T-Core Molding Structure Power Inductors LanTu Micro STC201610-R22MT with Low DCR and Ultra Low AC Losses
Product Overview
The STC201610 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installations and demanding applications. Featuring a thin profile with low DC resistance and ultra-high current capabilities, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their T-core molding structure ensures high reliability and excellent vibration resistance. With extremely low DCR and ultra-low AC losses, they are ideal for high switching frequencies. These inductors comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN
- Product Type: T-core molding Structure Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Product Identification
STC 201610 1R0 M T
- Type: STC (T-CORE molding Structure Power Inductors)
- Inductance: 1.0 uH
- External Dimensions (LWH): 201610 (2.01.61.0 mm)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Shape and Dimensions
Dimensions are in mm
| Part No | A | B | C | D | E | F | H |
|---|---|---|---|---|---|---|---|
| STC201610 | 2.00.2 | 1.60.2 | 1.0Max | 0.70.2 | 2.1Typ | 0.5Typ | 1.7Typ |
Electrical Characteristics
Electrical specifications at 25
| Part No | Inductance (H) @0A | Tol | DCR (m) Typical | DCR (m) Max | Saturation Current(A) Typical | Saturation Current(A) Max | Heat Rating Current(A) Typical | Heat Rating Current(A) Max |
|---|---|---|---|---|---|---|---|---|
| STC201610-R22M | 0.22 | 20% | 11 | 18 | 8.2 | 7.5 | 6.9 | 6.3 |
| STC201610-R47M | 0.47 | 20% | 22 | 25 | 6.3 | 5.5 | 5.5 | 5.0 |
| STC201610-1R0M | 1.0 | 20% | 35 | 43 | 4.6 | 4.2 | 4.5 | 4.1 |
| STC201610-1R5M | 1.5 | 20% | 80 | 100 | 3.2 | 2.9 | 2.6 | 2.3 |
| STC201610-2R2M | 2.2 | 20% | 120 | 130 | 3.0 | 2.8 | 2.5 | 2.1 |
| STC201610-3R3M | 3.3 | 20% | 140 | 170 | 2.3 | 2.0 | 1.7 | 1.5 |
| STC201610-4R7M | 4.7 | 20% | 190 | 220 | 2.0 | 1.8 | 1.6 | 1.4 |
| STC201610-100M | 10 | 20% | 483 | 580 | 1.4 | 1.1 | 1.0 | 0.7 |
Saturation Current: DC current at which inductance drops 30% from its value without current.
Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.
Special remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Applications
- DC/DC converter for CPU in Notebook PC
- Phones, tablets, HDDs, DVCs, PDAs, 5G modules
- Server, base station, etc.
- Various DC-DC conversion power modules
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| STC201610 | 8 | 4 | 3.5 | 8.4 | 60 | 13 | 178 | 3000 | 30,000 | 120,000 |
Reliability Testing Summary
- Terminal Strength: Meets specified force and duration requirements for SMT and DIP.
- Resistance to Flexure: No visible mechanical damage after flexure test.
- Dropping: No case deformation or change in appearance; no short and open after dropping packaged products.
- Solderability: Minimum 95% solder coverage on terminals after test.
- Vibration: No visible mechanical damage; inductance and Q factor changes within specified limits.
- Thermal Shock: No visible mechanical damage; inductance and Q factor changes within specified limits.
- Low temperature Storage: No visible mechanical damage; inductance and Q factor changes within specified limits.
- High temperature Storage: No visible mechanical damage; inductance and Q factor changes within specified limits.
- Damp Heat (Steady States): No visible mechanical damage; inductance and Q factor changes within specified limits.
- Heat endurance of Reflow soldering: No significant defects in appearance; inductance, Q factor, and DCR changes within specified limits.
- Resistance to solvent test: No case deformation or change in appearance.
- Overload test: No smoke, peculiar smell, or fire during test; characteristics normal after test.
- Voltage resistance test: No breakdown during test; characteristics normal after test.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months under conditions of 5~40C and 35~65% RH.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils; handle carefully to prevent damage.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is required.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied.
- Non-magnetic Shield Type: Careful layout is required on the PCB to prevent malfunction due to magnetic interference.
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