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Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR5040-221MT with Low DCR and EMI Resistance

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Product Description

Product Overview

The SNR5040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors featuring magnetic resin shielding. This design significantly reduces buzz noise to ultra-low levels, offers large current handling with low DCR, and provides excellent shock resistance due to metallization on the ferrite core. The closed magnetic circuit design minimizes leakage flux and enhances EMI resistance, while the compact size saves PCB space and power. These inductors are compliant with RoHS, Halogen Free, and REACH standards.

Applications: Widely used in LED backlights, flat-screen TVs, Blu-ray disc players, set-top boxes, notebooks, desktop computers, servers, graphics cards, portable gaming devices, personal navigation systems, personal multimedia devices, automotive systems, telecommunications base stations, and DC-DC converters.

Product Attributes

  • Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR5040
  • Construction: Magnetic Resin Shielded SMD
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China

Technical Specifications

Dimensions (mm)

Part No L W H A B C D E F (Typ) G (Typ) H (Typ)
SNR5040 5.0 0.3 5.0 0.3 4.0 Max 2.5 0.2 4.0 0.2 1.4 2.3 4.2 - - -

Electrical Characteristics

Part No Inductance (H) Tolerance L @ 100KHz, 1.0V (H) Typical DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SNR5040-1R0M 1.0 20% 1.0 0.012 0.018 7.35 4.90
SNR5040-1R2M 1.2 20% 1.2 0.016 0.021 6.50 4.30
SNR5040-1R5M 1.5 20% 1.5 0.015 0.020 6.30 4.30
SNR5040-2R2M 2.2 20% 2.2 0.019 0.025 4.90 3.80
SNR5040-3R3M 3.3 20% 3.3 0.024 0.031 3.95 3.40
SNR5040-4R7M 4.7 20% 4.7 0.030 0.039 3.50 3.00
SNR5040-6R8M 6.8 20% 6.8 0.043 0.056 2.90 2.50
SNR5040-8R2M 8.2 20% 8.2 0.050 0.070 2.70 2.30
SNR5040-100M 10 20% 10 0.064 0.082 2.35 2.10
SNR5040-120M 12 20% 12 0.077 0.102 2.20 2.00
SNR5040-150M 15 20% 15 0.086 0.115 2.00 2.00
SNR5040-220M 22 20% 22 0.129 0.167 1.60 1.50
SNR5040-330M 33 20% 33 0.188 0.244 1.30 1.20
SNR5040-470M 47 20% 47 0.272 0.353 1.10 1.00
SNR5040-680M 68 20% 68 0.400 0.520 0.90 0.80
SNR5040-820M 82 20% 82 0.560 0.660 0.80 0.75
SNR5040-101M 100 20% 100 0.509 0.728 0.75 0.70
SNR5040-121M 120 20% 120 0.665 0.864 0.70 0.65
SNR5040-151M 150 20% 150 0.750 0.975 0.65 0.60
SNR5040-221M 220 20% 220 1.400 1.820 0.48 0.40
SNR5040-331M 330 20% 330 2.000 2.730 0.42 0.40
SNR5040-471M 470 20% 470 3.000 3.900 0.37 0.35
SNR5040-681M 680 20% 680 3.900 5.070 0.30 0.25
SNR5040-102M 1000 20% 1000 6.000 7.800 0.21 0.23

Inductance Tolerance Codes

Code Tolerance
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%

Packing

Code Package Type
B Bulk Package
T Tape & Reel

Environmental Data

Parameter Value
Operating Temperature -40 to +125 (Including coils self-temperature rise)

Test Equipment

Measurement Equipment
Inductance (L) HP4284A, HP4285A LCR meter or equivalent
Saturation Current (Isat) & Temperature Rise Current (Irms) HP4284+42841A or equivalent
DC Resistance (DCR) Chroma 16502 or equivalent

Packaging Details (Tape & Reel)

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS) Total Quantity
SNR5040 12 8 5.5 12.4 100 13 330 1500 6000 24,000 -

Reliability Testing (Summary)

Item Requirements Test Methods and Remarks
Terminal Strength (SMT/DIP) Meet requirements without loose terminal Pulling test, Solder paste thickness, Force application based on terminal size
Resistance to Flexure No visible mechanical damage Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec
Dropping No case deformation, no short/open Drop from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction
Solderability Wetting >75% coverage, Terminals >95% solder coverage Solder temp: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu
Vibration Inductance change: 10%, Q factor change: 20% Frequency 10-55 Hz, Amplitude 1.5mm, 2 hours each direction
Thermal Shock Inductance change: 10%, Q factor change: 20% 100 cycles of temperature extremes (-55~40 to 85~125)
Low temperature Storage Inductance change: 10%, Q factor change: 20% -55~-402, 962 hours
High temperature Storage Inductance change: 10%, Q factor change: 20% 85~1252, 962 hours
Damp Heat (Steady States) Inductance change: 10%, Q factor change: 20% 602, 90%-95% RH, 962 hours
Heat endurance of Reflow soldering L/L10%, Q/Q30%, DCR/DCR10% Peak temp: 260+0/-5, Twice reflow
Resistance to solvent test No case deformation or appearance change Dip in IPA solvent, brush 10 times
Overload test No smoke, smell, fire; characteristics normal after test Apply twice rated current for 5 minutes
Voltage resistance test No breakdown; characteristics normal after test DC1000V, Current: 1mA, Time: 1Min

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.

Reminders for Using These Products

  • Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact SXN if cleaning is necessary.
  • Magnetic Fields: Do not expose to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
  • Self-Heating: Account for self-heating (temperature increase) when power is ON in thermal design.
  • Non-Magnetic Shield Type: Careful layout is needed on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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