Shielded SMD Power Inductors LanTu Micro SDRH105R-220MT Suitable for VTRs LCD Televisions and Notebook PCs
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Product Description
Product Overview
The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in compact applications. Featuring a closed magnetic circuit design to minimize leakage, high saturation current, and low DCR, these inductors are ideal for power supplies in VTRs, LCD televisions, notebook PCs, and DC/DC converters. Their highly accurate dimensions ensure suitability for automatic mounting, and they are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SDRH105R Series
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN
- Magnetic Circuit Design: Closed magnetic circuit
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Freq. | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SDRH105R-3R3N | 3.3 | 30% | 100KHz | 0.013 | 9.50 | 6.50 | 10.310.55.0 |
| SDRH105R-4R7N | 4.7 | 30% | 100KHz | 0.016 | 9.20 | 6.30 | 10.310.55.0 |
| SDRH105R-6R8N | 6.8 | 30% | 100KHz | 0.020 | 7.00 | 6.00 | 10.310.55.0 |
| SDRH105R-8R2N | 8.2 | 30% | 100KHz | 0.023 | 5.50 | 5.00 | 10.310.55.0 |
| SDRH105R-100N | 10 | 30% | 100KHz | 0.250 | 5.10 | 4.40 | 10.310.55.0 |
| SDRH105R-120N | 12 | 30% | 100KHz | 0.032 | 4.90 | 4.00 | 10.310.55.0 |
| SDRH105R-150N | 15 | 30% | 100KHz | 0.040 | 4.20 | 3.60 | 10.310.55.0 |
| SDRH105R-180M | 18 | 20% | 100KHz | 0.046 | 3.70 | 3.40 | 10.310.55.0 |
| SDRH105R-220M | 22 | 20% | 100KHz | 0.058 | 3.30 | 3.20 | 10.310.55.0 |
| SDRH105R-270M | 27 | 20% | 100KHz | 0.650 | 3.20 | 3.00 | 10.310.55.0 |
| SDRH105R-330M | 33 | 20% | 100KHz | 0.810 | 2.70 | 2.60 | 10.310.55.0 |
| SDRH105R-390M | 39 | 20% | 100KHz | 0.103 | 2.48 | 2.50 | 10.310.55.0 |
| SDRH105R-470M | 47 | 20% | 100KHz | 0.122 | 2.35 | 2.30 | 10.310.55.0 |
| SDRH105R-560M | 56 | 20% | 100KHz | 0.144 | 2.30 | 2.10 | 10.310.55.0 |
| SDRH105R-680M | 68 | 20% | 100KHz | 0.193 | 2.00 | 1.90 | 10.310.55.0 |
| SDRH105R-820M | 82 | 20% | 100KHz | 0.219 | 1.80 | 1.60 | 10.310.55.0 |
| SDRH105R-101M | 100 | 20% | 100KHz | 0.247 | 1.50 | 1.35 | 10.310.55.0 |
| SDRH105R-121M | 120 | 20% | 100KHz | 0.298 | 1.40 | 1.18 | 10.310.55.0 |
| SDRH105R-151M | 150 | 20% | 100KHz | 0.355 | 1.30 | 1.10 | 10.310.55.0 |
| SDRH105R-181M | 180 | 20% | 100KHz | 0.393 | 1.20 | 1.00 | 10.310.55.0 |
| SDRH105R-221M | 220 | 20% | 100KHz | 0.483 | 1.08 | 0.94 | 10.310.55.0 |
| SDRH105R-271M | 270 | 20% | 100KHz | 0.632 | 0.88 | 0.80 | 10.310.55.0 |
| SDRH105R-331M | 330 | 20% | 100KHz | 0.780 | 0.85 | 0.73 | 10.310.55.0 |
| SDRH105R-391M | 390 | 20% | 100KHz | 0.957 | 0.78 | 0.70 | 10.310.55.0 |
| SDRH105R-471M | 470 | 20% | 100KHz | 1.220 | 0.71 | 0.54 | 10.310.55.0 |
| SDRH105R-561M | 560 | 20% | 100KHz | 1.352 | 0.65 | 0.52 | 10.310.55.0 |
| SDRH105R-681M | 680 | 20% | 100KHz | 1.519 | 0.59 | 0.51 | 10.310.55.0 |
| SDRH105R-821M | 820 | 20% | 100KHz | 1.694 | 0.51 | 0.48 | 10.310.55.0 |
| SDRH105R-102M | 1000 | 20% | 100KHz | 1.946 | 0.49 | 0.42 | 10.310.55.0 |
| Operating Temperature | Test Equipment (Inductance) | Test Equipment (DCR) | Test Equipment (Current) |
|---|---|---|---|
| -40 to +125 (Including coils self-temperature rise) | HP4284A, HP4285A or equivalent LCR meter | Chroma 16502 or equivalent | HP4284+42841A |
| Product Identification Structure | Description |
|---|---|
| SDRH | Type |
| 105R | External Dimensions (LWH) (mm) |
| Inductance Value (e.g., 100 for 10 H) | Inductance |
| Tolerance (J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%) | Inductance Tolerance |
| Packing (T: Tape & Reel, B: Bulk Package) | Packing |
Recommended Land Pattern
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J | |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 10.3 | 10.5 | 5.0 | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
Tape and Reel Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 800 | 1600 | 6400 |
Reliability Testing Summary
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet requirements without loose terminal | Pulling test, Solder paste thickness, Applied force based on terminal diameter/area, Speed: 1.0mm/s, Keep time: 101s |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance, No short and no open | Drop from 1m high, 1 angle, 3 ridges and 6 surfaces, twice in each direction |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin and 75% ethanol |
| Vibration | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Total amplitude of 1.5mm, frequency 10 to 55 Hz and return, 2 hours in each 3 mutually perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | 100 cycles of temperature transitions (-55~40 to 85~125), Transforming interval: Max. 20 sec |
| Low temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 85~1252, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance, L/L10% (Mn-Zn: L/L30%), Q/Q30% (SMD series only), DCR/DCR10% | Peak temperature: 260+0/-5, Reflow twice |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times |
| Overload test | No smoke, no peculiar smell, no fire during test, characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | No breakdown during test, characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min (For parts with two coils) |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Beyond this period, terminal solderability may deteriorate.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals using bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: When designing the PCB layout for non-magnetic shield types, carefully configure the coil placement to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
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Contact Person
Sellina