Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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power inductor LanTu Micro SNR8040-2R2MT with magnetic resin shielded ferrite core and low noise operation

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Product Description

Product Overview

The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors designed for efficient power management. These inductors feature a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels. They offer large current handling capability with low DC resistance, a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, and metallization on the ferrite core for excellent shock resistance. Their compact design saves PCB space and reduces power consumption. Applications include LED backlighting, flat-screen TVs, set-top boxes, notebooks, desktops, servers, graphics cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR8040
  • Construction: Automatic assembly, Magnetic Resin Shielded
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Core Material: Ferrite Core

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency Test Voltage DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH mm)
SNR8040-1R0M 1.0 20% 100KHz 1.0V 0.010 9.85 6.30 8.08.04.0
SNR8040-1R5M 1.5 20% 100KHz 1.0V 0.013 8.15 5.65 8.08.04.0
SNR8040-2R2M 2.2 20% 100KHz 1.0V 0.015 7.10 5.15 8.08.04.0
SNR8040-3R3M 3.3 20% 100KHz 1.0V 0.022 6.50 4.40 8.08.04.0
SNR8040-3R6M 3.6 20% 100KHz 1.0V 0.022 6.50 4.35 8.08.04.0
SNR8040-4R7M 4.7 20% 100KHz 1.0V 0.024 5.90 4.10 8.08.04.0
SNR8040-5R6M 5.6 20% 100KHz 1.0V 0.027 4.55 3.85 8.08.04.0
SNR8040-6R8M 6.8 20% 100KHz 1.0V 0.031 4.55 3.60 8.08.04.0
SNR8040-8R2M 8.2 20% 100KHz 1.0V 0.033 4.20 3.45 8.08.04.0
SNR8040-100M 10 20% 100KHz 1.0V 0.037 3.60 3.30 8.08.04.0
SNR8040-150M 15 20% 100KHz 1.0V 0.061 2.95 2.80 8.08.04.0
SNR8040-180M 18 20% 100KHz 1.0V 0.068 2.70 2.40 8.08.04.0
SNR8040-220M 22 20% 100KHz 1.0V 0.089 2.40 2.10 8.08.04.0
SNR8040-270M 27 20% 100KHz 1.0V 0.101 2.15 2.00 8.08.04.0
SNR8040-330M 33 20% 100KHz 1.0V 0.126 2.05 1.80 8.08.04.0
SNR8040-390M 39 20% 100KHz 1.0V 0.139 1.95 1.70 8.08.04.0
SNR8040-470M 47 20% 100KHz 1.0V 0.176 1.75 1.55 8.08.04.0
SNR8040-680M 68 20% 100KHz 1.0V 0.254 1.45 1.25 8.08.04.0
SNR8040-820M 82 20% 100KHz 1.0V 0.292 1.30 1.15 8.08.04.0
SNR8040-101M 100 20% 100KHz 1.0V 0.377 1.15 1.00 8.08.04.0
SNR8040-121M 120 20% 100KHz 1.0V 0.434 1.12 0.95 8.08.04.0
SNR8040-151M 150 20% 100KHz 1.0V 0.553 1.10 0.85 8.08.04.0
SNR8040-221M 220 20% 100KHz 1.0V 0.778 0.85 0.80 8.08.04.0
SNR8040-331M 330 20% 100KHz 1.0V 1.155 0.68 0.64 8.08.04.0
SNR8040-471M 470 20% 100KHz 1.0V 1.625 0.60 0.50 8.08.04.0
SNR8040-681M 680 20% 100KHz 1.0V 2.652 0.50 0.45 8.08.04.0
SNR8040-102M 1000 20% 100KHz 1.0V 3.640 0.40 0.35 8.08.04.0
Environmental Data Value
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Product Identification Description
SNR 8040 Type: Shielded SMD Power Inductors, External Dimensions: 8.08.04.0 mm
470 M Inductance: 47 H, Tolerance: M (20%)
T Packing: Tape & Reel
Packaging Quantity
Reel 1000 PCS
Inside Box 3000 PCS
Outside Carton 12,000 PCS
Reliability Testing Item Requirements Test Method
Terminal Strength Varies by terminal cross-sectional area (e.g., 5N for 8mm, 10N for 8mm20mm) Pulling test, Solder paste thickness: 0.12mm, Keep time: 101s, Speed: 1.0mm/s
Resistance to Flexure No visible mechanical damage. Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration Inductance change: Within 10%. Q factor change: Within 20%. Frequency 10-55 Hz (1 min cycle), 2 hours in 3 directions.
Thermal Shock Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles (-55~40 to 85~125). Transforming interval: Max. 20 sec.
Low temperature Storage Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402, Duration: 962 hours.
High temperature Storage Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 85~1252, Duration: 962 hours.
Damp Heat (Steady States) Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours.
Heat endurance of Reflow soldering L/L10%, Q/Q30%, DCR/DCR10% Peak temperature: 260+0/-5 (twice).
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test No smoke, no peculiar smell, no fire. Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test No breakdown. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended reflow soldering curve

The recommended reflow conditions are set according to soldering equipment. Adjust and confirm according to user's environment/equipment.

Reminders for Using These Products

  • Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
  • Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals excessively to avoid wire fracture.
  • Do not rinse coils; contact the company if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; the temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
  • Ensure sufficient thermal design margin as devices self-heat when powered on.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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