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Shielded SMD Power Inductors LanTu Micro SDRH105R-221MT with RoHS Halogen Free and REACH Compliance Certifications

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Product Description

Product Overview

The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: LANTU
  • Series: SDRH105R
  • Type: Shielded SMD Power Inductors
  • Origin: SHENZHEN, China
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Magnetic Circuit Design: Closed magnetic circuit

Technical Specifications

Part No. Inductance (H) Tolerance Test Freq. DCR () Max @ 0A Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH) (mm)
SDRH105R-3R3N 3.3 30% 100KHz 0.013 9.50 6.50 10.310.55.0
SDRH105R-4R7N 4.7 30% 100KHz 0.016 9.20 6.30 10.310.55.0
SDRH105R-6R8N 6.8 30% 100KHz 0.020 7.00 6.00 10.310.55.0
SDRH105R-8R2N 8.2 30% 100KHz 0.023 5.50 5.00 10.310.55.0
SDRH105R-100N 10 30% 100KHz 0.250 5.10 4.40 10.310.55.0
SDRH105R-120N 12 30% 100KHz 0.032 4.90 4.00 10.310.55.0
SDRH105R-150N 15 30% 100KHz 0.040 4.20 3.60 10.310.55.0
SDRH105R-180M 18 20% 100KHz 0.046 3.70 3.40 10.310.55.0
SDRH105R-220M 22 20% 100KHz 0.058 3.30 3.20 10.310.55.0
SDRH105R-270M 27 20% 100KHz 0.650 3.20 3.00 10.310.55.0
SDRH105R-330M 33 20% 100KHz 0.810 2.70 2.60 10.310.55.0
SDRH105R-390M 39 20% 100KHz 0.103 2.48 2.50 10.310.55.0
SDRH105R-470M 47 20% 100KHz 0.122 2.35 2.30 10.310.55.0
SDRH105R-560M 56 20% 100KHz 0.144 2.30 2.10 10.310.55.0
SDRH105R-680M 68 20% 100KHz 0.193 2.00 1.90 10.310.55.0
SDRH105R-820M 82 20% 100KHz 0.219 1.80 1.60 10.310.55.0
SDRH105R-101M 100 20% 100KHz 0.247 1.50 1.35 10.310.55.0
SDRH105R-121M 120 20% 100KHz 0.298 1.40 1.18 10.310.55.0
SDRH105R-151M 150 20% 100KHz 0.355 1.30 1.10 10.310.55.0
SDRH105R-181M 180 20% 100KHz 0.393 1.20 1.00 10.310.55.0
SDRH105R-221M 220 20% 100KHz 0.483 1.08 0.94 10.310.55.0
SDRH105R-271M 270 20% 100KHz 0.632 0.88 0.80 10.310.55.0
SDRH105R-331M 330 20% 100KHz 0.780 0.85 0.73 10.310.55.0
SDRH105R-391M 390 20% 100KHz 0.957 0.78 0.70 10.310.55.0
SDRH105R-471M 470 20% 100KHz 1.220 0.71 0.54 10.310.55.0
SDRH105R-561M 560 20% 100KHz 1.352 0.65 0.52 10.310.55.0
SDRH105R-681M 680 20% 100KHz 1.519 0.59 0.51 10.310.55.0
SDRH105R-821M 820 20% 100KHz 1.694 0.51 0.48 10.310.55.0
SDRH105R-102M 1000 20% 100KHz 1.946 0.49 0.42 10.310.55.0

Environmental Data

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SDRH 105R [Inductance Code] [Tolerance Code] [Packing Code]

  • Type: SDRH
  • Series: 105R
  • Inductance Code Example: 100 for 10 H, 101 for 100 H
  • Tolerance Code: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • Packing Code: T (Tape & Reel), B (Bulk Package)

Shape and Dimensions

Part No. A (Max) B (Max) C (Max) D E F H I J
SDRH105R 10.3 10.5 5.0 7.7 3.0 1.2 3.6 1.7 7.3

(Dimensions are in mm)

Packaging

Tape and Reel Specifications:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRH105R 24 16 11.5 24.4 60 13 330 800 1600 6400

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Terminal Strength (SMT): Pulling test based on GB/T 2423.60-2008. Force requirements vary with terminal sectional area.

Terminal Strength (DIP): Pulling test based on GB/T 2423.60-2008. Force requirements vary with terminal diameter.

Resistance to Flexure: JIS C 5321:1997. No visible mechanical damage after applying force.

Dropping Test: GB/T 2423.7-2018. Packaged products dropped from 1m height. No case deformation, short, or open circuits.

Solderability: GB/T 2423.28-2005. Wetting shall exceed 75% coverage; terminals must have 95% minimum solder coverage.

Vibration Test: GB/T 2423.10-2019. Subjected to simple harmonic motion. Inductance change within 10%, Q factor change within 20%.

Thermal Shock Test: GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

Low Temperature Storage Test: GB/T 2423.1-2008 Method Ab. Stored at -402 for 962 hours. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

High Temperature Storage Test: GB/T 2423.2-2008 Method Bb. Stored at 852 for 962 hours. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

Damp Heat (Steady States) Test: GB/T 2423.3-2016. Tested at 602 and 90%-95% RH for 962 hours. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

Heat Endurance of Reflow Soldering: GJB 360B-2009. Tested twice with peak temperature 260+0/-5. L/L 10% (Mn-Zn: 30%), Q/Q 30%, DCR/DCR 10%.

Resistance to Solvent Test: IEC 68-2-45:1993. No case deformation or appearance change after dipping in IPA solvent and brushing.

Overload Test: JIS C5311-6.13. Applied twice the rated current for 5 minutes. No smoke, peculiar smell, or fire.

Voltage Resistance Test: MIL-STD-202G Method 301. DC1000V, 1mA for 1 min. No breakdown.

Recommended Reflow Soldering Curve

Refer to the graph for recommended reflow conditions. Adjust based on specific user equipment and process conditions.

Reminders for Using These Products

  • Storage: Within 12 months, at 5~40C and 35~65% RH.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali).
  • Handling: Avoid direct contact with terminals to prevent soldering issues. Handle carefully to prevent damage.
  • Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Keep away from magnets or magnetic objects.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform after mounting within specified conditions to avoid performance degradation or reduced lifespan.
  • Thermal Design: Account for self-heating when power is on.
  • Non-Magnetic Shield Type: Careful coil placement on the PCB is required to prevent malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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