Magnetic Resin Shielded SMD Power Inductors LanTu Micro SNR8040-220MT for Power Management Applications

Product Overview

The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly compatible power inductors designed for efficient power management. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capacity with low DC resistance (DCR), a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, and a metallization on ferrite core for excellent shock resistance and durability. These space-saving and power-efficient components are ideal for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SNR8040
• Construction: Magnetic Resin Shielded SMD
• Certifications: RoHS, Halogen Free, REACH Compliance
• Core Material: Ferrite Core (implied by metallization on ferrite core)
• Circuit Design: Closed Magnetic Circuit

Technical Specifications

Note on Saturation Current: DC current at which inductance drops 30% from its value without current.
Note on Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Note on Rated DC Current: The lesser value of Isat or Irms.
Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Usage Precautions

• Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
• Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to grease, which can reduce solderability. Handle products carefully to prevent damage from dropping or improper removal.
• Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
• Cleaning: Do not clean the products. Contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not place products near magnets or magnetic objects.
• Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering Correction: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Self-Heating: Devices self-heat when powered on; ensure sufficient thermal design margin.
• Non-Shielded Types: For non-magnetic shielded types, careful coil layout is required on the PCB design to prevent malfunctions due to magnetic interference.