High Reliability Molding SMD Power Inductors LanTu Micro SMS0518-100M for High Density Installations
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Product Description
Molding SMD Power Inductors - SMS0518 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0518 Series offers ultra-high current SMD power inductors designed for high-density installations. These thin-profile inductors feature low DC resistance, exceptional anti-electromagnetic interference due to magnetic shielding, and high reliability with an integral construction for superior vibration resistance. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, leading to high efficiency. Suitable for applications up to 3MHz, these inductors are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0518
- Certifications: RoHS, Halogen Free, REACH Compliance
- Construction: Integral construction, Magnetic shielding
Technical Specifications
General Specifications
| Item | Specification |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Maximum Voltage | 30VDC |
| Frequency Range | Up to 3MHz |
Electrical Characteristics (SMS0518 Series, Electrical specifications at 25)
| Part No. | Inductance (H) | Tol. | DCR (m) Max | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
|---|---|---|---|---|---|
| SMS0518-R33M | 0.33 | 20% | 7.0 | 17.0 | 12.0 |
| SMS0518-R47M | 0.47 | 20% | 9.0 | 15.5 | 10.5 |
| SMS0518-R56M | 0.56 | 20% | 10.0 | 15.0 | 9.5 |
| SMS0518-R68M | 0.68 | 20% | 12.0 | 12.0 | 9.0 |
| SMS0518-1R0M | 1.00 | 20% | 17.0 | 9.0 | 8.0 |
| SMS0518-1R5M | 1.50 | 20% | 26.0 | 9.0 | 7.5 |
| SMS0518-2R2M | 2.20 | 20% | 35.0 | 6.5 | 5.0 |
| SMS0518-3R3M | 3.30 | 20% | 58.0 | 5.0 | 4.5 |
| SMS0518-4R7M | 4.70 | 20% | 85.0 | 4.0 | 3.5 |
| SMS0518-6R8M | 6.80 | 20% | 120.0 | 3.4 | 2.8 |
| SMS0518-100M | 10.00 | 20% | 155.0 | 3.0 | 2.5 |
| SMS0518-150M | 15.00 | 20% | 260.0 | 2.2 | 1.8 |
Dimensions (mm)
| Part No. | A (L) | B (W) | C (H) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0518 | 5.500.30 | 5.200.20 | 1.80Max | 2.30 | 1.20 | 3.00 | 7.00 | 2.50 |
Product Identification
SMS 0518 4R7 M T
- : Type (SMS - Molding SMD Power Inductor)
- : Outer Dimensions (0518 - 5.5x5.2x1.8 mm)
- : Inductance (e.g., 4R7 = 4.7 H)
- : Inductance Tolerance (M: 20%)
- : Packing (T: Tape & Reel)
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0518 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually for 101s at 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Applied force varies with terminal diameter (5N to 40N) for 10sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10 to 55 Hz, 1.5mm amplitude, 2 hours in each of 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature cycling between -55~40 and 85~125. Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Twice reflow soldering. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjust and confirm according to user's environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months. Conditions: 5~40C, 35-66% RH. Solderability may deteriorate after storage period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils; contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is ON.
- Non-Magnetic Shield Type: Careful layout is required on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina