LanTu Micro SDRH104R-220MT Shielded SMD Power Inductors Designed for in VTRs and DC DC Converter Power Supplies
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Product Description
Product Overview
The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. Featuring a closed magnetic circuit to minimize leakage, high saturation current, and low DCR, these inductors ensure efficient power delivery. Their high-accuracy dimensions are ideal for automatic mounting processes. The series offers a wide range of inductance values and package sizes, complying with RoHS, Halogen Free, and REACH standards. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Product Series: SDRH104R Series
- Type: Shielded SMD Power Inductors
- Magnetic Circuit Design: Closed magnetic circuit
- Certifications: RoHS, Halogen Free, REACH Compliance
- Mounting Type: SMD (Surface Mount Device)
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications:
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coil self-temperature rise) |
| Test Frequency (Inductance) | 100KHz |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current | The lesser value of Isat or Irms. |
| Recommended Land Pattern | Refer to diagram (Page 2) |
| Recommended Reflow Soldering Curve | Refer to diagram (Page 8) |
Electrical Characteristics:
| Part No. | Inductance (H) | Tolerance | DCR () Max @0A | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|
| SDRH104R-1R5N | 1.5 | 30% | 0.008 | 12.50 | 8.50 |
| SDRH104R-2R2N | 2.2 | 30% | 0.011 | 9.90 | 7.70 |
| SDRH104R-3R3N | 3.3 | 30% | 0.014 | 8.80 | 7.40 |
| SDRH104R-3R8N | 3.8 | 30% | 0.018 | 8.80 | 7.40 |
| SDRH104R-4R7N | 4.7 | 30% | 0.022 | 7.00 | 6.00 |
| SDRH104R-5R2N | 5.2 | 30% | 0.022 | 7.00 | 6.00 |
| SDRH104R-6R8N | 6.8 | 30% | 0.027 | 6.60 | 5.30 |
| SDRH104R-8R2N | 8.2 | 30% | 0.030 | 6.00 | 4.80 |
| SDRH104R-100N | 10 | 30% | 0.035 | 5.60 | 4.50 |
| SDRH104R-150N | 15 | 30% | 0.050 | 4.40 | 3.70 |
| SDRH104R-220M | 22 | 20% | 0.073 | 3.60 | 2.80 |
| SDRH104R-330M | 33 | 20% | 0.093 | 2.90 | 2.60 |
| SDRH104R-470M | 47 | 20% | 0.128 | 2.44 | 2.30 |
| SDRH104R-560M | 56 | 20% | 0.185 | 2.18 | 1.75 |
| SDRH104R-680M | 68 | 20% | 0.213 | 2.08 | 1.68 |
| SDRH104R-820M | 82 | 20% | 0.275 | 1.88 | 1.48 |
| SDRH104R-101M | 100 | 20% | 0.304 | 1.66 | 1.42 |
| SDRH104R-151M | 150 | 20% | 0.506 | 1.40 | 1.15 |
| SDRH104R-221M | 220 | 20% | 0.756 | 1.19 | 0.88 |
| SDRH104R-331M | 330 | 20% | 1.090 | 0.92 | 0.66 |
| SDRH104R-471M | 470 | 20% | 1.476 | 0.65 | 0.59 |
| SDRH104R-681M | 680 | 20% | 2.100 | 0.54 | 0.50 |
Dimensions (mm):
| Part No. | Overall (LWH) | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH104R | 10.310.34.0 | 10.3 | 10.5 | 4.0 | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
Packaging Details:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box Quantity (PCS) | Outside Carton Quantity (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH104R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 1000 | 2000 | 8000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet defined force/time requirements without loose terminals. Solder paste thickness: 0.12mm. | Refer to GB/T 2423.60-2008. Pulling test with specified forces and durations based on terminal cross-sectional area. |
| Terminal Strength (DIP) | Meet defined force/time requirements without loose terminals. | Refer to GB/T 2423.60-2008. Pulling test with specified forces and durations based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Inductor soldered to test jig, flexure of 2mm applied at 0.5mm/sec for 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. | GB/T 2423.28-2005. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 1 min cycle, 2 hours per direction (3 directions). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature cycling between high (85~125) and low (-55~40) for T time. Max 20 sec transforming interval. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402, Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852, Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Performed twice according to reflow curve. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Reminders for Using These Products:
- Storage: Within 12 months. Conditions: 5~40C, 35~65% RH or less.
- Environment: Avoid gas corrosion (salt, acid, alkali).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage. Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Soldering: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C. Post-mounting corrections should be within specifications to avoid performance degradation.
- Thermal Design: Account for self-heating when power is applied.
- Non-shielded Type: Careful layout is needed to prevent malfunction due to magnetic interference.
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