LanTu Micro SDRI129-100MT Power Inductor Suitable for Power Supply Applications and Electronic Devices
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SDRI129 Series
- Type: Shielded SMD Power Inductors (Closed magnetic circuit SMD inductors)
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (T), Tape & Reel (B)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | DCR () Max @ 0A | Saturation Current (A) Max | Temperature Rise Current (A) Max | External Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SDRI129-1R0N | 1.0 | 30% | 100KHz | 0.0060 | 19.90 | 11.60 | 12.512.510.0 |
| SDRI129-1R8N | 1.8 | 30% | 100KHz | 0.0075 | 13.40 | 11.00 | 12.512.510.0 |
| SDRI129-2R2N | 2.2 | 30% | 100KHz | 0.0090 | 12.20 | 10.30 | 12.512.510.0 |
| SDRI129-3R3N | 3.3 | 30% | 100KHz | 0.010 | 12.00 | 9.00 | 12.512.510.0 |
| SDRI129-4R7N | 4.7 | 30% | 100KHz | 0.012 | 10.08 | 8.50 | 12.512.510.0 |
| SDRI129-5R6N | 5.6 | 30% | 100KHz | 0.014 | 9.50 | 8.00 | 12.512.510.0 |
| SDRI129-6R8N | 6.8 | 30% | 100KHz | 0.015 | 8.56 | 7.90 | 12.512.510.0 |
| SDRI129-8R2N | 8.2 | 30% | 100KHz | 0.017 | 8.48 | 7.30 | 12.512.510.0 |
| SDRI129-100M | 10 | 20% | 1KHz | 0.018 | 7.12 | 6.95 | 12.512.510.0 |
| SDRI129-120M | 12 | 20% | 1KHz | 0.022 | 7.04 | 6.20 | 12.512.510.0 |
| SDRI129-150M | 15 | 20% | 1KHz | 0.032 | 5.84 | 5.22 | 12.512.510.0 |
| SDRI129-180M | 18 | 20% | 1KHz | 0.035 | 5.50 | 5.10 | 12.512.510.0 |
| SDRI129-220M | 22 | 20% | 1KHz | 0.038 | 5.12 | 4.95 | 12.512.510.0 |
| SDRI129-270M | 27 | 20% | 1KHz | 0.040 | 5.00 | 4.20 | 12.512.510.0 |
| SDRI129-330M | 33 | 20% | 1KHz | 0.052 | 4.25 | 3.60 | 12.512.510.0 |
| SDRI129-390M | 39 | 20% | 1KHz | 0.066 | 4.20 | 3.50 | 12.512.510.0 |
| SDRI129-470M | 47 | 20% | 1KHz | 0.072 | 3.60 | 3.45 | 12.512.510.0 |
| SDRI129-560M | 56 | 20% | 1KHz | 0.090 | 2.85 | 2.95 | 12.512.510.0 |
| SDRI129-680M | 68 | 20% | 1KHz | 0.102 | 2.76 | 2.85 | 12.512.510.0 |
| SDRI129-820M | 82 | 20% | 1KHz | 0.112 | 2.62 | 2.60 | 12.512.510.0 |
| SDRI129-101M | 100 | 20% | 1KHz | 0.126 | 2.31 | 2.45 | 12.512.510.0 |
| SDRI129-121M | 120 | 20% | 1KHz | 0.154 | 2.05 | 2.20 | 12.512.510.0 |
| SDRI129-151M | 150 | 20% | 1KHz | 0.174 | 1.80 | 1.90 | 12.512.510.0 |
| SDRI129-181M | 180 | 20% | 1KHz | 0.191 | 1.66 | 1.86 | 12.512.510.0 |
| SDRI129-221M | 220 | 20% | 1KHz | 0.246 | 1.64 | 1.72 | 12.512.510.0 |
| SDRI129-271M | 270 | 20% | 1KHz | 0.330 | 1.35 | 1.50 | 12.512.510.0 |
| SDRI129-331M | 330 | 20% | 1KHz | 0.386 | 1.28 | 1.28 | 12.512.510.0 |
| SDRI129-391M | 390 | 20% | 1KHz | 0.440 | 1.20 | 1.27 | 12.512.510.0 |
| SDRI129-471M | 470 | 20% | 1KHz | 0.471 | 1.06 | 1.25 | 12.512.510.0 |
| SDRI129-561M | 560 | 20% | 1KHz | 0.650 | 1.01 | 0.98 | 12.512.510.0 |
| SDRI129-681M | 680 | 20% | 1KHz | 0.730 | 0.83 | 0.96 | 12.512.510.0 |
| SDRI129-821M | 820 | 20% | 1KHz | 0.824 | 0.81 | 0.94 | 12.512.510.0 |
| SDRI129-102M | 1000 | 20% | 1KHz | 1.220 | 0.70 | 0.78 | 12.512.510.0 |
| SDRI129-122M | 1200 | 20% | 1KHz | 1.330 | 0.64 | 0.79 | 12.512.510.0 |
| SDRI129-152M | 1500 | 20% | 1KHz | 1.990 | 0.56 | 0.58 | 12.512.510.0 |
| SDRI129-182M | 1800 | 20% | 1KHz | 2.180 | 0.48 | 0.54 | 12.512.510.0 |
| SDRI129-222M | 2200 | 20% | 1KHz | 2.580 | 0.43 | 0.52 | 12.512.510.0 |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284A+42841A or equivalent
- DCR: Chroma 16502 or equivalent
Definitions:
- Saturation Current: DC current at which inductance drops 25% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging Details
| Part No. | Tape Dimension (mm) W | Tape Dimension (mm) P | Tape Dimension (mm) H | Reel Dimensions (mm) A | Reel Dimensions (mm) B | Reel Dimensions (mm) C | Reel Dimensions (mm) D | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI129 | 24 | 16 | 11.5 | 24.4 | - | - | - | 100 | 13 | 330 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Force applied to terminal for 10 sec. Solder paste thickness: 0.12mm. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (0.35mm to >1.25mm) for 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in specified direction, Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration Test | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to test jig, subjected to simple harmonic motion (10-55 Hz) for 2 hours in 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristic is normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Always preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow for sufficient thermal design margin as products self-heat when powered on.
- Non-Magnetic Shield Type: Carefully configure the coil on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina