Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR6028-150MT for EMI Resistance Applications
Product Overview
The SNR6028 Series is an automatically assembled, magnetic resin shielded SMD power inductor designed for efficient power conversion. Its key features include a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels, large current handling capability with low DC resistance, and a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance. This space-saving and power-efficient component is suitable for a wide range of applications, including LED backlighting, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphics cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, and telecommunication base stations.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR6028
- Construction: Magnetic Resin Shielded SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Assembly: Automatic Assembly
- Magnetic Circuit: Closed Magnetic Circuit Design
- Shielding: Magnetic Resin Shielded
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Frequency (KHz) | Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR6028-R68M | 0.68 | 20% | 100 | 1.0 | 0.010 | 0.013 | 6.90 | 5.20 | 6.06.03.0 |
| SNR6028-1R0M | 1.0 | 20% | 100 | 1.0 | 0.010 | 0.013 | 5.75 | 5.20 | 6.06.03.0 |
| SNR6028-1R5M | 1.5 | 20% | 100 | 1.0 | 0.013 | 0.016 | 5.50 | 4.58 | 6.06.03.0 |
| SNR6028-2R2M | 2.2 | 20% | 100 | 1.0 | 0.020 | 0.026 | 5.10 | 3.75 | 6.06.03.0 |
| SNR6028-3R3M | 3.3 | 20% | 100 | 1.0 | 0.025 | 0.032 | 4.15 | 3.48 | 6.06.03.0 |
| SNR6028-4R7M | 4.7 | 20% | 100 | 1.0 | 0.030 | 0.039 | 3.00 | 3.08 | 6.06.03.0 |
| SNR6028-6R8M | 6.8 | 20% | 100 | 1.0 | 0.047 | 0.061 | 2.60 | 2.40 | 6.06.03.0 |
| SNR6028-8R2M | 8.2 | 20% | 100 | 1.0 | 0.055 | 0.071 | 2.30 | 2.25 | 6.06.03.0 |
| SNR6028-100M | 10 | 30% | 100 | 1.0 | 0.074 | 0.093 | 2.04 | 1.95 | 6.06.03.0 |
| SNR6028-120M | 12 | 30% | 100 | 1.0 | 0.080 | 0.104 | 1.80 | 1.85 | 6.06.03.0 |
| SNR6028-150M | 15 | 30% | 100 | 1.0 | 0.125 | 0.162 | 1.75 | 1.45 | 6.06.03.0 |
| SNR6028-180M | 18 | 30% | 100 | 1.0 | 0.120 | 0.169 | 1.52 | 1.45 | 6.06.03.0 |
| SNR6028-220M | 22 | 30% | 100 | 1.0 | 0.140 | 0.182 | 1.45 | 1.40 | 6.06.03.0 |
| SNR6028-330M | 33 | 20% | 100 | 1.0 | 0.185 | 0.240 | 1.35 | 1.22 | 6.06.03.0 |
| SNR6028-390M | 39 | 20% | 100 | 1.0 | 0.225 | 0.292 | 1.25 | 1.10 | 6.06.03.0 |
| SNR6028-470M | 47 | 20% | 100 | 1.0 | 0.315 | 0.400 | 1.15 | 1.06 | 6.06.03.0 |
| SNR6028-680M | 68 | 20% | 100 | 1.0 | 0.360 | 0.468 | 0.80 | 0.86 | 6.06.03.0 |
| SNR6028-820M | 82 | 20% | 100 | 1.0 | 0.500 | 0.650 | 0.75 | 0.70 | 6.06.03.0 |
| SNR6028-101M | 100 | 20% | 100 | 1.0 | 0.550 | 0.675 | 0.65 | 0.70 | 6.06.03.0 |
| Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packing Codes: B: Bulk Package, T: Tape & Reel | |||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||||
| External Dimensions (LWH): 6.06.03.0 mm | |||||||||
| Saturation Current: DC current at which inductance drops 30% from its value without current. | |||||||||
| Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||||
| Rated DC Current: The lesser value of Isat or Irms. | |||||||||
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR6028 | 16 | 12 | 7.5 | 16.4 | 100 | 13 | 330 | 2000 | 6000 | 24,000 |
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force and duration requirements without loose terminals. | Pulling test based on GB/T 2423.60-2008. Solder to jig with lead-free solder, apply force. |
| Terminal Strength (DIP) | Meet specified force and duration requirements without loose terminals. | Pulling test based on GB/T 2423.60-2008. Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply flexure (2mm) at 0.5mm/sec for 30 sec. (JIS C 5321:1997) |
| Dropping Test | No case deformation or appearance change; no short/open. | Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction. (GB/T 2423.7-2018) |
| Solderability | Wetting > 75% coverage; Terminals 95% solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol. (GB/T 2423.28-2005) |
| Vibration Test | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Solder to jig, subjected to harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 perpendicular directions. (GB/T 2423.10-2019) |
| Thermal Shock | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | 100 cycles of temperature shock (-55~40 to 85~125), max 20 sec transforming interval. (GB/T 2423.22-2012 Method Na) |
| Low Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Temperature: -55~-402 for 962 hours. (GB/T 2423.1-2008 Method Ab) |
| High Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Temperature: 85~1252 for 962 hours. (GB/T 2423.2-2008 Method Bb) |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Temperature: 602, Humidity: 90%-95% RH for 962 hours. (GB/T 2423.3-2016) |
| Heat Endurance of Reflow Soldering | No significant defects; L/L 10%; Q/Q 30%; DCR/DCR 10%. | Refer to reflow curve, twice. Peak temperature: 260+0/-5. (GJB 360B-2009) |
| Resistance to Solvent Test | No case deformation, appearance change, or marking obliteration. | Dip in IPA solvent for 50.5 min, dry 5 min, brush 10 times. (IEC 68-2-45:1993) |
| Overload Test | No smoke, peculiar smell, or fire during test; characteristics normal after test. | Apply twice rated current for 5 minutes. (JIS C5311-6.13) |
| Voltage Resistance Test | No breakdown during test; characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (MIL-STD-202G Method 301) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Usage Reminders
- Storage: Within 12 months, under 5~40C and 35~65% RH. Prolonged storage may degrade terminal solderability.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle with care to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Non-Shielded Type Layout: Carefully lay out coils on the circuit board for non-magnetic shield types to prevent malfunctions due to magnetic interference.
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