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Shielded SMD Power Inductors LanTu Micro SDRS7032-100NT with Bulk and Tape Reel Packaging Options

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Product Description

Product Overview

The SDRS7032 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are shielded SMD power inductors designed for high saturation current and low DC resistance. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high-accuracy dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for applications such as thin-screen TVs, LCDs, AV equipment, gaming equipment, and DC/DC converters.

Product Attributes

  • Brand: LANTU MICRO ELECTRIC TECHNOLOGY
  • Series: SDRS7032
  • Type: Shielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Magnetic Circuit Design: Closed magnetic circuit
  • Mounting Type: Surface Mount Device (SMD)
  • Packaging: Bulk Package (B), Tape & Reel (T)

Technical Specifications

Part No. Inductance (H) Tolerance Test Frequency DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SDRS7032-3R3N 3.3 30% 100KHz 0.023 1.90 1.90
SDRS7032-4R7N 4.7 30% 100KHz 0.036 1.70 1.70
SDRS7032-6R8N 6.8 30% 100KHz 0.041 1.60 1.60
SDRS7032-100N 10 30% 100KHz 0.053 1.40 1.40
SDRS7032-150N 15 30% 100KHz 0.075 1.10 1.10
SDRS7032-220N 22 30% 100KHz 0.110 0.96 0.96
SDRS7032-330N 33 30% 100KHz 0.160 0.75 0.75
SDRS7032-470N 47 30% 100KHz 0.240 0.67 0.67
SDRS7032-680N 68 30% 100KHz 0.310 0.59 0.59
SDRS7032-101N 100 30% 100KHz 0.450 0.45 0.45
SDRS7032-151N 150 30% 100KHz 0.650 0.37 0.37
SDRS7032-221M 220 20% 100KHz 1.050 0.29 0.29
SDRS7032-331M 330 20% 100KHz 1.670 0.22 0.22
SDRS7032-471M 470 20% 100KHz 2.050 0.20 0.20
SDRS7032-681M 680 20% 100KHz 3.150 0.16 0.16
Part No. External Dimensions (LWH) (mm) A (mm) B (mm) C (mm) D (mm) E (mm) H (mm) I (mm) J (mm)
SDRS7032 7.07.03.2 7.00.2 7.00.2 3.20.2 4.0 2.0 2.2 2.0 4.0

Environmental Data:

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

  • Inductance (L): HP4284A or HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification: SDRS 7032 [Inductance] [Tolerance] [Packing]

  • Inductance: e.g., 100 (for 10 H)
  • Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • Packing: B (Bulk Package), T (Tape & Reel)

Packaging:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRS7032 16 12 7.5 16.4 60 13 330 1000 3000 12,000

Tape and Reel Specifications:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm
Terminal Strength (DIP) Meet requirements without any loose terminal Pulling test (force varies by terminal diameter)
Resistance to Flexure No visible mechanical damage Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec
Dropping No case deformation or change in appearance. No short and no open. Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Frequency range: 10 to 55 Hz and return to 10 Hz in approx. 1 minute. Applied for 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Refer to reflow curve, peak temperature: 260+0/-5. Performed twice.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip into IPA solvent for 50.5Min, drying at room temp for 5Min, brushing 10 times.
Overload test During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. Apply twice as rated current for 5 minutes.
Voltage resistance test During the test no breakdown. The characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended reflow soldering curve: Conditions to be adjusted and confirmed according to user's environment/equipment.

Reminders for using these products:

  • Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
  • Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils by yourself; contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
  • Allow sufficient thermal design margin for self-heating when power is ON.
  • For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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