Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Unshielded SMD Power Inductors LanTu Micro SCD1054-221MT Ideal for Power Supplies and DC DC Converters

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Product Description

Unshielded SMD Power Inductors - SCD1054 Series

Product Overview

The SCD1054 Series Unshielded SMD Power Inductors are designed for surface mounting and offer a low-cost solution with a silver-plated type. These inductors are characterized by their small size, high rated current capability, and low DC resistance. They are suitable for a wide range of applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SCD1054
  • Type: Unshielded SMD Power Inductor
  • Design: Silver plated type, Low cost design
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

General Specifications:

Item Specification
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance) HP4284A, HP4285A or equivalent LCR meter
Test Equipment (Current) HP4284+42841A or equivalent
Test Equipment (SRF) Agilent E4991A or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Product Identification:

Field Description
SCD 1054 Type
100 Inductance Value (e.g., 100 = 10 uH)
M Inductance Tolerance (e.g., M: 20%)
T Packing (T: Tape & Reel, B: Bulk Package)

External Dimensions (mm):

Part No L (mm) W (mm) H (mm) A (mm) B (mm) C (mm) D (mm) I (mm) J (mm)
SCD1054 10.00.3 5.40.5 - 10.00.3 9.00.3 5.40.5 2.1 9.5 3.75

Electrical Characteristics:

Part No Inductance L (H) Tole Test Freq SRF Min (MHz) DCR Typ () Isat (A) Max Irms (A) Max
SCD1054-100M 10 M 100KHz 120 0.06 4.00 2.60
SCD1054-120M 12 M 100KHz 100 0.07 3.50 2.45
SCD1054-150M 15 M 100KHz 95 0.08 3.00 2.27
SCD1054-180M 18 M 100KHz 85 0.09 2.90 2.15
SCD1054-220M 22 M 100KHz 75 0.10 2.55 1.95
SCD1054-270M 27 M 100KHz 62 0.11 2.20 1.76
SCD1054-330M 33 M 100KHz 53 0.12 2.10 1.50
SCD1054-390M 39 M 100KHz 47 0.14 2.00 1.37
SCD1054-470M 47 M 100KHz 41 0.17 1.95 1.28
SCD1054-560M 56 M 100KHz 38 0.19 1.70 1.17
SCD1054-680M 68 M 100KHz 33 0.22 1.50 1.11
SCD1054-820M 82 M 100KHz 31 0.25 0.35 1.00
SCD1054-101M 100 M 100KHz 27 0.35 1.20 0.97
SCD1054-121M 120 M 100KHz 23 0.40 1.15 0.89
SCD1054-151M 150 M 100KHz 21 0.47 1.05 0.78
SCD1054-181M 180 M 100KHz 19 0.63 0.88 0.72
SCD1054-221M 220 M 100KHz 17 0.73 0.85 0.66
SCD1054-271M 270 M 100KHz 15 0.97 0.80 0.57
SCD1054-331M 330 M 100KHz 14 1.15 0.75 0.52
SCD1054-391M 390 M 100KHz 12 1.30 0.65 0.48
SCD1054-471M 470 M 100KHz 11 1.48 0.56 0.42
SCD1054-561M 560 M 100KHz 10 1.90 0.52 0.33
SCD1054-681M 680 M 100KHz 9.3 2.25 0.48 0.28
SCD1054-821M 820 M 100KHz 8.4 2.55 0.44 0.24
SCD1054-102M 1000 M 100KHz 7 3.10 0.40 0.20

Note: Saturation Current (Isat): DC current at which inductance drops 10% from its value without current. Temperature Rise Current (Irms): the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current is the lesser of Isat or Irms. Component temperature should be verified in the end application.

Packaging Specifications:

Tape Dimension (mm) W P W1 Reel Dimensions (mm) A B C D REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SCD1054 24 12 11.5 24.4 100 13 330 1000 2000 8000 -

Cover tape peel force: 10 to 120g. Noodle strip peeling angle: 165 to 180.

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength Meet requirements without any loose terminal. Pulling test based on terminal area, Solder paste thickness: 0.12mm.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Amplitude 1.5mm, frequency 10-55 Hz, 2 hours in 3 directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles of temperature cycling between high (85~125) and low (-55~40).
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402, Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 125~852, Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. Refer to reflow curve, performed twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test No smoke, no peculiar smell, no fire during test. Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test No breakdown during test. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve:

The recommended reflow conditions are set according to our soldering equipment. Please adjust and confirm according to user's environment/equipment.

Reminders for Using These Products:

  • Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35 to 65% RH or less.
  • Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions.
  • Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils; contact the company if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
  • Allow sufficient thermal design margin for self-heating when power is on.
  • For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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