Product Overview
The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors designed for efficient power management. These inductors feature a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels. They offer large current handling capability with low DC resistance, a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, and metallization on the ferrite core for excellent shock resistance. Their compact design saves PCB space and reduces power consumption. Applications include LED backlighting, flat-screen TVs, set-top boxes, notebooks, desktops, servers, graphics cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR8040
- Construction: Automatic assembly, Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency | Test Voltage | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
| SNR8040-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.010 | 9.85 | 6.30 | 8.08.04.0 |
| SNR8040-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.013 | 8.15 | 5.65 | 8.08.04.0 |
| SNR8040-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.015 | 7.10 | 5.15 | 8.08.04.0 |
| SNR8040-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.022 | 6.50 | 4.40 | 8.08.04.0 |
| SNR8040-3R6M | 3.6 | 20% | 100KHz | 1.0V | 0.022 | 6.50 | 4.35 | 8.08.04.0 |
| SNR8040-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.024 | 5.90 | 4.10 | 8.08.04.0 |
| SNR8040-5R6M | 5.6 | 20% | 100KHz | 1.0V | 0.027 | 4.55 | 3.85 | 8.08.04.0 |
| SNR8040-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.031 | 4.55 | 3.60 | 8.08.04.0 |
| SNR8040-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.033 | 4.20 | 3.45 | 8.08.04.0 |
| SNR8040-100M | 10 | 20% | 100KHz | 1.0V | 0.037 | 3.60 | 3.30 | 8.08.04.0 |
| SNR8040-150M | 15 | 20% | 100KHz | 1.0V | 0.061 | 2.95 | 2.80 | 8.08.04.0 |
| SNR8040-180M | 18 | 20% | 100KHz | 1.0V | 0.068 | 2.70 | 2.40 | 8.08.04.0 |
| SNR8040-220M | 22 | 20% | 100KHz | 1.0V | 0.089 | 2.40 | 2.10 | 8.08.04.0 |
| SNR8040-270M | 27 | 20% | 100KHz | 1.0V | 0.101 | 2.15 | 2.00 | 8.08.04.0 |
| SNR8040-330M | 33 | 20% | 100KHz | 1.0V | 0.126 | 2.05 | 1.80 | 8.08.04.0 |
| SNR8040-390M | 39 | 20% | 100KHz | 1.0V | 0.139 | 1.95 | 1.70 | 8.08.04.0 |
| SNR8040-470M | 47 | 20% | 100KHz | 1.0V | 0.176 | 1.75 | 1.55 | 8.08.04.0 |
| SNR8040-680M | 68 | 20% | 100KHz | 1.0V | 0.254 | 1.45 | 1.25 | 8.08.04.0 |
| SNR8040-820M | 82 | 20% | 100KHz | 1.0V | 0.292 | 1.30 | 1.15 | 8.08.04.0 |
| SNR8040-101M | 100 | 20% | 100KHz | 1.0V | 0.377 | 1.15 | 1.00 | 8.08.04.0 |
| SNR8040-121M | 120 | 20% | 100KHz | 1.0V | 0.434 | 1.12 | 0.95 | 8.08.04.0 |
| SNR8040-151M | 150 | 20% | 100KHz | 1.0V | 0.553 | 1.10 | 0.85 | 8.08.04.0 |
| SNR8040-221M | 220 | 20% | 100KHz | 1.0V | 0.778 | 0.85 | 0.80 | 8.08.04.0 |
| SNR8040-331M | 330 | 20% | 100KHz | 1.0V | 1.155 | 0.68 | 0.64 | 8.08.04.0 |
| SNR8040-471M | 470 | 20% | 100KHz | 1.0V | 1.625 | 0.60 | 0.50 | 8.08.04.0 |
| SNR8040-681M | 680 | 20% | 100KHz | 1.0V | 2.652 | 0.50 | 0.45 | 8.08.04.0 |
| SNR8040-102M | 1000 | 20% | 100KHz | 1.0V | 3.640 | 0.40 | 0.35 | 8.08.04.0 |
| Environmental Data | Value |
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Product Identification | Description |
| SNR 8040 | Type: Shielded SMD Power Inductors, External Dimensions: 8.08.04.0 mm |
| 470 M | Inductance: 47 H, Tolerance: M (20%) |
| T | Packing: Tape & Reel |
| Packaging | Quantity |
| Reel | 1000 PCS |
| Inside Box | 3000 PCS |
| Outside Carton | 12,000 PCS |
| Reliability Testing Item | Requirements | Test Method |
| Terminal Strength | Varies by terminal cross-sectional area (e.g., 5N for 8mm, 10N for 8mm20mm) | Pulling test, Solder paste thickness: 0.12mm, Keep time: 101s, Speed: 1.0mm/s |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | Frequency 10-55 Hz (1 min cycle), 2 hours in 3 directions. |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252, Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L10%, Q/Q30%, DCR/DCR10% | Peak temperature: 260+0/-5 (twice). |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | No smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended reflow soldering curve
The recommended reflow conditions are set according to soldering equipment. Adjust and confirm according to user's environment/equipment.
Reminders for Using These Products
- Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the company if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; the temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Ensure sufficient thermal design margin as devices self-heat when powered on.