Shielded SMD Power Inductors LanTu Micro SDRS1275-330NT with Wide Inductance Range and Package Sizes
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Product Description
Product Overview
The SDRS1275 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DC resistance. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high-accuracy dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for thin-screen TVs, LCDs, AV equipment, gaming devices, and DC/DC converters, these inductors operate efficiently within a wide temperature range.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRS1275
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SDRS1275-1R2N | 1.2 | 30% | 1KHz | 0.006 | 13.00 | 8.20 |
| SDRS1275-2R7N | 2.7 | 30% | 1KHz | 0.009 | 10.00 | 7.00 |
| SDRS1275-3R9N | 3.9 | 30% | 1KHz | 0.010 | 9.00 | 6.70 |
| SDRS1275-5R6N | 5.6 | 30% | 1KHz | 0.011 | 7.80 | 6.30 |
| SDRS1275-6R8N | 6.8 | 30% | 1KHz | 0.013 | 7.20 | 5.90 |
| SDRS1275-100N | 10 | 30% | 1KHz | 0.015 | 5.50 | 5.40 |
| SDRS1275-150N | 15 | 30% | 1KHz | 0.018 | 4.70 | 5.00 |
| SDRS1275-220N | 22 | 30% | 1KHz | 0.026 | 4.00 | 4.00 |
| SDRS1275-330N | 33 | 30% | 1KHz | 0.039 | 3.20 | 3.40 |
| SDRS1275-470N | 47 | 30% | 1KHz | 0.052 | 2.70 | 3.00 |
| SDRS1275-680N | 68 | 30% | 1KHz | 0.077 | 2.00 | 2.40 |
| SDRS1275-101N | 100 | 30% | 1KHz | 0.125 | 1.90 | 1.90 |
| SDRS1275-151N | 150 | 30% | 1KHz | 0.175 | 1.50 | 1.60 |
| SDRS1275-221M | 220 | 20% | 1KHz | 0.258 | 1.30 | 1.30 |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Dimensions (mm):
| Part No. | A (L) | B (W) | C (H) | D | E | H | I | J |
|---|---|---|---|---|---|---|---|---|
| SDRS1275 | 12.50.3 | 12.50.3 | 7.50.35 | 8.6 | 3.2 | 3.2 | 2.5 | 8.6 |
Product Identification Example: SDRS 1275 100 N T
- Type: SDRS (Shielded SMD Power Inductors)
- External Dimensions (LWH) (mm): 1275 (12.512.57.5)
- Inductance: 100 (10 H)
- Inductance Tolerance: N (30%) (Other options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%)
- Packing: T (Tape & Reel) (Other option: B - Bulk Package)
Packaging:
- Tape and Reel Specifications: W=24mm, P=16mm, W1=11.5mm
- Reel Dimensions: A=24.4mm, B=60mm, C=13mm, D=330mm
- Packing Quantity: Reel (PCS): 500, Inside Box (PCS): 1000, Outside Carton (PCS): 4000
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Refer to GB/T 2423.60-2008 | Pulling test based on terminal cross-sectional area; Solder paste thickness: 0.12mm; Meet requirements without loose terminal. |
| Terminal Strength (DIP) | Refer to GB/T 2423.60-2008 | Pull Force based on terminal diameter (0.35mm to >1.25mm); Duration: 10sec; Meet requirements without loose terminal. |
| Resistance to Flexure | JIS C 5321:1997 | No visible mechanical damage; Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping | GB/T 2423.7-2018 | No case deformation or change in appearance; No short and no open; Drop from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | GB/T 2423.28-2005 | No visible mechanical damage; Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage; Solder temperature: 2402; Duration: 3 sec. |
| Vibration | GB/T 2423.10-2019 | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%; Amplitude: 1.5mm; Frequency: 10-55 Hz; Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | GB/T 2423.22-2012 Method Na | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; 100 cycles of temperature transitions between (-55~-40) and (85~125). |
| Low temperature Storage | GB/T 2423.1-2008 Method Ab | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | GB/T 2423.2-2008 Method Bb | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; Temperature: 85~1252; Duration: 962 hours. |
| Damp Heat (Steady States) | GB/T 2423.3-2016 | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | GJB 360B-2009 | No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10%; Peak temperature: 260+0/-5. |
| Resistance to solvent test | IEC 68-2-45:1993 | No case deformation or change in appearance or obliteration of marking; Dip into IPA solvent for 50.5Min, drying for 5Min, brushing 10 times. |
| Overload test | JIS C5311-6.13 | No smoke, peculiar smell, or fire; Characteristics normal after test; Apply twice rated current for 5 minutes. |
| Voltage resistance test | MIL-STD-202G Method 301 | No breakdown during test; Characteristics normal after test; DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions (5~40C, 35~65% RH). Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle products carefully to prevent damage.
- Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions; overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON.
- Non-Magnetic Shield Type: Careful layout is required on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina