Product Overview
The SNR5040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors featuring magnetic resin shielding. This design significantly reduces buzz noise to ultra-low levels, offers large current handling with low DCR, and provides excellent shock resistance due to metallization on the ferrite core. The closed magnetic circuit design minimizes leakage flux and enhances EMI resistance, while the compact size saves PCB space and power. These inductors are compliant with RoHS, Halogen Free, and REACH standards.
Applications: Widely used in LED backlights, flat-screen TVs, Blu-ray disc players, set-top boxes, notebooks, desktop computers, servers, graphics cards, portable gaming devices, personal navigation systems, personal multimedia devices, automotive systems, telecommunications base stations, and DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR5040
- Construction: Magnetic Resin Shielded SMD
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China
Technical Specifications
Dimensions (mm)
| Part No | L | W | H | A | B | C | D | E | F (Typ) | G (Typ) | H (Typ) |
| SNR5040 | 5.0 0.3 | 5.0 0.3 | 4.0 Max | 2.5 0.2 | 4.0 0.2 | 1.4 | 2.3 | 4.2 | - | - | - |
Electrical Characteristics
| Part No | Inductance (H) | Tolerance | L @ 100KHz, 1.0V (H) Typical | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
| SNR5040-1R0M | 1.0 | 20% | 1.0 | 0.012 | 0.018 | 7.35 | 4.90 |
| SNR5040-1R2M | 1.2 | 20% | 1.2 | 0.016 | 0.021 | 6.50 | 4.30 |
| SNR5040-1R5M | 1.5 | 20% | 1.5 | 0.015 | 0.020 | 6.30 | 4.30 |
| SNR5040-2R2M | 2.2 | 20% | 2.2 | 0.019 | 0.025 | 4.90 | 3.80 |
| SNR5040-3R3M | 3.3 | 20% | 3.3 | 0.024 | 0.031 | 3.95 | 3.40 |
| SNR5040-4R7M | 4.7 | 20% | 4.7 | 0.030 | 0.039 | 3.50 | 3.00 |
| SNR5040-6R8M | 6.8 | 20% | 6.8 | 0.043 | 0.056 | 2.90 | 2.50 |
| SNR5040-8R2M | 8.2 | 20% | 8.2 | 0.050 | 0.070 | 2.70 | 2.30 |
| SNR5040-100M | 10 | 20% | 10 | 0.064 | 0.082 | 2.35 | 2.10 |
| SNR5040-120M | 12 | 20% | 12 | 0.077 | 0.102 | 2.20 | 2.00 |
| SNR5040-150M | 15 | 20% | 15 | 0.086 | 0.115 | 2.00 | 2.00 |
| SNR5040-220M | 22 | 20% | 22 | 0.129 | 0.167 | 1.60 | 1.50 |
| SNR5040-330M | 33 | 20% | 33 | 0.188 | 0.244 | 1.30 | 1.20 |
| SNR5040-470M | 47 | 20% | 47 | 0.272 | 0.353 | 1.10 | 1.00 |
| SNR5040-680M | 68 | 20% | 68 | 0.400 | 0.520 | 0.90 | 0.80 |
| SNR5040-820M | 82 | 20% | 82 | 0.560 | 0.660 | 0.80 | 0.75 |
| SNR5040-101M | 100 | 20% | 100 | 0.509 | 0.728 | 0.75 | 0.70 |
| SNR5040-121M | 120 | 20% | 120 | 0.665 | 0.864 | 0.70 | 0.65 |
| SNR5040-151M | 150 | 20% | 150 | 0.750 | 0.975 | 0.65 | 0.60 |
| SNR5040-221M | 220 | 20% | 220 | 1.400 | 1.820 | 0.48 | 0.40 |
| SNR5040-331M | 330 | 20% | 330 | 2.000 | 2.730 | 0.42 | 0.40 |
| SNR5040-471M | 470 | 20% | 470 | 3.000 | 3.900 | 0.37 | 0.35 |
| SNR5040-681M | 680 | 20% | 680 | 3.900 | 5.070 | 0.30 | 0.25 |
| SNR5040-102M | 1000 | 20% | 1000 | 6.000 | 7.800 | 0.21 | 0.23 |
Inductance Tolerance Codes
| Code | Tolerance |
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packing
| Code | Package Type |
| B | Bulk Package |
| T | Tape & Reel |
Environmental Data
| Parameter | Value |
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
Test Equipment
| Measurement | Equipment |
| Inductance (L) | HP4284A, HP4285A LCR meter or equivalent |
| Saturation Current (Isat) & Temperature Rise Current (Irms) | HP4284+42841A or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
Packaging Details (Tape & Reel)
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) | Total Quantity |
| SNR5040 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 1500 | 6000 | 24,000 | - |
Reliability Testing (Summary)
| Item | Requirements | Test Methods and Remarks |
| Terminal Strength (SMT/DIP) | Meet requirements without loose terminal | Pulling test, Solder paste thickness, Force application based on terminal size |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation, no short/open | Drop from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction |
| Solderability | Wetting >75% coverage, Terminals >95% solder coverage | Solder temp: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu |
| Vibration | Inductance change: 10%, Q factor change: 20% | Frequency 10-55 Hz, Amplitude 1.5mm, 2 hours each direction |
| Thermal Shock | Inductance change: 10%, Q factor change: 20% | 100 cycles of temperature extremes (-55~40 to 85~125) |
| Low temperature Storage | Inductance change: 10%, Q factor change: 20% | -55~-402, 962 hours |
| High temperature Storage | Inductance change: 10%, Q factor change: 20% | 85~1252, 962 hours |
| Damp Heat (Steady States) | Inductance change: 10%, Q factor change: 20% | 602, 90%-95% RH, 962 hours |
| Heat endurance of Reflow soldering | L/L10%, Q/Q30%, DCR/DCR10% | Peak temp: 260+0/-5, Twice reflow |
| Resistance to solvent test | No case deformation or appearance change | Dip in IPA solvent, brush 10 times |
| Overload test | No smoke, smell, fire; characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | No breakdown; characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils; contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Self-Heating: Account for self-heating (temperature increase) when power is ON in thermal design.
- Non-Magnetic Shield Type: Careful layout is needed on the circuit board to prevent malfunctions due to magnetic interference.