Surface Mount Unshielded SMD Power Inductors LanTu Micro SCD5845-3R3MT RoHS Halogen Free Compliance
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Delivery Time:
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Product Description
Unshielded SMD Power Inductors - SCD5845 Series
Product Overview
The SCD5845 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers unshielded SMD power inductors designed for surface mounting. These low-cost, silver-plated inductors feature a small size with high rated current and low DC resistance. They are compliant with RoHS, Halogen Free, and REACH standards, making them suitable for a wide range of applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD5845
- Type: Unshielded SMD Power Inductors
- Design: Silver plated, Low cost
- Certifications: RoHS, Halogen Free, REACH Compliance
- Mounting Type: Surface mounting
Technical Specifications
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Current (Isat & Irms): HP4284+42841A or equivalent
- Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification Example: SCD 5845 100 M T
- Type: SCD (Unshielded SMD Power Inductors)
- Dimensions: 5845 (5.84.5 mm LWH)
- Inductance: 100 (10 H)
- Tolerance: M (20%)
- Packing: T (Tape & Reel)
External Dimensions (mm):
| Part No | A (5.80.3) | B (5.20.3) | C (4.50.35) | D (2.0) | H (5.5) | I (2.15) | J (1.7) |
|---|---|---|---|---|---|---|---|
| SCD5845 | 5.80.3 | 5.20.3 | 4.50.35 | 2.0 | 5.5 | 2.15 | 1.7 |
Electrical Characteristics:
| Part No | Inductance L (H) | Tolerance | Test Freq @0A | SRF Min (MHz) | DCR Typ () | Saturation Current Isat Max (A) | Temperature Rise Current Irms Max (A) |
|---|---|---|---|---|---|---|---|
| SCD5845-1R0M | 1.0 | M | 100KHz | 20 | 0.013 | 6.00 | 5.40 |
| SCD5845-1R5M | 1.5 | M | 100KHz | 20 | 0.017 | 5.00 | 4.70 |
| SCD5845-3R3M | 3.3 | M | 100KHz | 20 | 0.031 | 4.00 | 3.70 |
| SCD5845-4R7M | 4.7 | M | 100KHz | 20 | 0.052 | 3.50 | 3.10 |
| SCD5845-6R8M | 6.8 | M | 100KHz | 20 | 0.059 | 3.00 | 2.40 |
| SCD5845-8R2M | 8.2 | M | 100KHz | 20 | 0.062 | 2.50 | 2.00 |
| SCD5845-100M | 10 | M | 100KHz | 35 | 0.075 | 1.60 | 1.44 |
| SCD5845-120M | 12 | M | 100KHz | 35 | 0.088 | 1.45 | 1.40 |
| SCD5845-150M | 15 | M | 100KHz | 35 | 0.105 | 1.35 | 1.30 |
| SCD5845-180M | 18 | M | 100KHz | 35 | 0.117 | 1.26 | 1.23 |
| SCD5845-220M | 22 | M | 100KHz | 35 | 0.153 | 1.12 | 1.11 |
| SCD5845-270M | 27 | M | 100KHz | 35 | 0.169 | 1.04 | 0.97 |
| SCD5845-330M | 33 | M | 100KHz | 35 | 0.208 | 0.96 | 0.88 |
| SCD5845-390M | 39 | M | 100KHz | 35 | 0.215 | 0.85 | 0.80 |
| SCD5845-470M | 47 | M | 100KHz | 35 | 0.355 | 0.80 | 0.72 |
| SCD5845-560M | 56 | M | 100KHz | 35 | 0.377 | 0.72 | 0.68 |
| SCD5845-680M | 68 | M | 100KHz | 35 | 0.390 | 0.68 | 0.61 |
| SCD5845-820M | 82 | M | 100KHz | 35 | 0.416 | 0.64 | 0.58 |
| SCD5845-101M | 100 | M | 100KHz | 40 | 0.611 | 0.56 | 0.52 |
| SCD5845-121M | 120 | M | 100KHz | 40 | 0.754 | 0.52 | 0.48 |
| SCD5845-151M | 150 | M | 100KHz | 40 | 0.845 | 0.44 | 0.40 |
| SCD5845-181M | 180 | M | 100KHz | 40 | 1.040 | 0.40 | 0.38 |
| SCD5845-221M | 220 | M | 100KHz | 40 | 1.450 | 0.36 | 0.35 |
| SCD5845-331M | 330 | M | 100KHz | 40 | 1.760 | 0.34 | 0.28 |
| SCD5845-471M | 470 | M | 100KHz | 40 | 2.990 | 0.32 | 0.24 |
| SCD5845-681M | 680 | M | 100KHz | 40 | 3.900 | 0.29 | 0.20 |
| SCD5845-102M | 1000 | M | 100KHz | 40 | 5.800 | 0.26 | 0.19 |
Definitions:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Packaging:
| Part No. | Tape Dimension W (mm) | P (mm) | W1 (mm) | Reel Dimensions A (mm) | B (mm) | C (mm) | D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SCD5845 | 12 | 8 | 7.5 | 16.4 | 100 | 13 | 330 | 1500 | 4500 | 18,000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force varies by terminal diameter (5N to 40N). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | Amplitude: 1.5mm. Frequency: 10 to 55 Hz. Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (-55~40) and (85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L10%. Q/Q30%. DCR/DCR10%. | Go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Adjust and confirm according to user's environment/equipment.
Reminders for Using These Products:
- Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with electrodes by bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow for sufficient thermal design margin due to self-heating when power is on.
- For non-magnetic shield types, careful coil placement on the circuit board is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina