Surface mount LanTu Micro SCD4532-470MT unshielded power inductor offering high rated current and low resistance
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Negotiable
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Delivery Time:
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Product Description
Unshielded SMD Power Inductors - SCD4532 Series
Product Overview
The SCD4532 Series Unshielded SMD Power Inductors are designed for surface mounting applications, offering a low-cost, high-performance solution for DC/DC converters and power supplies in various electronic devices. These inductors feature a small size with high rated current capability and low DC resistance, making them ideal for compact and power-efficient designs. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD4532
- Type: Unshielded Power Inductor
- Design: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free, REACH Compliance
- Termination: Suitable for surface mounting equipment
Applications
- Power supply for VTRs
- LCD televisions
- Notebook PCs
- Portable communication equipment
- DC/DC converters
- Automotive
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Technical Specifications
Product Identification Example: SCD 4532 - 100 M T
- Type: SM (Unshielded SMD Power Inductors)
- External Dimensions (LWH): 4.53.2 mm
- Inductance: e.g., 10 uH
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: T (Tape & Reel), B (Bulk Package)
Shape and Dimensions (mm)
| Part No | A (0.3) | B (0.3) | C (0.3) | D (Typ) | H (Typ) | I (Typ) | J (Typ) |
|---|---|---|---|---|---|---|---|
| SCD4532 | 4.5 | 4.0 | 3.2 | 1.2 | 4.5 | 1.75 | 1.5 |
Electrical Characteristics
| Part No | Inductance L(H) @ 0A | Tolerance | Test Freq | SRF Min Test Freq (MHz) | DCR Typ () | DCR Max () | Saturation Current Isat Max (A) | Temperature Rise Current Irms Max (A) | |
|---|---|---|---|---|---|---|---|---|---|
| SCD4532-1R0M | 1.0 | M (20%) | 100KHz | 7.96 | 0.0487 | - | 3.85 | 2.56 | |
| SCD4532-1R4M | 1.4 | M (20%) | 100KHz | 7.96 | 0.0562 | - | 3.40 | 2.52 | |
| SCD4532-1R8M | 1.8 | M (20%) | 100KHz | 7.96 | 0.0637 | - | 2.90 | 1.95 | |
| SCD4532-2R2M | 2.2 | M (20%) | 100KHz | 7.96 | 0.0712 | - | 2.80 | 1.75 | |
| SCD4532-2R7M | 2.7 | M (20%) | 100KHz | 7.96 | 0.0787 | - | 2.75 | 1.58 | |
| SCD4532-3R3M | 3.3 | M (20%) | 100KHz | 7.96 | 0.0862 | - | 2.48 | 1.44 | |
| SCD4532-3R9M | 3.9 | M (20%) | 100KHz | 7.96 | 0.0937 | - | 2.30 | 1.33 | |
| SCD4532-4R7M | 4.7 | M (20%) | 1 | 100KHz | 7.96 | 0.1087 | - | 2.00 | 1.15 |
| SCD4532-5R6M | 5.6 | M (20%) | 100KHz | 7.96 | 0.1257 | - | 1.95 | 0.99 | |
| SCD4532-6R8M | 6.8 | M (20%) | 100KHz | 7.96 | 0.1312 | - | 1.60 | 0.95 | |
| SCD4532-8R2M | 8.2 | M (20%) | 100KHz | 7.96 | 0.1462 | - | 1.50 | 0.84 | |
| SCD4532-100M | 10 | M (20%) | 100KHz | 2.52 | 0.1820 | - | 1.45 | 1.04 | |
| SCD4532-120M | 12 | M (20%) | 100KHz | 2.52 | 0.2100 | - | 1.20 | 0.97 | |
| SCD4532-150M | 15 | M (20%) | 100KHz | 2.52 | 0.2350 | - | 1.12 | 0.85 | |
| SCD4532-180M | 18 | M (20%) | 100KHz | 2.52 | 0.3380 | - | 1.00 | 0.74 | |
| SCD4532-220M | 22 | M (20%) | 100KHz | 2.52 | 0.3780 | - | 0.96 | 0.68 | |
| SCD4532-270M | 27 | M (20%) | 100KHz | 2.52 | 0.5220 | - | 0.84 | 0.62 | |
| SCD4532-330M | 33 | M (20%) | 100KHz | 2.52 | 0.5400 | - | 0.75 | 0.56 | |
| SCD4532-390M | 39 | M (20%) | 100KHz | 2.52 | 0.5870 | - | 0.70 | 0.52 | |
| SCD4532-470M | 47 | M (20%) | 100KHz | 2.52 | 0.8440 | - | 0.68 | 0.44 | |
| SCD4532-560M | 56 | M (20%) | 100KHz | 2.52 | 0.9370 | - | 0.60 | 0.42 | |
| SCD4532-680M | 68 | M (20%) | 100KHz | 2.52 | 1.1170 | - | 0.50 | 0.37 | |
| SCD4532-820M | 82 | M (20%) | 100KHz | 2.52 | 1.3450 | - | 0.46 | 0.29 | |
| SCD4532-101M | 100 | M (20%) | 100KHz | 1.00 | 1.5200 | - | 0.45 | 0.26 | |
| SCD4532-121M | 120 | M (20%) | 100KHz | 1.00 | 1.7500 | - | 0.44 | 0.24 | |
| SCD4532-151M | 150 | M (20%) | 100KHz | 1.00 | 2.0000 | - | 0.42 | 0.22 | |
| SCD4532-181M | 180 | M (20%) | 100KHz | 1.00 | 3.2000 | - | 0.38 | 0.19 | |
| SCD4532-221M | 220 | M (20%) | 100KHz | 1.00 | 3.4000 | - | 0.36 | 0.18 | |
| SCD4532-331M | 330 | M (20%) | 100KHz | 1.00 | 5.3000 | - | 0.28 | 0.15 | |
| SCD4532-391M | 390 | M (20%) | 100KHz | 1.00 | 5.9000 | - | 0.24 | 0.13 | |
| SCD4532-471M | 470 | M (20%) | 100KHz | 1.00 | 6.8000 | - | 0.21 | 0.12 | |
| SCD4532-561M | 560 | M (20%) | 100KHz | 1.00 | 8.4000 | - | 0.20 | 0.10 |
Notes on Current Ratings:
- Saturation Current (Isat): DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging Information
Packing Quantity:
| Part No | Tape Dimension W (mm) | P (mm) | W1 (mm) | Reel Dimensions A (mm) | B (mm) | C (mm) | D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) | Total Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SCD4532 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 | - |
Tape and Reel Specifications: Dimensions are in mm.
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g
- b) Noodle strip peeling angle 165 to 180
Reliability Testing
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet the above requirements without any loose terminal | 1. Pulling test: Force applied based on terminal sectional area (A). 2. Solder paste thickness: 0.12mm. 3. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet the above requirements without any loose terminal. | Pull Force applied based on terminal diameter (d). Duration: 10 sec. |
| Resistance to Flexure | 1. No visible mechanical damage. | 1. Solder inductor to test jig. 2. Flexure: 2mm. 3. Pressurizing Speed: 0.5mm/sec. 4. Keep time: 30 sec. |
| Dropping | 1. No case deformation or change in appearance. 2. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | 1. No visible mechanical damage. 2. Wetting shall exceed 75% coverage. 3. Terminals must have 95% minimum solder coverage. | 1. Solder temperature: 2402. 2. Duration: 3 sec. 3. Solder: Sn/3.0Ag/0.5Cu. 4. Flux: 25% Resin and 75% ethanol. |
| Vibration | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | Subjected to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz) for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | 100 cycles of temperature cycling between (-55~-40) and (85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | 1. No significant defects in appearance. 2. L/L10%. 3. Q/Q30%. 4. DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | 1. During the test no smoke, no peculiar smell, no fire. 2. The characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | 1. During the test no breakdown. 2. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to general soldering equipment standards. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35-65% RH. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping.
- Terminals: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering Corrections: Perform after-mounting corrections within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil placement is required during PCB design to prevent malfunctions due to electromagnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina