Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Molding SMD Power Inductor LanTu Micro SMS1360-101MT with Low Impedance and Excellent EMI Performance

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Product Description

Molding SMD Power Inductors - SMS1360 Series

Product Overview

The SMS1360 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed with a thin profile, low DC resistance, and excellent anti-electromagnetic interference capabilities due to magnetic shielding. These inductors feature an integral construction for high reliability and vibration resistance, composite construction for ultra-low buzz noise, and are manufactured using low-loss alloy powder for low impedance and small parasitic capacitance. They are suitable for high-density installations and offer high efficiency with low eddy-current loss. Applications include PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems. They operate at frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: SMS1360 Series
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Part No. Inductance (H) Tolerance DCR (m) Typical Saturation Current (A) Typical Heat Rating Current (A) Typical Dimensions (LWH) (mm) Operating Temperature (C) Absolute Maximum Voltage (VDC)
SMS1360-R68M 0.68 20% 1.4 1.6 55.00 13.812.67.0 -55 to +125 30
SMS1360-1R0M 1.0 20% 1.7 2.0 35.00 13.812.67.0 -55 to +125 30
SMS1360-2R2M 2.2 20% 3.5 4.2 25.00 13.812.67.0 -55 to +125 30
SMS1360-3R3M 3.3 20% 5.5 6.8 22.00 13.812.67.0 -55 to +125 30
SMS1360-4R7M 4.7 20% 8.0 9.0 18.00 13.812.67.0 -55 to +125 30
SMS1360-6R8M 6.8 20% 10.0 14.0 15.00 13.812.67.0 -55 to +125 30
SMS1360-8R2M 8.2 20% 13.5 16.0 14.00 13.812.67.0 -55 to +125 30
SMS1360-100M 10 20% 18.0 21.0 12.50 13.812.67.0 -55 to +125 30
SMS1360-220M 22 20% 34.0 38.0 8.00 13.812.67.0 -55 to +125 30
SMS1360-270M 27 20% 45.0 56.0 7.00 13.812.67.0 -55 to +125 30
SMS1360-330M 33 20% 56.0 70.0 6.50 13.812.67.0 -55 to +125 30
SMS1360-470M 47 20% 70.0 90.0 6.00 13.812.67.0 -55 to +125 30
SMS1360-680M 68 20% 105.0 125.0 5.00 13.812.67.0 -55 to +125 30
SMS1360-820M 82 20% 115.0 140.0 4.00 13.812.67.0 -55 to +125 30
SMS1360-101M 100 20% 130.0 200.0 3.00 13.812.67.0 -55 to +125 30

Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packaging Options: B: Bulk Package, T: Tape & Reel

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Environmental Data:

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment:

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Recommended Land Pattern: (Dimensions are in mm)

Part No. A B C D E F G H
SMS1360 13.800.50 12.600.20 7.00Max 3.70 Typ 2.50 Typ 8.00 14.60 5.00

Recommended Reflow Soldering Curve: (Refer to provided graph for details. Adjust based on user environment/equipment.)

Reminders for Using These Products:

  • Storage period is within 12 months under conditions (5~40C, 35-65% RH).
  • Avoid use and storage in corrosive environments (salt, acid, alkali).
  • Do not touch electrodes directly with bare hands.
  • Handle products carefully to prevent damage.
  • Do not bend terminals excessively.
  • Do not rinse coils; contact manufacturer if cleaning is needed.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions.
  • Allow sufficient thermal design margin for self-heating.
  • For non-magnetic shield types, careful layout is required to avoid malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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