LanTu Micro SMS0630 1R5MT molding SMD power inductors suitable for PDA notebooks desktops and servers
Molding SMD Power Inductors - SMS0630 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0630 Series ultra-high current SMD power inductors are designed for high-density installations requiring low DC resistance and ultra-high current capabilities. Featuring a thin, magnetically shielded design, these inductors offer strong anti-electromagnetic interference and excellent vibration resistance due to their integral construction. They provide ultra-low buzz noise and low loss through a composite structure and die-casting with low-loss alloy powder, resulting in low impedance and small parasitic capacitance for high efficiency. Suitable for frequencies up to 3MHz, these inductors are ideal for applications such as PDA, notebooks, desktops, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN
- Product Type: Molding SMD Power Inductor
- Series: SMS0630
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) | Absolute Maximum Voltage (VDC) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|---|
| SMS0630-R10M | 0.10 | 20% | 1.40 | 2.20 | 60.00 | 32.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-R15M | 0.15 | 20% | 1.55 | 2.30 | 41.00 | 30.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-R22M | 0.22 | 20% | 1.60 | 3.00 | 35.00 | 25.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-R47M | 0.47 | 20% | 4.00 | 4.50 | 20.00 | 18.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-R68M | 0.68 | 20% | 4.75 | 5.30 | 19.00 | 16.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-1R0M | 1.0 | 20% | 7.60 | 8.00 | 16.00 | 13.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-1R5M | 1.5 | 20% | 13.20 | 16.00 | 14.00 | 12.50 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-2R2M | 2.2 | 20% | 16.50 | 20.00 | 11.50 | 8.50 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-3R3M | 3.3 | 20% | 24.50 | 35.00 | 9.50 | 7.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-4R7M | 4.7 | 20% | 35.00 | 40.00 | 6.55 | 6.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-5R6M | 5.6 | 20% | 36.00 | 42.00 | 6.35 | 5.70 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-6R8M | 6.8 | 20% | 44.30 | 48.00 | 6.00 | 5.10 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-8R2M | 8.2 | 20% | 60.00 | 64.90 | 6.00 | 5.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-100M | 10 | 20% | 64.50 | 75.00 | 5.50 | 4.50 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-150M | 15 | 20% | 103.00 | 115.00 | 4.50 | 3.10 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-220M | 22 | 20% | 180.00 | 200.00 | 3.50 | 2.60 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-330M | 33 | 20% | 250.00 | 270.00 | 3.00 | 2.00 | 7.16.63.0 | 30 | -55 to +125 |
| SMS0630-470M | 47 | 20% | 310.00 | 385.00 | 2.00 | 1.50 | 7.16.63.0 | 30 | -55 to +125 |
Note on Current Ratings:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
- Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS0630 | 7.100.30 | 6.600.20 | 3.00 Max | 3.00 Typ | 1.60 Typ | 3.70 | 8.40 | 3.50 |
Inductance Tolerance
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packaging
Tape & Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0630 | 16.0 | 12.0 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Cover Tape Peel Off Condition:
a) Cover tape peel force: 10 to 120g
b) Noodle strip peeling angle: 165 to 180
Packing Quantity: REEL13 PE Bag. Inside Box. Outside Carton. Insufficient full cartons will be filled with inner boxes or cushioning material.
Reliability Testing
Terminal Strength:
- SMT: Pulling test based on sectional area of terminal (A): A8mm, Force5N, Time: 30sec; 8mm
Resistance to Flexure: No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping Test: No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability: No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight.
Vibration Test: No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Subjected to simple harmonic motion with total amplitude of 1.5mm, frequency varied between 10 and 55 Hz. Traversed in approx. 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total of 6 hours).
Thermal Shock Test: No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. 100 cycles of temperature change from (85~125) to (-55~40). Transforming interval: Max. 20 sec. Stabilized at normal condition for 1~2 hours.
Low Temperature Storage Test: No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours. Stabilized at normal condition for 1~2 hours.
High Temperature Storage Test: No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours. Stabilized at normal condition for 1~2 hours.
Damp Heat (Steady States) Test: No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilized at normal condition for 1~2 hours.
Heat Endurance of Reflow Soldering: No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Performed twice according to reflow curve. Peak temperature: 260+0/-5.
Resistance to Solvent Test: No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, at last, brushing making 10 times.
Overload Test: During the test, no smoke, no peculiar smell, no fire. Characteristics are normal after test. Apply twice rated current for 5 minutes.
Voltage Resistance Test: During the test, no breakdown. Characteristics are normal after test. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min.
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to our soldering equipment. Due to variations in manufacturers' equipment, products, and process conditions, please adjust and confirm according to your environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands as oil secretions may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminals: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the company if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder temperature and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance deterioration, or lifespan shortening.
- Self-Heating: Sufficient thermal design margin is required as self-heating occurs when power is ON.
- Non-Magnetic Shield Type: Carefully lay out coils for circuit board design. Malfunctions may occur due to magnetic interference.
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