Shielded SMD Power Inductors LanTu Micro SDRI74-331MT Series for High Saturation Current Applications
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Product Description
Shielded SMD Power Inductors - SDRI74 Series
Product Overview
The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a high saturation current, low DC resistance, and a closed magnetic circuit design to minimize leakage. Their high-precision dimensions ensure suitability for automatic mounting. Available in various package sizes and a wide inductance range, these components are RoHS, Halogen Free, and REACH compliant, making them ideal for VTRs, LCD televisions, Notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU
- Manufacturer: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SDRI74
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
Technical Specifications
General Characteristics
| Attribute | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| External Dimensions (LWH) | 7.5 7.5 4.5 mm |
| Inductance Tolerance Options | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (Q Factor) | HP4285A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Electrical Characteristics (Electrical specifications at 25)
| Part No. | Inductance (H) @ 0A | Tolerance | Test Freq (L) | Q Factor Min @ Test Freq | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI74-2R2N | 2.2 | 30% | 100KHz | 30 @ 1MHz | 0.0147 | 5.20 | 5.00 |
| SDRI74-3R3N | 3.3 | 30% | 100KHz | 30 @ 1MHz | 0.0214 | 4.60 | 4.00 |
| SDRI74-4R7N | 4.7 | 30% | 100KHz | 30 @ 1MHz | 0.0310 | 3.80 | 3.40 |
| SDRI74-6R8N | 6.8 | 30% | 100KHz | 30 @ 1MHz | 0.035 | 3.20 | 2.30 |
| SDRI74-8R2N | 8.2 | 30% | 100KHz | 30 @ 1MHz | 0.042 | 3.00 | 2.10 |
| SDRI74-100N | 10 | 30% | 100KHz | 35 @ 1MHz | 0.049 | 2.95 | 1.84 |
| SDRI74-120M | 12 | 20% | 100KHz | 35 @ 1MHz | 0.058 | 2.85 | 1.71 |
| SDRI74-150M | 15 | 20% | 100KHz | 35 @ 1MHz | 0.081 | 2.80 | 1.47 |
| SDRI74-180M | 18 | 20% | 100KHz | 35 @ 1MHz | 0.091 | 2.50 | 1.31 |
| SDRI74-220M | 22 | 20% | 100KHz | 35 @ 1MHz | 0.110 | 2.10 | 1.23 |
| SDRI74-270M | 27 | 20% | 100KHz | 35 @ 1MHz | 0.150 | 1.90 | 1.12 |
| SDRI74-330M | 33 | 20% | 100KHz | 35 @ 1MHz | 0.170 | 1.80 | 0.96 |
| SDRI74-390M | 39 | 20% | 100KHz | 35 @ 1MHz | 0.230 | 1.70 | 0.91 |
| SDRI74-470M | 47 | 20% | 100KHz | 35 @ 1MHz | 0.260 | 1.50 | 0.88 |
| SDRI74-560M | 56 | 20% | 100KHz | 35 @ 1MHz | 0.350 | 1.32 | 0.75 |
| SDRI74-680M | 68 | 20% | 100KHz | 35 @ 1MHz | 0.380 | 1.08 | 0.69 |
| SDRI74-820M | 82 | 20% | 100KHz | 35 @ 1MHz | 0.430 | 1.05 | 0.61 |
| SDRI74-101M | 100 | 20% | 100KHz | 40 @ 0.796MHz | 0.610 | 1.02 | 0.60 |
| SDRI74-121M | 120 | 20% | 100KHz | 40 @ 0.796MHz | 0.660 | 0.98 | 0.52 |
| SDRI74-151M | 150 | 20% | 100KHz | 40 @ 0.796MHz | 0.880 | 0.95 | 0.46 |
| SDRI74-181M | 180 | 20% | 100KHz | 40 @ 0.796MHz | 0.980 | 0.74 | 0.42 |
| SDRI74-221M | 220 | 20% | 100KHz | 40 @ 0.796MHz | 1.170 | 0.70 | 0.36 |
| SDRI74-271M | 270 | 20% | 100KHz | 40 @ 0.796MHz | 1.640 | 0.57 | 0.34 |
| SDRI74-331M | 330 | 20% | 100KHz | 40 @ 0.796MHz | 1.860 | 0.56 | 0.32 |
| SDRI74-391M | 390 | 20% | 100KHz | 40 @ 0.796MHz | 2.850 | 0.45 | 0.29 |
| SDRI74-471M | 470 | 20% | 100KHz | 40 @ 0.796MHz | 3.010 | 0.45 | 0.26 |
| SDRI74-561M | 560 | 20% | 100KHz | 40 @ 0.796MHz | 3.620 | 0.43 | 0.23 |
| SDRI74-681M | 680 | 20% | 100KHz | 40 @ 0.796MHz | 4.630 | 0.37 | 0.22 |
| SDRI74-821M | 820 | 20% | 100KHz | 40 @ 0.796MHz | 5.200 | 0.35 | 0.20 |
| SDRI74-102M | 1000 | 20% | 100KHz | 40 @ 0.796MHz | 6.000 | 0.33 | 0.18 |
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
- Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension H (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI74 | 16 | 12 | 11.5 | 16.5 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm. Speed: 1.0mm/s. Keep time: 101s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test (force varies by terminal diameter). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency 10 to 55 Hz and return to 10 Hz in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles: (85~125) for T time, rush to (-55~40) for T time. Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Peak temperature: 260+0/-5. Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands due to oil secretions. Handle products carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is applied.
- Non-Magnetic Shield Type: Carefully lay out the coil on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina