1050 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1050 Series offers ultra-high current SMD power inductors with a thin design, low DC resistance, and magnetic shielding for strong anti-electromagnetic interference. These high-reliability components feature an integral construction for excellent vibration resistance and a composite structure that minimizes buzz noise. Designed for high efficiency, they utilize low-loss alloy powder for die-casting, resulting in low impedance and small parasitic capacitance. Suitable for frequencies up to 3MHz, these inductors are ideal for applications requiring high current density and robust performance, such as PDAs, notebooks, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1050
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Electrical Characteristics
| Part No | Inductance (H) @ 100KHz, 1.0V | Tol. | DCR (m) Max | Saturation Current (A) Typical (at 30% drop) | Heat Rating Current (A) Typical (T=40) |
|---|---|---|---|---|---|
| SMS1050-R82M | 0.82 | 20% | 3.2 | 39.00 | 22.00 |
| SMS1050-1R0M | 1.0 | 20% | 3.5 | 30.00 | 20.30 |
| SMS1050-1R2M | 1.2 | 20% | 3.5 | 28.00 | 18.00 |
| SMS1050-1R5M | 1.5 | 20% | 4.8 | 25.00 | 16.00 |
| SMS1050-2R2M | 2.2 | 20% | 8.2 | 20.00 | 13.00 |
| SMS1050-3R3M | 3.3 | 20% | 12.0 | 18.00 | 10.00 |
| SMS1050-4R7M | 4.7 | 20% | 18.0 | 14.00 | 9.50 |
| SMS1050-5R6M | 5.6 | 20% | 25.0 | 13.00 | 8.50 |
| SMS1050-6R8M | 6.8 | 20% | 28.0 | 12.00 | 8.00 |
| SMS1050-8R2M | 8.2 | 20% | 35.0 | 10.00 | 7.00 |
| SMS1050-100M | 10 | 20% | 40.0 | 8.50 | 5.50 |
| SMS1050-150M | 15 | 20% | 55.0 | 7.00 | 4.50 |
| SMS1050-220M | 22 | 20% | 72.0 | 5.50 | 4.00 |
| SMS1050-330M | 33 | 20% | 105.0 | 5.50 | 3.50 |
| SMS1050-470M | 47 | 20% | 130.0 | 4.50 | 3.00 |
| SMS1050-680M | 68 | 20% | 210.0 | 3.00 | 2.00 |
Inductance Tolerance Codes
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Dimensions (mm)
| Part No | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1050 | 11.50 | 10.00 | 5.00 | 3.00 | 2.00 | 5.40 | 13.60 | 4.10 |
General Specifications
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
- Absolute Maximum Voltage: 30VDC
- Frequency: Up to 3MHz
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Packaging
- Packing Types: Bulk Package (B), Tape & Reel (T)
Reminders for Using These Products
- Storage period is within 12 months; storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact SXN if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip temperature should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause short circuits, performance deterioration, or lifespan shortening.
- Sufficient thermal design margin is required due to self-heating when power is ON.
- For non-magnetic shield types, careful coil layout is needed to prevent malfunctions due to magnetic interference.
Get in Touch
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