Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
Verified Supplier
17 Years
Since 2009
Menu

SMD power inductor LanTu Micro SNR5040-101MT magnetic resin shielded for low DCR high current design

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The SNR5040 Series is an automatic assembly, magnetic resin shielded SMD power inductor designed for high-current, low DCR applications. Its closed magnetic circuit design minimizes leakage flux and EMI, while the magnetic-resin shielded construction significantly reduces buzz noise to ultra-low levels. This series offers excellent shock resistance and durability due to metallization on the ferrite core. Designed for space and power efficiency, these inductors are RoHS, Halogen Free, and REACH compliant. They are widely used in applications such as LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive products, telecommunication equipment, and DC-DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR5040
  • Type: Shielded SMD Power Inductors
  • Construction: Magnetic Resin Shielded
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency Test Voltage DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SNR5040-1R0M 1.0 20% 100KHz 1.0V 0.012 0.018 7.35 4.90
SNR5040-1R2M 1.2 20% 100KHz 1.0V 0.016 0.021 6.50 4.30
SNR5040-1R5M 1.5 20% 100KHz 1.0V 0.015 0.020 6.30 4.30
SNR5040-2R2M 2.2 20% 100KHz 1.0V 0.019 0.025 4.90 3.80
SNR5040-3R3M 3.3 20% 100KHz 1.0V 0.024 0.031 3.95 3.40
SNR5040-4R7M 4.7 20% 100KHz 1.0V 0.030 0.039 3.50 3.00
SNR5040-6R8M 6.8 20% 100KHz 1.0V 0.043 0.056 2.90 2.50
SNR5040-8R2M 8.2 20% 100KHz 1.0V 0.050 0.070 2.70 2.30
SNR5040-100M 10 20% 100KHz 1.0V 0.064 0.082 2.35 2.10
SNR5040-120M 12 20% 100KHz 1.0V 0.077 0.102 2.20 2.00
SNR5040-150M 15 20% 100KHz 1.0V 0.086 0.115 2.00 2.00
SNR5040-220M 22 20% 100KHz 1.0V 0.129 0.167 1.60 1.50
SNR5040-330M 33 20% 100KHz 1.0V 0.188 0.244 1.30 1.20
SNR5040-470M 47 20% 100KHz 1.0V 0.272 0.353 1.10 1.00
SNR5040-680M 68 20% 100KHz 1.0V 0.400 0.520 0.90 0.80
SNR5040-820M 82 20% 100KHz 1.0V 0.560 0.660 0.80 0.75
SNR5040-101M 100 20% 100KHz 1.0V 0.509 0.728 0.75 0.70
SNR5040-121M 120 20% 100KHz 1.0V 0.665 0.864 0.70 0.65
SNR5040-151M 150 20% 100KHz 1.0V 0.750 0.975 0.65 0.60
SNR5040-221M 220 20% 100KHz 1.0V 1.400 1.820 0.48 0.40
SNR5040-331M 330 20% 100KHz 1.0V 2.000 2.730 0.42 0.40
SNR5040-471M 470 20% 100KHz 1.0V 3.000 3.900 0.37 0.35
SNR5040-681M 680 20% 100KHz 1.0V 3.900 5.070 0.30 0.25
SNR5040-102M 1000 20% 100KHz 1.0V 6.000 7.800 0.21 0.23
Inductance Tolerance Codes Packing Codes
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% B: Bulk Package, T: Tape & Reel
Dimensions (mm) A B C (Max) D E F (Typ) G (Typ) H (Typ)
SNR5040 5.00.3 5.00.3 4.0 2.50.2 4.00.2 1.4 2.3 4.2
Environmental Data Specification
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Equipment Instrument
Inductance (L) HP4284A, HP4285A LCR meter or equivalent
Saturation Current (Isat) & Temperature Rise Current (Irms) HP4284+42841A or equivalent
DC Resistance (DCR) Chroma 16502 or equivalent
Packaging Details (Tape & Reel) W (mm) P (mm) W1 (mm) Reel Diameter (mm) Inside Box (PCS) Outside Carton (PCS) Total Reel Quantity
SNR5040 12 8 5.5 100 13 330 1500 6000 24,000
Reliability Testing Items Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without loose terminal Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s
Terminal Strength (DIP) Meet requirements without loose terminal Pull force applied gradually for 10 seconds, varying with terminal diameter
Resistance to Flexure No visible mechanical damage Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec
Dropping No case deformation or change in appearance; No short and no open Drop from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction
Solderability Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol
Vibration Inductance change: Within 10%; Q factor change: Within 20% Frequency 10-55 Hz, amplitude 1.5mm, 2 hours in 3 perpendicular directions
Thermal Shock Inductance change: Within 10%; Q factor change: Within 20% 100 cycles of temperature shock between -40 to +125; Transforming interval: Max. 20 sec
Low temperature Storage Inductance change: Within 10%; Q factor change: Within 20% -402 for 962 hours
High temperature Storage Inductance change: Within 10%; Q factor change: Within 20% 852 for 962 hours
Damp Heat (Steady States) Inductance change: Within 10%; Q factor change: Within 20% 602, 90% to 95% RH for 962 hours
Heat endurance of Reflow soldering L/L10%; Q/Q30%; DCR/DCR10% Two reflow cycles with peak temperature: 260+0/-5
Resistance to solvent test No case deformation or change in appearance or obliteration of marking Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times
Overload test No smoke, no peculiar smell, no fire; Characteristic is normal after test Apply twice rated current for 5 minutes
Voltage resistance test No breakdown; Characteristic is normal after test DC1000V, Current: 1mA, Time: 1Min

Recommended Reflow Soldering Curve

The recommended reflow conditions are provided as a guideline. Users should adjust and confirm these conditions based on their specific reflow soldering equipment, process, and environment.

Reminders for Using These Products

  • Storage Period: Within 12 months under conditions (Temperature: 5~40C, Humidity: 35~65% RH or less).
  • Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
  • Do not touch electrodes directly with bare hands to prevent soldering inhibition.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals excessively to avoid wire fracture.
  • Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
  • Allow sufficient thermal design margin for self-heating when power is ON.
  • For non-magnetic shielded types, careful PCB layout is required to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

Request A Quote

Please check your email address.
Your message must be at least 20 characters.