Molding SMD Power Inductor LanTu Micro SMS0518-6R8M Suitable for High Frequency Applications up to 3MHz
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Product Description
Molding SMD Power Inductors - SMS0518 Series
Product Overview
The SMS0518 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are ultra-high current, thin-profile SMD power inductors designed for high-density installation. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability through an integral construction, providing excellent vibration resistance and ultra-low buzz noise due to their composite structure. They are constructed using low-loss alloy powder for die-casting, resulting in low impedance, small parasitic capacitance, high efficiency, and reduced eddy-current loss. These inductors support frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, making them suitable for various applications including PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0518
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
General Specifications
| Item | Specification |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Frequency Range | Up to 3MHz |
| Absolute Maximum Voltage | 30VDC |
| Test Equipment (Inductance) | WK3260B LCR meter or equivalent |
| Test Equipment (Current) | WK3260B+WK3265B or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Electrical Characteristics
| Part No. | Inductance (H) | Tolerance | Inductance @ 100KHz, 1.0V (H) | DCR Max (m) | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
|---|---|---|---|---|---|---|
| SMS0518-R33M | 0.33 | 20% | 6.0 | 7.0 | 17.0 | 12.0 |
| SMS0518-R47M | 0.47 | 20% | 7.7 | 9.0 | 15.5 | 10.5 |
| SMS0518-R56M | 0.56 | 20% | 8.0 | 10.0 | 15.0 | 9.5 |
| SMS0518-R68M | 0.68 | 20% | 10.0 | 12.0 | 12.0 | 9.0 |
| SMS0518-1R0M | 1.00 | 20% | 15.0 | 17.0 | 9.0 | 8.0 |
| SMS0518-1R5M | 1.50 | 20% | 21.0 | 26.0 | 9.0 | 7.5 |
| SMS0518-2R2M | 2.20 | 20% | 30.0 | 35.0 | 6.5 | 5.0 |
| SMS0518-3R3M | 3.30 | 20% | 52.0 | 58.0 | 5.0 | 4.5 |
| SMS0518-4R7M | 4.70 | 20% | 78.0 | 85.0 | 4.0 | 3.5 |
| SMS0518-6R8M | 6.80 | 20% | 107.0 | 120.0 | 3.4 | 2.8 |
| SMS0518-100M | 10.00 | 20% | 140.0 | 155.0 | 3.0 | 2.5 |
| SMS0518-150M | 15.00 | 20% | 240.0 | 260.0 | 2.2 | 1.8 |
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (Typ) (mm) | E (Typ) (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS0518 | 5.500.30 | 5.200.20 | 1.80Max | 2.30 | 1.20 | 3.00 | 7.00 | 2.50 |
Product Identification Example
SMS 0518 4R7 M T
- SMS: Series Type
- 0518: External Dimensions (LWH) (mm)
- 4R7: Inductance Value (4.7 H)
- M: Inductance Tolerance (20%)
- T: Packing Type (Tape & Reel)
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0518 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force and duration requirements without loose terminals. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet specified force and duration requirements without loose terminals. | Pulling test based on GB/T 2423.60-2008, varying force based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop from 1m height in specified angles and surfaces. |
| Solderability | No visible mechanical damage. Wetting >75% coverage. Terminals 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temp: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin, 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 2 hours per direction (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes (-55~40 to 85~125). Transforming interval Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L 10% (Mn-Zn: 30%). Q/Q 30%. DCR/DCR 10%. | GJB 360B-2009. Twice reflow soldering, peak temp: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not clean products; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design as devices self-heat when powered on.
- Layout (Non-magnetic shield type): Careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina