Molding SMD Power Inductors - SMS0630 Series

Product Overview: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. presents the SMS0630 Series, ultra-high current SMD power inductors designed for demanding applications. These thin-profile inductors feature low DC resistance and ultra-high current capabilities, making them ideal for high-density installations. With magnetic shielding for strong anti-electromagnetic interference, high reliability due to an integral construction for excellent vibration resistance, and ultra-low buzz noise from a composite structure, these inductors offer high efficiency and reduced losses. They are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.

Applications:

• PDA, notebook, desktop, server applications
• High current POL converters
• Battery powered devices
• DC/DC converters in distributed power systems

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SMS0630
• Type: Molding SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Environmental Data

• Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Electrical Characteristics (at 25)

Shape and Dimensions (mm)

Product Identification

Format: SMS 0630 R68 M T

• Type: SMS (Molding SMD Power Inductor)
• Inductance: e.g., R68 = 0.68 uH
• Outer Dimensions (LWH) (mm): 0630 = 7.16.63.0
• Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: T = Tape & Reel, B = Bulk Package

Test Equipment

• Inductance (L): WK3260B LCR meter or equivalent
• Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Definitions

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.

Packaging

Tape and Reel Specifications:

Cover tape peel off condition:

• a) Cover tape peel force shall be 10 to 120g
• b) Noodle strip peeling angle 165 to 180

Packing quantity: REEL13 PE Bag. Inside Box, Outside Carton. Insufficient full cartons will be filled with inner boxes or cushioning material.

Reliability Testing

Terminal Strength (SMT):

• Pulling test: Defined by sectional area of terminal (A).
• Solder paste thickness: 0.12mm.
• Requirements met without any loose terminal.
• Keep time: 101s, Speed: 1.0mm/s.

Terminal Strength (DIP):

• Applied force and duration based on terminal diameter (d).
• Requirements met without any loose terminal.
• Pull Force: Applied gradually and maintained for 10 seconds.

Resistance to Flexure:

• No visible mechanical damage.
• Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.

Dropping Test:

• No case deformation or change in appearance.
• No short and no open.
• Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.

Solderability:

• No visible mechanical damage.
• Wetting shall exceed 75% coverage.
• Terminals must have 95% minimum solder coverage.
• Solder temperature: 2402, Duration: 3 sec.

Vibration:

• No visible mechanical damage.
• Inductance change: Within 10%.
• Q factor change: Within 20%.
• Subjected to simple harmonic motion (10-55 Hz) for 2 hours in each of 3 mutually perpendicular directions.

Thermal Shock:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• 100 cycles of temperature changes between 85~125 and -55~40. Transforming interval: Max. 20 sec.

Low temperature Storage:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Temperature: -55~-402. Duration: 962 hours.

High temperature Storage:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Temperature: 125~852. Duration: 962 hours.

Damp Heat (Steady States):

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours.

Heat endurance of Reflow soldering:

• No significant defects in appearance.
• L/L10% (Mn-Zn: L/L30%).
• Q/Q30% (SMD series only).
• DCR/DCR10%.
• Tested twice according to reflow curve with peak temperature 260+0/-5.

Resistance to solvent test:

• No case deformation or change in appearance or obliteration of marking.
• Dipped in IPA solvent for 50.5Min, dried for 5Min, then brushed 10 times.

Overload test:

• During the test no smoke, no peculiar smell, no fire.
• Characteristics are normal after test.
• Apply twice the rated current for 5 minutes.

Voltage resistance test:

• During the test no breakdown.
• Characteristics are normal after test.
• DC1000V, Current: 1mA, Time: 1Min.

Recommended reflow soldering curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment and equipment.

Reminders for Using These Products

• Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less). Soldering of terminal electrodes may deteriorate if the storage period elapses.
• Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
• Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetism: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating can cause short circuits, performance deterioration, or lifespan reduction.
• Thermal Design: Allow sufficient margin for self-heating (temperature increase) when power is ON.
• Non-Magnetic Shield Type: Carefully lay out the coil on the circuit board design to prevent malfunctions due to magnetic interference.