Molding SMD Power Inductors LanTu Micro SMS0518-1R0M with RoHS Halogen Free and REACH Certifications
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Product Description
Molding SMD Power Inductors - SMS0518 Series
Product Overview
The SMS0518 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installations requiring low DC resistance and ultra-high current capabilities in a thin profile. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability with an integral construction for excellent vibration resistance. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance. These inductors achieve high efficiency by reducing winding DC resistance and core eddy-current loss, operating at frequencies up to 3MHz with an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0518
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
General Specifications
| Item | Specification |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Frequency | Up to 3MHz |
| Absolute Maximum Voltage | 30VDC |
Electrical Characteristics (SMS0518 Series at 25)
| Part No. | Inductance (H) | Inductance Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
|---|---|---|---|---|---|---|
| SMS0518-R33M | 0.33 | 20% | 6.0 | 7.0 | 17.0 | 12.0 |
| SMS0518-R47M | 0.47 | 20% | 7.7 | 9.0 | 15.5 | 10.5 |
| SMS0518-R56M | 0.56 | 20% | 8.0 | 10.0 | 15.0 | 9.5 |
| SMS0518-R68M | 0.68 | 20% | 10.0 | 12.0 | 12.0 | 9.0 |
| SMS0518-1R0M | 1.00 | 20% | 15.0 | 17.0 | 9.0 | 8.0 |
| SMS0518-1R5M | 1.50 | 20% | 21.0 | 26.0 | 9.0 | 7.5 |
| SMS0518-2R2M | 2.20 | 20% | 30.0 | 35.0 | 6.5 | 5.0 |
| SMS0518-3R3M | 3.30 | 20% | 52.0 | 58.0 | 5.0 | 4.5 |
| SMS0518-4R7M | 4.70 | 20% | 78.0 | 85.0 | 4.0 | 3.5 |
| SMS0518-6R8M | 6.80 | 20% | 107.0 | 120.0 | 3.4 | 2.8 |
| SMS0518-100M | 10.00 | 20% | 140.0 | 155.0 | 3.0 | 2.5 |
| SMS0518-150M | 15.00 | 20% | 240.0 | 260.0 | 2.2 | 1.8 |
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) Typ | E (mm) Typ | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS0518 | 5.500.30 | 5.200.20 | 1.80Max | 2.30 | 1.20 | 3.00 | 7.00 | 2.50 |
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0518 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pulling test (force varies by terminal diameter) |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance, No short and no open | Drop from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin and 75% ethanol |
| Vibration | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Frequency: 10 to 55 Hz, Amplitude: 1.5mm, Duration: 2 hours in each 3 mutually perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | 100 cycles of temperature change between (85~125) and (-55~40), Transforming interval: Max. 20 sec |
| Low temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 125~852, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance, L/L10% (Mn-Zn: L/L30%), Q/Q30% (SMD series only), DCR/DCR10% | Peak temperature: 260+0/-5, Tested twice |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage period is within 12 months under conditions of 5~40C and 35~65% RH.
- Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Do not touch electrodes directly with bare hands to maintain solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; the temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance deterioration, or lifespan reduction.
- Allow for sufficient thermal design margin due to self-heating when power is on.
- For non-magnetic shield types, careful layout is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina