vibration resistant molding SMD power inductors LanTu Micro SMS0630 150MT for demanding power systems
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Product Description
Molding SMD Power Inductors - SMS0630 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0630 Series offers ultra-high current SMD power inductors designed for demanding applications. These thin-profile inductors feature low DC resistance and ultra-high current capabilities, making them ideal for high-density installations due to their magnetic shielding that provides strong anti-electromagnetic interference. The integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, these inductors exhibit low impedance and small parasitic capacitance, contributing to high efficiency by reducing winding DC resistance and core eddy-current loss. They are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards.
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Product Attributes
- Brand: LANTU MICRO ELECTRIC
- Origin: SHENZHEN, CHINA
- Type: Molding SMD Power Inductor
- Compliance: RoHS, Halogen Free, REACH
Technical Specifications
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
Electrical Characteristics (at 25)
| Part No. | Inductance (H) @ 0A (100KHz, 1.0V) | Tolerance | DCR (m) Max | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
|---|---|---|---|---|---|
| SMS0630-R10M | 0.10 | 20% | 2.20 | 60.00 | 32.00 |
| SMS0630-R15M | 0.15 | 20% | 2.30 | 41.00 | 30.00 |
| SMS0630-R22M | 0.22 | 20% | 3.00 | 35.00 | 25.00 |
| SMS0630-R47M | 0.47 | 20% | 4.50 | 20.00 | 18.00 |
| SMS0630-R68M | 0.68 | 20% | 5.30 | 19.00 | 16.00 |
| SMS0630-1R0M | 1.0 | 20% | 8.00 | 16.00 | 13.00 |
| SMS0630-1R5M | 1.5 | 20% | 16.00 | 14.00 | 12.50 |
| SMS0630-2R2M | 2.2 | 20% | 20.00 | 11.50 | 8.50 |
| SMS0630-3R3M | 3.3 | 20% | 35.00 | 9.50 | 7.00 |
| SMS0630-4R7M | 4.7 | 20% | 40.00 | 6.55 | 6.00 |
| SMS0630-5R6M | 5.6 | 20% | 42.00 | 6.35 | 5.70 |
| SMS0630-6R8M | 6.8 | 20% | 48.00 | 6.00 | 5.10 |
| SMS0630-8R2M | 8.2 | 20% | 64.90 | 6.00 | 5.00 |
| SMS0630-100M | 10 | 20% | 75.00 | 5.50 | 4.50 |
| SMS0630-150M | 15 | 20% | 115.00 | 4.50 | 3.10 |
| SMS0630-220M | 22 | 20% | 200.00 | 3.50 | 2.60 |
| SMS0630-330M | 33 | 20% | 270.00 | 3.00 | 2.00 |
| SMS0630-470M | 47 | 20% | 385.00 | 2.00 | 1.50 |
Dimensions (mm)
| Part No. | A | B | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0630 | 7.100.30 | 6.600.20 | 3.00 | 3.00 | 1.60 | 3.70 | 8.40 | 3.50 |
Product Identification
Format: SMS 0630 R68 M T
- Type: SMS (Molding SMD Power Inductor)
- Inductance: e.g., R68 = 0.68 uH
- Outer Dimensions (LWH): e.g., 0630 = 7.16.63.0 mm
- Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: T = Tape & Reel, B = Bulk Package
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0630 | 16.0 | 12.0 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually and maintained for 10 seconds (force varies by terminal diameter). |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency 10-55 Hz, amplitude 1.5mm. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Peak temperature: 260+0/-5. Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended reflow soldering curve: Provided in the datasheet, users should adjust based on their specific equipment and environment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35-65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is required.
- Magnetism: Keep away from magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specification limits to avoid short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on.
- Layout: Carefully lay out non-magnetic shield types to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina