Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Molding SMD power inductors LanTu Micro SMS1040 150MT with integral construction and low buzz noise

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Product Description

Molding SMD Power Inductors - SMS1040 Series

Product Overview

The SMS1040 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current, thin-profile SMD power inductors designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors boast high reliability due to their integral construction, providing excellent vibration resistance. Their composite structure contributes to ultra-low buzz noise, while the use of low-loss alloy powder in a die-casting process ensures low impedance and small parasitic capacitance, leading to high efficiency. Suitable for applications up to 3MHz, they are ideal for PDAs, notebooks, desktops, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: LANTU MICRO
  • Manufacturer: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS1040
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: China

Technical Specifications

Part No Inductance (H) Inductance Tolerance Test Frequency (100KHz, 1.0V) DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical Dimensions (LWH) (mm) Absolute Maximum Voltage (VDC) Operating Temperature (C)
SMS1040-R22M 0.22 20% 1.2 1.5 60.00 35.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-R36M 0.36 20% 1.7 1.9 50.00 30.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-R47M 0.47 20% 1.9 2.2 40.00 30.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-R56M 0.56 20% 2.1 2.4 33.00 25.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-R68M 0.68 20% 2.3 3.0 30.00 23.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-1R0M 1.0 20% 3.0 4.0 28.00 18.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-1R5M 1.5 20% 4.8 5.4 23.00 16.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-2R2M 2.2 20% 7.2 9.0 18.00 12.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-3R3M 3.3 20% 10.8 11.8 16.00 10.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-4R7M 4.7 20% 17.0 20.0 15.00 8.50 11.5x10.0x4.0 30 -55 to +125
SMS1040-5R6M 5.6 20% 20.5 23.0 13.00 8.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-6R8M 6.8 20% 22.5 25.0 12.00 7.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-100M 10 20% 34.0 37.0 8.50 5.50 11.5x10.0x4.0 30 -55 to +125
SMS1040-150M 15 20% 50.0 55.0 7.00 5.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-220M 22 20% 60.0 66.0 6.00 4.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-330M 33 20% 85.0 92.0 5.00 3.50 11.5x10.0x4.0 30 -55 to +125
SMS1040-470M 47 20% 141.0 155.0 4.50 3.00 11.5x10.0x4.0 30 -55 to +125
SMS1040-680M 68 20% 200.0 220.0 3.80 2.30 11.5x10.0x4.0 30 -55 to +125
SMS1040-101M 100 20% 237.0 290.0 3.00 2.00 11.5x10.0x4.0 30 -55 to +125

Shape and Dimensions

Part No A (Max) B (0.30) C (Max) D (Typ) E (Typ) F G H
SMS1040 11.50 10.00 4.00 3.00 2.00 4.10 13.60 5.40

Inductance Tolerance Codes

J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packaging

Bulk Package

Tape & Reel Package

Part No Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS1040 24.0 16.0 11.5 24.4 100 13 330 1000 2000 8000

Reminders for Using These Products

  • Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
  • Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering.
  • Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils; contact SXN if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance deterioration, or lifespan shortening.
  • Ensure sufficient thermal design margin for self-heating when power is on.
  • For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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