Product Overview
The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors are automatic assembly compatible power inductors designed for high-performance applications. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, and metallization on the ferrite core for excellent shock resistance and durability. These space-saving and power-efficient components are suitable for a wide range of applications including LED backlights, flat-screen TVs, set-top boxes, notebooks, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR8040 Series
- Construction: Magnetic Resin Shielded SMD
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit: Closed
- Electrode: Metallization on Ferrite Core
Technical Specifications
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
| SNR8040-1R0M | 1.0 | 20% | 0.008 | 0.010 | 9.85 | 6.30 |
| SNR8040-1R5M | 1.5 | 20% | 0.010 | 0.013 | 8.15 | 5.65 |
| SNR8040-2R2M | 2.2 | 20% | 0.012 | 0.015 | 7.10 | 5.15 |
| SNR8040-3R3M | 3.3 | 20% | 0.017 | 0.022 | 6.50 | 4.40 |
| SNR8040-3R6M | 3.6 | 20% | 0.017 | 0.022 | 6.50 | 4.35 |
| SNR8040-4R7M | 4.7 | 20% | 0.019 | 0.024 | 5.90 | 4.10 |
| SNR8040-5R6M | 5.6 | 20% | 0.021 | 0.027 | 4.55 | 3.85 |
| SNR8040-6R8M | 6.8 | 20% | 0.024 | 0.031 | 4.55 | 3.60 |
| SNR8040-8R2M | 8.2 | 20% | 0.026 | 0.033 | 4.20 | 3.45 |
| SNR8040-100M | 10 | 20% | 0.029 | 0.037 | 3.60 | 3.30 |
| SNR8040-150M | 15 | 20% | 0.047 | 0.061 | 2.95 | 2.80 |
| SNR8040-180M | 18 | 20% | 0.053 | 0.068 | 2.70 | 2.40 |
| SNR8040-220M | 22 | 20% | 0.069 | 0.089 | 2.40 | 2.10 |
| SNR8040-270M | 27 | 20% | 0.078 | 0.101 | 2.15 | 2.00 |
| SNR8040-330M | 33 | 20% | 0.097 | 0.126 | 2.05 | 1.80 |
| SNR8040-390M | 39 | 20% | 0.107 | 0.139 | 1.95 | 1.70 |
| SNR8040-470M | 47 | 20% | 0.136 | 0.176 | 1.75 | 1.55 |
| SNR8040-680M | 68 | 20% | 0.196 | 0.254 | 1.45 | 1.25 |
| SNR8040-820M | 82 | 20% | 0.225 | 0.292 | 1.30 | 1.15 |
| SNR8040-101M | 100 | 20% | 0.290 | 0.377 | 1.15 | 1.00 |
| SNR8040-121M | 120 | 20% | 0.334 | 0.434 | 1.12 | 0.95 |
| SNR8040-151M | 150 | 20% | 0.410 | 0.553 | 1.10 | 0.85 |
| SNR8040-221M | 220 | 20% | 0.599 | 0.778 | 0.85 | 0.80 |
| SNR8040-331M | 330 | 20% | 0.889 | 1.155 | 0.68 | 0.64 |
| SNR8040-471M | 470 | 20% | 1.260 | 1.625 | 0.60 | 0.50 |
| SNR8040-681M | 680 | 20% | 2.040 | 2.652 | 0.50 | 0.45 |
| SNR8040-102M | 1000 | 20% | 2.800 | 3.640 | 0.40 | 0.35 |
| Dimensions (mm) |
| Series | L | W | H |
| SNR8040 | 8.0 0.3 | 8.0 0.3 | 4.0 Max |
| Recommended Land Pattern (mm) |
| Part No. | A | B | C | D | E | F | G |
| SNR8040 | 8.00.3 | 8.00.3 | 4.0 Max | 4.00.3 | 6.30.3 | 2.2 Typ | 3.8 Typ |
| Environmental Data |
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Product Identification |
| Code | Description | Example |
| Type | SNR (Shielded SMD Power Inductors) |
| External Dimensions (LWH) (mm) | 8040 (8.08.04.0) |
| Inductance | 470 (47 H) |
| Inductance Tolerance | M (20%) |
| Packing | T (Tape & Reel) |
| Inductance Tolerance Options |
| Code | Tolerance | Code | Tolerance |
| J | 5% | M | 20% |
| K | 10% | P | 25% |
| L | 15% | N | 30% |
| Packaging Options |
| Code | Package Type |
| B | Bulk Package |
| T | Tape & Reel |
| Definitions |
| Saturation Current | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current | The lesser value of Isat or Irms. |
| Tape and Reel Specifications |
| Part No. | Tape Dimension (W, P, W1) (mm) | Reel Dimensions (A, B, C, D) (mm) | Quantity (Reel, Inside Box, Outside Carton) |
| SNR8040 | 16, 12, 7.5 | 16.4, 100, 13, 330 | 1000, 3000, 12,000 |
| Cover Tape Peel Off Condition |
| Cover tape peel force | 10 to 120g |
| Noodle strip peeling angle | 165 to 180 |
| Reliability Testing |
| Item | Requirements & Test Methods |
| Terminal Strength (SMT) | Pulling test based on sectional area of terminal (5N to 20N). Solder paste thickness: 0.12mm. Meet requirements without loose terminal. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Applied force based on terminal diameter (5N to 40N). Duration: 10sec. Meet requirements without loose terminal. |
| Resistance to Flexure | No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or appearance change. No short/open. Drop from 1m high in 1 angle, 3 ridges, 6 surfaces, twice each. |
| Solderability | No visible mechanical damage. Wetting >75% coverage. Terminals 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. |
| Vibration | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. Frequency 10-55 Hz, 2 hours each in 3 directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. 100 cycles (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. Temperature: 85~1252. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. Temperature: 602, Humidity: 90-95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects. L/L 10% (Mn-Zn: 30%). Q/Q 30%. DCR/DCR 10%. Performed twice according to reflow curve (peak 260+0/-5). |
| Resistance to solvent test | No case deformation, appearance change, or obliteration of marking. Dip in IPA for 50.5min, dry 5min, brush 10 times. |
| Overload test | No smoke, smell, fire during test. Characteristics normal after test. Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min. |
| Recommended Reflow Soldering Curve |
| Refer to the provided graph for recommended reflow conditions. Adjust and confirm according to user's environment and equipment. |
Usage Reminders
- Storage: Within 12 months under conditions: temperature 5~40C, humidity 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the company if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Allow sufficient thermal design margin as devices generate heat when powered on.
- Non-Magnetic Shielded Type: Careful layout is required for non-magnetic shielded types to prevent malfunctions due to magnetic interference.
