Unshielded smd power inductors LanTu Micro SCD4532-2R2MT designed for surface mounting in power supply circuits

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Product Description

Unshielded SMD Power Inductors - SCD4532 Series

Product Overview

The SCD4532 Series Unshielded SMD Power Inductors are designed for surface mounting applications, offering a low-cost, compact solution for high-rated current and low DC resistance requirements. These inductors are suitable for use in power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Series: SCD4532
Type: Unshielded SMD Power Inductors
Design: Silver plated type, Low cost design
Certifications: RoHS, Halogen Free, REACH Compliance
Mounting: Suitable for surface mounting equipment

Technical Specifications

Dimensions:

Part No	External Dimensions (LWH) (mm)	A (mm)	B (mm)	C (mm)	D (mm)	H (mm)	I (mm)	J (mm)
SCD4532	4.53.2	4.50.3	4.00.3	3.20.3	1.2	4.5	1.75	1.5

Electrical Characteristics:

Part No	Inductance L (H)	@0A Tole	Test Freq (KHz)	SRF Min (MHz)	DCR Typ ()	DCR Max ()	Saturation Current Isat Max (A)	Temperature Rise Current Irms Max (A)
SCD4532-1R0M	1.0	M	100	120	0.0487	-	3.85	2.56
SCD4532-1R4M	1.4	M	100	95	0.0562	-	3.40	2.52
SCD4532-1R8M	1.8	M	100	75	0.0637	-	2.90	1.95
SCD4532-2R2M	2.2	M	100	62	0.0712	-	2.80	1.75
SCD4532-2R7M	2.7	M	100	53	0.0787	-	2.75	1.58
SCD4532-3R3M	3.3	M	100	47	0.0862	-	2.48	1.44
SCD4532-3R9M	3.9	M	100	41	0.0937	-	2.30	1.33
SCD4532-4R7M	4.7	M	100	38	0.1087	-	2.00	1.15
SCD4532-5R6M	5.6	M	100	33	0.1257	-	1.95	0.99
SCD4532-6R8M	6.8	M	100	31	0.1312	-	1.60	0.95
SCD4532-8R2M	8.2	M	100	27	0.1462	-	1.50	0.84
SCD4532-100M	10	M	100	2.52	0.1820	-	1.45	1.04
SCD4532-120M	12	M	100	2.52	0.2100	-	1.20	0.97
SCD4532-150M	15	M	100	2.52	0.2350	-	1.12	0.85
SCD4532-180M	18	M	100	2.52	0.3380	-	1.00	0.74
SCD4532-220M	22	M	100	2.52	0.3780	-	0.96	0.68
SCD4532-270M	27	M	100	2.52	0.5220	-	0.84	0.62
SCD4532-330M	33	M	100	2.52	0.5400	-	0.75	0.56
SCD4532-390M	39	M	100	2.52	0.5870	-	0.70	0.52
SCD4532-470M	47	M	100	2.52	0.8440	-	0.68	0.44
SCD4532-560M	56	M	100	2.52	0.9370	-	0.60	0.42
SCD4532-680M	68	M	100	2.52	1.1170	-	0.50	0.37
SCD4532-820M	82	M	100	2.52	1.3450	-	0.46	0.29
SCD4532-101M	100	M	100	1	1.5200	-	0.45	0.26
SCD4532-121M	120	M	100	1	1.7500	-	0.44	0.24
SCD4532-151M	150	M	100	1	2.0000	-	0.42	0.22
SCD4532-181M	180	M	100	1	3.2000	-	0.38	0.19
SCD4532-221M	220	M	100	1	3.4000	-	0.36	0.18
SCD4532-331M	330	M	100	1	5.3000	-	0.28	0.15
SCD4532-391M	390	M	100	1	5.9000	-	0.24	0.13
SCD4532-471M	470	M	100	1	6.8000	-	0.21	0.12
SCD4532-561M	560	M	100	1	8.4000	-	0.20	0.10

Environmental Data:

Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

Inductance: HP4284A, HP4285A LCR meter or equivalent
Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification Example: SCD 4532 100 M T

: Type
: Inductance Tolerance (J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%)
: Inductance Value (e.g., 100 for 10 uH)
: External Dimensions (e.g., 4532 for 4.53.2 mm)
: Packing (B: Bulk Package, T: Tape & Reel)

Packaging:

Packing Quantity: Reel (PCS): 2000, Inside Box (PCS): 8000, Outside Carton (PCS): 32,000

Reminders for Using These Products:

Storage Period: within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
Avoid use or storage in gas corrosive environments (salt, acid, alkali, etc.).
Do not touch electrodes directly with bare hands.
Handle products carefully to prevent damage.
Do not bend terminals with excessive stress.
Do not rinse coils; contact the manufacturer if cleaning is necessary.
Do not expose products to magnets or magnetic fields.
Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
Soldering corrections after mounting should be within specified conditions to avoid overheating.
Allow sufficient margin for thermal design due to self-heating when power is ON.
For non-magnetic shield types, carefully lay out the coil on the circuit board to prevent malfunctions due to magnetic interference.