High Current SMD Power Inductor LanTu Micro SNR5020-4R7MT with Magnetic Resin Shielding and Low Noise
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Product Description
Product Overview
The SNR5020 Series is an automatic assembly, magnetic resin shielded SMD power inductor designed for high-current applications with low DC resistance. Its closed magnetic circuit design minimizes leakage flux and EMI, while the magnetic-resin shielding effectively reduces buzz noise to ultra-low levels. This series offers space and power savings, making it suitable for a wide range of electronic devices including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SNR5020 Series
- Construction: Magnetic Resin Shielded, Automatic Assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) | Packing |
|---|---|---|---|---|---|---|---|---|
| SNR5020-R47M | 0.47 | 20% | 0.017 | 0.021 | 4.50 | 4.60 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-1R0M | 1.0 | 20% | 0.020 | 0.025 | 4.10 | 3.80 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-1R5M | 1.5 | 20% | 0.026 | 0.032 | 3.80 | 3.20 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-2R2M | 2.2 | 20% | 0.032 | 0.040 | 3.20 | 2.90 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-3R3M | 3.3 | 20% | 0.043 | 0.054 | 2.55 | 2.50 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-3R9M | 3.9 | 20% | 0.043 | 0.054 | 2.30 | 2.50 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-4R7M | 4.7 | 20% | 0.057 | 0.074 | 2.40 | 2.20 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-6R8M | 6.8 | 20% | 0.083 | 0.107 | 2.05 | 1.80 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-8R2M | 8.2 | 20% | 0.098 | 0.125 | 1.85 | 1.65 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-100M | 10 | 20% | 0.110 | 0.140 | 1.70 | 1.55 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-120M | 12 | 20% | 0.140 | 0.180 | 1.50 | 1.40 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-150M | 15 | 20% | 0.165 | 0.210 | 1.35 | 1.25 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-220M | 22 | 20% | 0.226 | 0.290 | 1.15 | 1.10 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-330M | 33 | 20% | 0.390 | 0.500 | 0.95 | 0.90 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-470M | 47 | 20% | 0.523 | 0.670 | 0.77 | 0.77 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-680M | 68 | 20% | 0.740 | 1.050 | 0.72 | 0.64 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-820M | 82 | 20% | 1.000 | 1.280 | 0.66 | 0.50 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-101M | 100 | 20% | 1.100 | 1.480 | 0.57 | 0.53 | 5.05.02.0 | T (Tape & Reel) |
| SNR5020-121M | 120 | 20% | 1.350 | 1.700 | 0.49 | 0.40 | 5.05.02.0 | T (Tape & Reel) |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Dimensions
External Dimensions (LWH): 5.05.02.0 mm
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) | |
|---|---|---|---|---|---|---|---|---|---|
| SNR5020 | 5.00.3 | 5.00.3 | 2.0 Max | 2.50.2 | 4.00.2 | 1.4 Typ | 2.3 Typ | 4.2 Typ | N/A |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull Force test based on GB/T 2423.60-2008, varying force based on terminal diameter. Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration Test | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10 to 55 Hz, 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat Endurance of Reflow Soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Performed twice according to recommended reflow curve. Peak temperature: 260+0/-5. |
| Resistance to Solvent Test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload Test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage Resistance Test | During the test no breakdown. Characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals to prevent soldering issues. Handle carefully to prevent damage.
- Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils without contacting the manufacturer.
- Magnetism: Keep away from magnets or magnetic fields.
- Preheating: Ensure preheating before soldering, with a temperature difference not exceeding 150C between solder and chip.
- Post-Mounting Correction: Perform soldering corrections within specified conditions to avoid performance degradation.
- Thermal Design: Allow sufficient margin for self-heating when power is applied.
- Layout: For non-magnetic shielded types, careful coil placement on the PCB is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina