Unshielded SMD Power Inductors LanTu Micro SSD0804-6R8MT with RoHS Halogen Free and REACH Compliance
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Product Description
Unshielded SMD Power Inductors - SSD0804 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0804 Series Unshielded SMD Power Inductors are designed for high power applications, featuring high saturation and low DC resistance. These unshielded inductors are suitable for surface mounting equipment and are available in various package sizes and inductance ranges. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in power supplies for VTRs, LCD televisions, DC/DC converters, and other home appliances.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SSD0804
- Type: Unshielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications
| Parameter | Value | Notes |
|---|---|---|
| Operating Temperature | -40 to +125 | Including coils self-temperature rise |
| External Dimensions (LWH) | 12.959.45.21 mm | (SSD0804 model) |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |
| Test Frequency for L | 100KHz | |
| Saturation Current Definition | DC current at which inductance drops 10% from its value without current. | |
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25) | |
| Rated DC Current | The lesser value of Isat or Irms. |
Electrical Characteristics (at 25)
| Part No | Inductance (H) | Tolerance | Test Freq (MHz) | SRF Typ () | DCR Max () | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SSD0804-1R0M | 1.0 | 20% | 100KHz | 100 | 0.009 | 9.00 | 6.80 |
| SSD0804-1R5M | 1.5 | 20% | 100KHz | 90 | 0.010 | 8.00 | 6.40 |
| SSD0804-2R2M | 2.2 | 20% | 100KHz | 80 | 0.012 | 7.00 | 6.10 |
| SSD0804-3R3M | 3.3 | 20% | 100KHz | 65 | 0.015 | 6.40 | 5.40 |
| SSD0804-4R7M | 4.7 | 20% | 100KHz | 45 | 0.018 | 5.40 | 4.80 |
| SSD0804-6R8M | 6.8 | 20% | 100KHz | 38 | 0.027 | 4.60 | 4.40 |
| SSD0804-100M | 10 | 20% | 100KHz | 30 | 0.038 | 3.80 | 3.90 |
| SSD0804-150M | 15 | 20% | 100KHz | 27 | 0.046 | 3.50 | 3.10 |
| SSD0804-220M | 22 | 20% | 100KHz | 19 | 0.085 | 3.00 | 2.70 |
| SSD0804-330M | 33 | 20% | 100KHz | 15 | 0.100 | 2.60 | 2.10 |
| SSD0804-470M | 47 | 20% | 100KHz | 12 | 0.140 | 2.00 | 1.60 |
| SSD0804-680M | 68 | 20% | 100KHz | 10 | 0.200 | 1.60 | 1.40 |
| SSD0804-101M | 100 | 20% | 100KHz | 9 | 0.280 | 1.40 | 1.20 |
| SSD0804-151K | 150 | 10% | 100KHz | 6 | 0.400 | 1.20 | 1.00 |
| SSD0804-221K | 220 | 10% | 100KHz | 5 | 0.610 | 1.00 | 0.80 |
| SSD0804-331K | 330 | 10% | 100KHz | 4.5 | 1.020 | 0.60 | 0.60 |
| SSD0804-471K | 470 | 10% | 100KHz | 3.5 | 1.270 | 0.50 | 0.50 |
| SSD0804-681K | 680 | 10% | 100KHz | 2.5 | 2.020 | 0.40 | 0.40 |
| SSD0804-102K | 1000 | 10% | 100KHz | 2.0 | 3.000 | 0.30 | 0.30 |
Dimensions (mm)
| Part No | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 12.95 | 9.4 | 5.21 | 7.62 | 2.54 | 2.54 | 2.79 | 2.92 | 7.37 |
Packaging Information
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal. | Refer to GB/T 2423.60-2008 (SMT/DIP). Force and duration vary based on terminal size. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temp: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 2 hours in 3 directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature cycling (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 85~1252. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Twice reflow. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage period is within 12 months under conditions (5~40C, 35~65% RH).
- Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oils that inhibit soldering.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; the temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Allow sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, careful coil layout on the PCB is necessary to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina