Magnetic Resin Shielded SMD Inductors LanTu Micro SNR4030-2R2MT with Low DCR and Enhanced EMI Resistance
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Product Description
Product Overview
The SNR4030 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors featuring magnetic resin shielding. This design significantly reduces buzz noise to ultra-low levels, offers large current handling with low DCR, and provides excellent shock resistance and durability due to metallization on the ferrite core. The closed magnetic circuit design minimizes leakage flux and enhances EMI resistance, while the compact size saves PCB real estate and power. These inductors are widely used in LED backlights, flat-screen TVs, notebooks, servers, graphic cards, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4030
- Type: Magnetic Resin Shielded SMD Power Inductors
- Construction: Automatic assembly, Magnetic-resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications:
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
| Component | Description |
|---|---|
| SNR 4030 | Type (Shielded SMD Power Inductors) |
| 100 | Inductance Value (e.g., 10 uH) |
| M | Tolerance (e.g., 20%) |
| T | Packing (Tape & Reel) |
External Dimensions (LWH): 4.0 4.0 3.0 mm
Recommended Land Pattern:
| Item | A | B | C | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| Dimensions (mm) | 4.0 0.3 | 4.0 0.3 | 3.0 Max | 2.1 0.2 | 3.3 0.2 | 1.1 | 1.9 | 3.7 |
Electrical Characteristics (SNR4030 Series at 25):
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 0.014 | 0.018 | 5.26 | 4.15 |
| SNR4030-1R2M | 1.2 | 20% | 0.015 | 0.020 | 5.26 | 3.82 |
| SNR4030-1R5M | 1.5 | 20% | 0.020 | 0.026 | 4.84 | 3.34 |
| SNR4030-1R8M | 1.8 | 20% | 0.025 | 0.033 | 4.84 | 3.20 |
| SNR4030-2R2M | 2.2 | 20% | 0.030 | 0.039 | 4.40 | 2.95 |
| SNR4030-3R3M | 3.3 | 20% | 0.040 | 0.050 | 3.30 | 2.40 |
| SNR4030-4R7M | 4.7 | 20% | 0.060 | 0.076 | 2.90 | 2.00 |
| SNR4030-5R6M | 5.6 | 20% | 0.073 | 0.091 | 2.75 | 1.90 |
| SNR4030-6R8M | 6.8 | 20% | 0.090 | 0.115 | 2.60 | 1.60 |
| SNR4030-8R2M | 8.2 | 20% | 0.095 | 0.122 | 2.10 | 1.60 |
| SNR4030-100M | 10 | 20% | 0.100 | 0.130 | 1.95 | 1.50 |
| SNR4030-120M | 12 | 20% | 0.135 | 0.172 | 1.70 | 1.30 |
| SNR4030-150M | 15 | 20% | 0.190 | 0.230 | 1.65 | 1.11 |
| SNR4030-220M | 22 | 20% | 0.225 | 0.290 | 1.30 | 1.00 |
| SNR4030-330M | 33 | 20% | 0.330 | 0.420 | 1.10 | 0.84 |
| SNR4030-470M | 47 | 20% | 0.445 | 0.570 | 0.95 | 0.72 |
| SNR4030-680M | 68 | 20% | 0.868 | 1.100 | 0.72 | 0.52 |
| SNR4030-820M | 82 | 20% | 1.060 | 1.280 | 0.66 | 0.47 |
| SNR4030-101M | 100 | 20% | 1.150 | 1.480 | 0.60 | 0.45 |
| SNR4030-121M | 120 | 20% | 1.350 | 1.700 | 0.55 | 0.42 |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing: B (Bulk Package), T (Tape & Reel)
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging Details (Tape & Reel):
| Part No. | Tape Width (W) (mm) | Pitch (P) (mm) | Tape Width (W1) (mm) | Reel Diameter (A) (mm) | Reel Hub (B) (mm) | Reel Inner Width (C) (mm) | Reel Dimensions (D) (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area; Solder paste thickness: 0.12mm; Speed: 1.0mm/s; Keep time: 101s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually and maintained for 10 seconds, dependent on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance; No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Frequency 10-55 Hz and return, 1 minute cycle, 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40); Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10% | Peak temperature: 260+0/-5; Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire; Characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown; Characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve:
Users should adjust and confirm reflow conditions based on their specific environment and equipment.
Reminders for Using These Products:
- Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip temperature should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause short circuits, performance degradation, or reduced lifespan.
- Ensure sufficient thermal design margin for self-heating when power is ON.
- For non-magnetic shielded types, careful layout is needed to avoid malfunctions due to magnetic interference.
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Contact Person
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