Surface Mount LanTu Micro SCD7850-100MT Unshielded SMD Power Inductors Compliant with RoHS and REACH
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Product Description
Unshielded SMD Power Inductors - SCD7850 Series
The SCD7850 Series are unshielded SMD power inductors designed for surface mounting applications. They offer a low-cost, silver-plated design with small size and high rated current capabilities, along with low DC resistance. These inductors are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD7850
- Type: Unshielded SMD Power Inductors
- Design: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Applications
- Power supply for VTRs
- LCD televisions
- Notebook PCs
- Portable communication equipment
- DC/DC converters
- Automotive
Technical Specifications
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification:
SCD 7850 - [Inductance Value] [Tolerance Code] [Packing Code]
- Type: SCD (Unshielded SMD Power Inductors)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
External Dimensions (LWH): 7.85.02.1 mm
Electrical Characteristics (Electrical specifications at 25)
| Part No | Inductance (H) @ 0A | Tole | Test Freq (100KHz) | SRF Min (MHz) | DCR Typ () | DCR Max () | Isat (A) Max | Irms (A) Max |
|---|---|---|---|---|---|---|---|---|
| SCD7850-1R0M | 1.0 | M | 100KHz | 145 | 0.013 | - | 7.00 | 5.20 |
| SCD7850-2R2M | 2.2 | M | 100KHz | 140 | 0.015 | - | 6.00 | 4.80 |
| SCD7850-4R7M | 4.7 | M | 100KHz | 135 | 0.026 | - | 5.00 | 3.80 |
| SCD7850-6R8M | 6.8 | M | 100KHz | 130 | 0.033 | - | 4.00 | 2.80 |
| SCD7850-8R2M | 8.2 | M | 100KHz | 125 | 0.039 | - | 3.50 | 2.55 |
| SCD7850-100M | 10 | M | 100KHz | 120 | 0.042 | - | 2.85 | 2.31 |
| SCD7850-120M | 12 | M | 100KHz | 100 | 0.049 | - | 2.50 | 2.00 |
| SCD7850-150M | 15 | M | 100KHz | 95 | 0.072 | - | 2.20 | 1.81 |
| SCD7850-180M | 18 | M | 100KHz | 85 | 0.085 | - | 2.00 | 1.60 |
| SCD7850-220M | 22 | M | 100KHz | 75 | 0.091 | - | 1.95 | 1.50 |
| SCD7850-270M | 27 | M | 100KHz | 62 | 0.107 | - | 1.75 | 1.30 |
| SCD7850-330M | 33 | M | 100KHz | 53 | 0.120 | - | 1.50 | 1.20 |
| SCD7850-390M | 39 | M | 100KHz | 47 | 0.150 | - | 1.40 | 1.10 |
| SCD7850-470M | 47 | M | 100KHz | 41 | 0.176 | - | 1.28 | 1.10 |
| SCD7850-560M | 56 | M | 100KHz | 38 | 0.208 | - | 1.20 | 0.94 |
| SCD7850-680M | 68 | M | 100KHz | 33 | 0.238 | - | 1.12 | 0.85 |
| SCD7850-820M | 82 | M | 100KHz | 31 | 0.273 | - | 1.04 | 0.78 |
| SCD7850-101M | 100 | M | 100KHz | 27 | 0.325 | - | 0.92 | 0.73 |
| SCD7850-121M | 120 | M | 100KHz | 23 | 0.390 | - | 0.80 | 0.66 |
| SCD7850-151M | 150 | M | 100KHz | 21 | 0.520 | - | 0.72 | 0.58 |
| SCD7850-181M | 180 | M | 100KHz | 19 | 0.598 | - | 0.68 | 0.51 |
| SCD7850-221M | 220 | M | 100KHz | 17 | 0.793 | - | 0.64 | 0.49 |
| SCD7850-271M | 270 | M | 100KHz | 15 | 0.884 | - | 0.56 | 0.42 |
| SCD7850-331M | 330 | M | 100KHz | 14 | 1.130 | - | 0.52 | 0.40 |
| SCD7850-391M | 390 | M | 100KHz | 12 | 1.300 | - | 0.44 | 0.36 |
| SCD7850-471M | 470 | M | 100KHz | 11 | 1.680 | - | 0.40 | 0.34 |
| SCD7850-561M | 560 | M | 100KHz | 10 | 1.900 | - | 0.38 | 0.32 |
| SCD7850-681M | 680 | M | 100KHz | 9 | 2.470 | - | 0.35 | 0.29 |
| SCD7850-821M | 820 | M | 100KHz | 8 | 2.860 | - | 0.30 | 0.25 |
| SCD7850-102M | 1000 | M | 100KHz | 7 | 3.640 | - | 0.25 | 0.19 |
| SCD7850-122M | 1200 | M | 100KHz | 5 | 4.430 | - | 0.23 | 0.17 |
Notes on Current Ratings:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special Remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Shape and Dimensions
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | H (mm) | I (mm) | J (mm) |
|---|---|---|---|---|---|---|---|
| SCD7850 | 7.80.3 | 7.00.3 | 5.00.5 | 2.1 | 7.5 | 3.0 | 2.0 |
Packaging Information
Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SCD7850 | 16 | 12 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Cover tape peel off condition:
- Cover tape peel force shall be 10 to 120g.
- Noodle strip peeling angle 165 to 180.
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (d). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subjected to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz). Applied for 2 hours in 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Refer to recommended reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less). Terminal electrode solderability may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands to prevent reduced solderability. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminals: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Self-heating occurs when power is on; ensure sufficient allowance in thermal design.
- Layout: For non-magnetic shield types, carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina