Shielded SMD Power Inductors LanTu Micro SDRI129-680MT Ideal for DC DC Converters and Portable Communication
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Product Description
Product Overview
The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current, and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting. The series offers a wide range of inductance values and package sizes, complying with RoHS, Halogen Free, and REACH standards. They are ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRI129
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Design: Closed magnetic circuit design
- Mounting Type: SMD (Surface Mount Device)
- Origin: SHENZHEN, China
Technical Specifications
General Specifications:
| Item | Specification | Test Method/Remarks |
|---|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) | |
| Inductance Measurement | HP4284A, HP4285A LCR meter or equivalent | @ 0A |
| Saturation Current (Isat) Measurement | HP4284A+42841A or equivalent | DC current at which inductance drops 25% from its value without current. |
| Temperature Rise Current (Irms) Measurement | HP4284A+42841A or equivalent | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| DC Resistance (DCR) Measurement | Chroma 16502 or equivalent | |
| Rated DC Current | The lesser of Isat or Irms |
Dimensions:
| Part No. | External Dimensions (LWH) (mm) |
|---|---|
| SDRI129 | 12.5 Max 12.5 Max 10.0 Max |
Product Identification Example: SDRI 129 220 M T
| Component | Description |
|---|---|
| SDRI | Type |
| 129 | Series/Dimensions |
| 220 | Inductance (22 uH) |
| M | Inductance Tolerance (20%) |
| T | Packing (Tape & Reel) |
Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Options: B (Bulk Package), T (Tape & Reel)
Electrical Characteristics:
| Part No. | Inductance L(H) | Tole | Test Freq | DCR () Max @0A | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|
| SDRI129-1R0N | 1.0 | 30% | 100KHz | 0.0060 | 19.90 | 11.60 |
| SDRI129-1R8N | 1.8 | 30% | 100KHz | 0.0075 | 13.40 | 11.00 |
| SDRI129-2R2N | 2.2 | 30% | 100KHz | 0.0090 | 12.20 | 10.30 |
| SDRI129-3R3N | 3.3 | 30% | 100KHz | 0.010 | 12.00 | 9.00 |
| SDRI129-4R7N | 4.7 | 30% | 100KHz | 0.012 | 10.08 | 8.50 |
| SDRI129-5R6N | 5.6 | 30% | 100KHz | 0.014 | 9.50 | 8.00 |
| SDRI129-6R8N | 6.8 | 30% | 100KHz | 0.015 | 8.56 | 7.90 |
| SDRI129-8R2N | 8.2 | 30% | 100KHz | 0.017 | 8.48 | 7.30 |
| SDRI129-100M | 10 | 20% | 100KHz | 0.018 | 7.12 | 6.95 |
| SDRI129-120M | 12 | 20% | 1KHz | 0.022 | 7.04 | 6.20 |
| SDRI129-150M | 15 | 20% | 1KHz | 0.032 | 5.84 | 5.22 |
| SDRI129-180M | 18 | 20% | 1KHz | 0.035 | 5.50 | 5.10 |
| SDRI129-220M | 22 | 20% | 1KHz | 0.038 | 5.12 | 4.95 |
| SDRI129-270M | 27 | 20% | 1KHz | 0.040 | 5.00 | 4.20 |
| SDRI129-330M | 33 | 20% | 1KHz | 0.052 | 4.25 | 3.60 |
| SDRI129-390M | 39 | 20% | 1KHz | 0.066 | 4.20 | 3.50 |
| SDRI129-470M | 47 | 20% | 1KHz | 0.072 | 3.60 | 3.45 |
| SDRI129-560M | 56 | 20% | 1KHz | 0.090 | 2.85 | 2.95 |
| SDRI129-680M | 68 | 20% | 1KHz | 0.102 | 2.76 | 2.85 |
| SDRI129-820M | 82 | 20% | 1KHz | 0.112 | 2.62 | 2.60 |
| SDRI129-101M | 100 | 20% | 1KHz | 0.126 | 2.31 | 2.45 |
| SDRI129-121M | 120 | 20% | 1KHz | 0.154 | 2.05 | 2.20 |
| SDRI129-151M | 150 | 20% | 1KHz | 0.174 | 1.80 | 1.90 |
| SDRI129-181M | 180 | 20% | 1KHz | 0.191 | 1.66 | 1.86 |
| SDRI129-221M | 220 | 20% | 1KHz | 0.246 | 1.64 | 1.72 |
| SDRI129-271M | 270 | 20% | 1KHz | 0.330 | 1.35 | 1.50 |
| SDRI129-331M | 330 | 20% | 1KHz | 0.386 | 1.28 | 1.28 |
| SDRI129-391M | 390 | 20% | 1KHz | 0.440 | 1.20 | 1.27 |
| SDRI129-471M | 470 | 20% | 1KHz | 0.471 | 1.06 | 1.25 |
| SDRI129-561M | 560 | 20% | 1KHz | 0.650 | 1.01 | 0.98 |
| SDRI129-681M | 680 | 20% | 1KHz | 0.730 | 0.83 | 0.96 |
| SDRI129-821M | 820 | 20% | 1KHz | 0.824 | 0.81 | 0.94 |
| SDRI129-102M | 1000 | 20% | 1KHz | 1.220 | 0.70 | 0.78 |
| SDRI129-122M | 1200 | 20% | 1KHz | 1.330 | 0.64 | 0.79 |
| SDRI129-152M | 1500 | 20% | 1KHz | 1.990 | 0.56 | 0.58 |
| SDRI129-182M | 1800 | 20% | 1KHz | 2.180 | 0.48 | 0.54 |
| SDRI129-222M | 2200 | 20% | 1KHz | 2.580 | 0.43 | 0.52 |
Packaging Details:
| Part No. | Tape Dimension (mm) W | Tape Dimension (mm) P | Tape Dimension (mm) H | Reel Dimensions (mm) A | Reel Dimensions (mm) B | Reel Dimensions (mm) C | Reel Dimensions (mm) D | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI129 | 24 | 16 | 11.5 | 330 | 100 | 13 | 400 | 800 | 3200 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on sectional area of terminal; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Applied force based on terminal diameter (d); Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig; Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance; No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration Test | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Solder to testing jig; Harmonic motion 10 to 55 Hz; Applied for 2 hours in each 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125); Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10% | Refer to reflow curve, twice; Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent for 50.5Min, drying for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire; Characteristic is normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown; Characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the soldering equipment. Adjust and confirm according to user's environment/equipment.
Reminders for Using These Products:
- Storage period: within 12 months; Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact company if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance deterioration, or lifespan shortening.
- Allow sufficient margin for thermal design due to self-heating when power is ON.
- For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina