Product Overview

The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR, featuring a close magnetic circuit design to minimize leakage. These inductors offer high-accuracy dimensions suitable for automatic mounting, available in various package sizes and a wide inductance range. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Series: SDRH104R Series
• Type: Shielded SMD Power Inductors
• Magnetic Circuit Design: Close magnetic circuit design
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: SHENZHEN, China

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A or HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification:

• Format: SDRH 104R [Inductance Value] [Tolerance Code] [Packing Code]
• Example: SDRH104R100NT (SDRH104R Series, 10 H, 30% Tolerance, Tape & Reel Packing)

Packing:

• Packing Options: Bulk Package (B), Tape & Reel (T)
• Tape and Reel Specifications: (Dimensions are in mm)
• Reel Dimensions: (mm)
• Tape Dimension: (mm)
• Cover tape peel off condition:
• a) Cover tape peel force: 10 to 120g
• b) Noodle strip peeling angle: 165 to 180
• Packing quantity:

Part No.	Tape Dimension W (mm)	P (mm)	W1 (mm)	Reel Dimensions A (mm)	B (mm)	C (mm)	D (mm)	REEL (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SDRH104R	24	16	11.5	24.4	60	13	330	1000	2000	8000

Reliability Testing:

• Terminal Strength: Meets specified force requirements without loose terminals.
• Resistance to Flexure: No visible mechanical damage; meets specified flexure and speed requirements.
• Dropping: No case deformation or appearance change; no short/open circuits after specified drops.
• Solderability: Meets wetting and solder coverage requirements after specified solder temperature and duration.
• Vibration: No visible mechanical damage; inductance and Q factor changes within specified limits.
• Thermal Shock: No visible mechanical damage; inductance and Q factor changes within specified limits after specified cycles.
• Low temperature Storage: No visible mechanical damage; inductance and Q factor changes within specified limits after specified duration and temperature.
• High temperature Storage: No visible mechanical damage; inductance and Q factor changes within specified limits after specified duration and temperature.
• Damp Heat (Steady States): No visible mechanical damage; inductance and Q factor changes within specified limits after specified duration, temperature, and humidity.
• Heat endurance of Reflow soldering: No significant defects; inductance, Q factor, and DCR changes within specified limits after reflow soldering.
• Resistance to solvent test: No case deformation, appearance change, or obliteration of marking after dipping and brushing in IPA solvent.
• Overload test: No smoke, peculiar smell, or fire during test; characteristics normal after test.
• Voltage resistance test: No breakdown during test; characteristics normal after test.

Recommended reflow soldering curve: The recommended reflow conditions should be adjusted and confirmed according to user's environment/equipment.

Reminders for Using These Products:

• Storage: Within 12 months, under 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
• Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping.
• Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
• Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
• Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
• Layout (Non-magnetic Shielded Type): Carefully configure coils on the circuit board to prevent malfunctions due to magnetic interference.