SMD Power Inductor LanTu Micro SNR4030-6R8MT with Closed Magnetic Circuit Design and EMI Resistance
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Product Description
Product Overview
The SNR4030 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly compatible power inductors designed for high performance and reliability. Featuring magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capability with low DCR, and metallization on the ferrite core ensures excellent shock resistance and durability. The closed magnetic circuit design minimizes flux leakage and enhances EMI resistance, while their compact size saves PCB real estate and reduces power consumption. These inductors are widely used in LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive products, and DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SNR4030
- Construction: Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN, China
Technical Specifications
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Current (Isat & Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification:
Model Structure: SNR 4030 [Inductance] [Tolerance] [Packing Type]
- Type: SNR (Shielded SMD Power Inductors)
- Series: 4030 (4.0 x 4.0 x 3.0 mm)
- Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing Codes: B (Bulk Package), T (Tape & Reel)
Shape and Dimensions:
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (Typ mm) | G (Typ mm) | H (Typ mm) |
|---|---|---|---|---|---|---|---|---|
| SNR4030 | 4.00.3 | 4.00.3 | 3.0 Max | 2.10.2 | 3.30.2 | 1.1 | 1.9 | 3.7 |
Electrical Characteristics:
| Part No | Inductance (H) Tol | Test Frequency (KHz) / Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 20% | 100KHz / 1.0V | 0.014 | 0.018 | 5.26 | 4.15 |
| SNR4030-1R2M | 1.2 20% | 100KHz / 1.0V | 0.015 | 0.020 | 5.26 | 3.82 |
| SNR4030-1R5M | 1.5 20% | 100KHz / 1.0V | 0.020 | 0.026 | 4.84 | 3.34 |
| SNR4030-1R8M | 1.8 20% | 100KHz / 1.0V | 0.025 | 0.033 | 4.84 | 3.20 |
| SNR4030-2R2M | 2.2 20% | 100KHz / 1.0V | 0.030 | 0.039 | 4.40 | 2.95 |
| SNR4030-3R3M | 3.3 20% | 100KHz / 1.0V | 0.040 | 0.050 | 3.30 | 2.40 |
| SNR4030-4R7M | 4.7 20% | 100KHz / 1.0V | 0.060 | 0.076 | 2.90 | 2.00 |
| SNR4030-5R6M | 5.6 20% | 100KHz / 1.0V | 0.073 | 0.091 | 2.75 | 1.90 |
| SNR4030-6R8M | 6.8 20% | 100KHz / 1.0V | 0.090 | 0.115 | 2.60 | 1.60 |
| SNR4030-8R2M | 8.2 20% | 100KHz / 1.0V | 0.095 | 0.122 | 2.10 | 1.60 |
| SNR4030-100M | 10 20% | 100KHz / 1.0V | 0.100 | 0.130 | 1.95 | 1.50 |
| SNR4030-120M | 12 20% | 100KHz / 1.0V | 0.135 | 0.172 | 1.70 | 1.30 |
| SNR4030-150M | 15 20% | 100KHz / 1.0V | 0.190 | 0.230 | 1.65 | 1.11 |
| SNR4030-220M | 22 20% | 100KHz / 1.0V | 0.225 | 0.290 | 1.30 | 1.00 |
| SNR4030-330M | 33 20% | 100KHz / 1.0V | 0.330 | 0.420 | 1.10 | 0.84 |
| SNR4030-470M | 47 20% | 100KHz / 1.0V | 0.445 | 0.570 | 0.95 | 0.72 |
| SNR4030-680M | 68 20% | 100KHz / 1.0V | 0.868 | 1.100 | 0.72 | 0.52 |
| SNR4030-820M | 82 20% | 100KHz / 1.0V | 1.060 | 1.280 | 0.66 | 0.47 |
| SNR4030-101M | 100 20% | 100KHz / 1.0V | 1.150 | 1.480 | 0.60 | 0.45 |
| SNR4030-121M | 120 20% | 100KHz / 1.0V | 1.350 | 1.700 | 0.55 | 0.42 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser of Isat or Irms.
Packaging:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal. Solder with lead-free solder. Force applied gradually and maintained for 101s at 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (0.35mm to >1.25mm). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig. Apply force in specified direction. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig. Subject to simple harmonic motion (10 to 55 Hz, 1.5mm amplitude) for 2 hours in 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature change between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products:
- Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate after storage period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating when designing for thermal management.
- Non-Magnetic Shield Type: Careful layout is needed to avoid malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina