High Rated Current LanTu Micro SCD5845-6R8MT Unshielded SMD Power Inductors with Low DC Resistance
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Product Description
Unshielded SMD Power Inductors - SCD5845 Series
Product Overview
The SCD5845 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers unshielded SMD power inductors designed for surface mounting. These low-cost, silver-plated inductors feature a small size with high rated current capabilities and low DC resistance. They are suitable for a wide range of applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SCD5845
- Type: Unshielded SMD Power Inductors
- Design: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China
Technical Specifications
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A, HP4285A or equivalent LCR meter
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification: SCD 5845 [Inductance] [Tolerance] [Packing]
- Type Code: SCD (Unshielded SMD Power Inductors)
- Inductance Tolerance: J (5%), K (10%), L (15%), M (20%), P (25%), N (30%)
- Packing: T (Tape & Reel), B (Bulk Package)
External Dimensions:
| Part No | Inductance (H) | Tolerance | Test Freq (kHz) | SRF (MHz) Typ | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | |
|---|---|---|---|---|---|---|---|---|
| SCD5845-1R0M | 1.0 | M (20%) | 100 | 7.96 | 0.013 | 6.00 | 5.40 | |
| SCD5845-1R5M | 1.5 | M (20%) | 100 | 7.96 | 0.017 | 5.00 | 4.70 | |
| SCD5845-3R3M | 3.3 | M (20%) | 100 | 7.96 | 0.031 | 4.00 | 3.70 | |
| SCD5845-4R7M | 4.7 | M (20%) | 100 | 7.96 | 0.052 | 3.50 | 3.10 | |
| SCD5845-6R8M | 6.8 | M (20%) | 100 | 7.96 | 0.059 | 3.00 | 2.40 | |
| SCD5845-8R2M | 8.2 | M (20%) | 100 | 7.96 | 0.062 | 2.50 | 2.00 | |
| SCD5845-100M | 10 | M (20%) | 100 | 2.52 | 0.075 | 1.60 | 1.44 | |
| SCD5845-120M | 12 | M (20%) | 100 | 2.52 | 0.088 | 1.45 | 1.40 | |
| SCD5845-150M | 15 | M (20%) | 100 | 2.52 | 0.105 | 1.35 | 1.30 | |
| SCD5845-180M | 18 | M (20%) | 100 | 2.52 | 0.117 | 1.26 | 1.23 | |
| SCD5845-220M | 22 | M (20%) | 100 | 2.52 | 0.153 | 1.12 | 1.11 | |
| SCD5845-270M | 27 | M (20%) | 100 | 2.52 | 0.169 | 1.04 | 0.97 | |
| SCD5845-330M | 33 | M (20%) | 100 | 2.52 | 0.208 | 0.96 | 0.88 | |
| SCD5845-390M | 39 | M (20%) | 100 | 2.52 | 0.215 | 0.85 | 0.80 | |
| SCD5845-470M | 47 | M (20%) | 100 | 2.52 | 0.355 | 0.80 | 0.72 | |
| SCD5845-560M | 56 | M (20%) | 1 | 100 | 2.52 | 0.377 | 0.72 | 0.68 |
| SCD5845-680M | 68 | M (20%) | 100 | 2.52 | 0.390 | 0.68 | 0.61 | |
| SCD5845-820M | 82 | M (20%) | 100 | 2.52 | 0.416 | 0.64 | 0.58 | |
| SCD5845-101M | 100 | M (20%) | 100 | 1.00 | 0.611 | 0.56 | 0.52 | |
| SCD5845-121M | 120 | M (20%) | 100 | 1.00 | 0.754 | 0.52 | 0.48 | |
| SCD5845-151M | 150 | M (20%) | 100 | 1.00 | 0.845 | 0.44 | 0.40 | |
| SCD5845-181M | 180 | M (20%) | 100 | 1.00 | 1.040 | 0.40 | 0.38 | |
| SCD5845-221M | 220 | M (20%) | 100 | 1.00 | 1.450 | 0.36 | 0.35 | |
| SCD5845-331M | 330 | M (20%) | 100 | 1.00 | 1.760 | 0.34 | 0.28 | |
| SCD5845-471M | 470 | M (20%) | 100 | 1.00 | 2.990 | 0.32 | 0.24 | |
| SCD5845-681M | 680 | M (20%) | 100 | 1.00 | 3.900 | 0.29 | 0.20 | |
| SCD5845-102M | 1000 | M (20%) | 100 | 1.00 | 5.800 | 0.26 | 0.19 |
Dimensions (mm):
| Part No | L | W | H | A | B | C | D | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SCD5845 | 5.80.3 | 5.20.3 | 4.50.35 | 2.0 | 5.5 | 2.15 | 1.7 | N/A | N/A |
Definitions:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Packaging:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SCD5845 | 12 | 8 | 7.5 | 16.4 | 100 | 13 | 330 | 1500 | 4500 | 18,000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (5N to 40N); Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance; No short and no open. | Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (10 to 55 Hz, amplitude 1.5mm) for 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | 100 cycles of temperature transition between (-55~40) and (85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire; Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown; Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
The recommended reflow conditions should be adjusted and confirmed according to user's environment/equipment.
Reminders for Using These Products:
- Storage period within 12 months under conditions (5~40C, 35~65% RH).
- Avoid use or storage in gas corrosive environments (salt, acid, alkali, etc.).
- Do not touch electrodes directly with bare hands to prevent soldering inhibition.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, careful coil layout is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina