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Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR6028-150MT for EMI Resistance Applications

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Product Description

Product Overview

The SNR6028 Series is an automatically assembled, magnetic resin shielded SMD power inductor designed for efficient power conversion. Its key features include a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels, large current handling capability with low DC resistance, and a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance. This space-saving and power-efficient component is suitable for a wide range of applications, including LED backlighting, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphics cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, and telecommunication base stations.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR6028
  • Construction: Magnetic Resin Shielded SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Assembly: Automatic Assembly
  • Magnetic Circuit: Closed Magnetic Circuit Design
  • Shielding: Magnetic Resin Shielded

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Frequency (KHz) Voltage (V) DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH mm)
SNR6028-R68M 0.68 20% 100 1.0 0.010 0.013 6.90 5.20 6.06.03.0
SNR6028-1R0M 1.0 20% 100 1.0 0.010 0.013 5.75 5.20 6.06.03.0
SNR6028-1R5M 1.5 20% 100 1.0 0.013 0.016 5.50 4.58 6.06.03.0
SNR6028-2R2M 2.2 20% 100 1.0 0.020 0.026 5.10 3.75 6.06.03.0
SNR6028-3R3M 3.3 20% 100 1.0 0.025 0.032 4.15 3.48 6.06.03.0
SNR6028-4R7M 4.7 20% 100 1.0 0.030 0.039 3.00 3.08 6.06.03.0
SNR6028-6R8M 6.8 20% 100 1.0 0.047 0.061 2.60 2.40 6.06.03.0
SNR6028-8R2M 8.2 20% 100 1.0 0.055 0.071 2.30 2.25 6.06.03.0
SNR6028-100M 10 30% 100 1.0 0.074 0.093 2.04 1.95 6.06.03.0
SNR6028-120M 12 30% 100 1.0 0.080 0.104 1.80 1.85 6.06.03.0
SNR6028-150M 15 30% 100 1.0 0.125 0.162 1.75 1.45 6.06.03.0
SNR6028-180M 18 30% 100 1.0 0.120 0.169 1.52 1.45 6.06.03.0
SNR6028-220M 22 30% 100 1.0 0.140 0.182 1.45 1.40 6.06.03.0
SNR6028-330M 33 20% 100 1.0 0.185 0.240 1.35 1.22 6.06.03.0
SNR6028-390M 39 20% 100 1.0 0.225 0.292 1.25 1.10 6.06.03.0
SNR6028-470M 47 20% 100 1.0 0.315 0.400 1.15 1.06 6.06.03.0
SNR6028-680M 68 20% 100 1.0 0.360 0.468 0.80 0.86 6.06.03.0
SNR6028-820M 82 20% 100 1.0 0.500 0.650 0.75 0.70 6.06.03.0
SNR6028-101M 100 20% 100 1.0 0.550 0.675 0.65 0.70 6.06.03.0
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
External Dimensions (LWH): 6.06.03.0 mm
Saturation Current: DC current at which inductance drops 30% from its value without current.
Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.

Packaging

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SNR6028 16 12 7.5 16.4 100 13 330 2000 6000 24,000

Reliability Testing

Test Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet specified force and duration requirements without loose terminals. Pulling test based on GB/T 2423.60-2008. Solder to jig with lead-free solder, apply force.
Terminal Strength (DIP) Meet specified force and duration requirements without loose terminals. Pulling test based on GB/T 2423.60-2008. Force applied gradually and maintained for 10 seconds.
Resistance to Flexure No visible mechanical damage. Solder to test jig, apply flexure (2mm) at 0.5mm/sec for 30 sec. (JIS C 5321:1997)
Dropping Test No case deformation or appearance change; no short/open. Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction. (GB/T 2423.7-2018)
Solderability Wetting > 75% coverage; Terminals 95% solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol. (GB/T 2423.28-2005)
Vibration Test No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. Solder to jig, subjected to harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 perpendicular directions. (GB/T 2423.10-2019)
Thermal Shock No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. 100 cycles of temperature shock (-55~40 to 85~125), max 20 sec transforming interval. (GB/T 2423.22-2012 Method Na)
Low Temperature Storage No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. Temperature: -55~-402 for 962 hours. (GB/T 2423.1-2008 Method Ab)
High Temperature Storage No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. Temperature: 85~1252 for 962 hours. (GB/T 2423.2-2008 Method Bb)
Damp Heat (Steady States) No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. Temperature: 602, Humidity: 90%-95% RH for 962 hours. (GB/T 2423.3-2016)
Heat Endurance of Reflow Soldering No significant defects; L/L 10%; Q/Q 30%; DCR/DCR 10%. Refer to reflow curve, twice. Peak temperature: 260+0/-5. (GJB 360B-2009)
Resistance to Solvent Test No case deformation, appearance change, or marking obliteration. Dip in IPA solvent for 50.5 min, dry 5 min, brush 10 times. (IEC 68-2-45:1993)
Overload Test No smoke, peculiar smell, or fire during test; characteristics normal after test. Apply twice rated current for 5 minutes. (JIS C5311-6.13)
Voltage Resistance Test No breakdown during test; characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min. (MIL-STD-202G Method 301)

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Usage Reminders

  • Storage: Within 12 months, under 5~40C and 35~65% RH. Prolonged storage may degrade terminal solderability.
  • Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle with care to prevent damage from dropping.
  • Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Keep away from magnets or magnetic objects.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
  • Non-Shielded Type Layout: Carefully lay out coils on the circuit board for non-magnetic shield types to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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