High Density Mini Molded Chip Power Inductor LMSC0410100MTA Ideal for PDAs Notebooks and Smartphones
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Description
The LMSC0410100MTA is a Mini Molded Chip Power Inductor. Its main materials include soft magnetic powder, coil, and electrode pin, which are pressed and formed for molding. This design offers advantages such as a closed magnetic circuit, anti-electromagnetic interference, high installation density, and suitability for SMT processes. It is primarily used for energy storage or filtering in electronic circuits, with typical applications in PDAs, notebooks, smartphones, servers, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Soft magnetic powder, coil, electrode pin
- Color: Not specified
- Certifications: Halogen free, RoHS compliant
Technical Specifications
| Part Number | Inductance (H) | Test Freq. (MHz) | DC Resistance (m) | Saturation Current (Isat) (A) | Temperature Rise Current (Irms) (A) | Rated Voltage Max. (V) |
| LMSC0410100MTA | 10 | 1 | 220.00 (Typ) / 265.00 (Max) | 3.00 (Typ) / 2.60 (Max) | 2.20 (Typ) / 2.00 (Max) | 20 |
Outline Dimensions (Unit: mm)
| Type | A | B | C | D | L | G | H |
| 0410 | 4.00.2 | 4.00.2 | 1.0Max | 1.7 Typ | 4.1 | 1.6 | 4.0 |
Electrical Characteristics Notes
- Inductance Tolerance: 20%
- All test data is referenced to 25 ambient
- Test Condition: 1MHz, 1.0Vrms
- Idc: DC current (A) that will cause an approximate T of 40
- Isat: DC current (A) that will cause L0 to drop approximately 30%
- Operating Temperature Range: -40 to +125
- The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower
Reliability Test Items
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | 1. Appearance: no obvious damage. 2. Coverage area of new solder on electrode surface: > 95%. | 1. Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0); 2. Solder temperature: 2455; 3. Immersion time: 31 seconds. |
| Terminal Strength | 1. Sample shall not fall off test board. 2. No disconnection of leads or cracks on product matrix. 3. Inductance value change: 10%. | 1. Solder samples onto test board using reflow soldering. Push perpendicular to side at 30mm/min until 17.5N is reached. 2. Duration: 101 seconds. 3. Push-head radius: 0.5mm. |
| Bending | 1. Sample must not drop off test board. 2. No disconnection of lead-out terminals or cracks on product matrix. | 1. Solder samples onto test board using reflow soldering. Apply force until bending degree reaches 2mm. 2. PCB size: 100401.0 (or 0.8mm) mm. 3. Bending duration: 30s. 4. Test rate: 0.5mm/s. |
| Reflow | 1. Appearance: no obvious mechanical damage. 2. Inductance value change: 10%. | Max. 260, for 3 times. |
| Long-term humid heat | 1. Appearance: no hidden cracks, rust, or excessive glue. 2. Inductance value change: 10%. | 1. Temperature: 60. 2. Humidity: 95%RH. 3. Time: 1000H +24/-0 hours. 4. Test after standing for 1H. |
| Dropping | 1. Appearance: no obvious damage. 2. Inductance value change: 10%. | 1. Solder samples onto test boards using reflow soldering, then place into drop-test boxes. 2. Drop boxes from 1 meter onto marble floor. 3. Drop boxes onto each of 6 faces three times (18 drops total). 4. Counterweight: 250g 20g. |
| Long-term high temperature and high humidity | 1. Appearance: no hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 852. 2. Humidity: 855%. 3. Duration: 1000H +24/0 hours. 4. Test after standing for 1H. |
| Low-temperature storage | 1. Surface: no hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance value change: 10%. | 1. Temperature: -402. 2. Time: 1000 +24/-0 hours. 3. Test after standing for 1 hour. |
| High-temperature storage | 1. Surface: no hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 125+2/-0. 2. Time: 1000+24/-0 hours. 3. Test after standing for 1 hour. |
| Long-term durability | 1. Surface: no hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 85 2 2. Duration: 1000 + 24 / -0 hours 3. Applied current: Rated current 4. Conduct test after standing for 1 hour. |
| Thermal Shock | 1. Surface: no hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance value change: 10%. | 1. -55+0/-5 for 303 minutes room temperature within 5 minutes 125+5/-0 for 303 minutes room temperature 2. Conversion time: 5 minutes Max 3. Cycles: 100 4. Conduct test after standing for 1 hour. |
| Vibration | 1. No parts falling off or cracks. 2. Inductance value change: 10%. | 1. Solder samples onto test board by reflow soldering. 2. Acceleration: 5g 3. Sweep speed: 20 min/cycle 4. Cycles: 12 cycles per axis (X, Y, Z), 36 total 5. Frequency: 10 - 2000Hz. |
| Humid heat load (60/95%RH + loading) | 1. Surface: no hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 60 2. Humidity: 95%RH 3. Applied Current: Rated current 4. Duration: 1000H +24/-0 hours 5. Conduct test after standing for 1 hour. |
Packaging and Storage
Tape packaging dimensions: Unit: mm
| Dimensions | A0 | B0 | K0 | T |
| (mm) | 4.350.1 | 4.350.1 | 1.100.10 | 0.300.05 |
Units/Reel: 3K
Peel force of top cover tape: The peel speed shall be about 300 mm/minute. The peel force shall be between 0.1 to 0.7N.
Storage:
- Recommended conditions: -10~40, 70% RH (Max.).
- Product should be used within one year from the time of delivery.
- If stored over 6 months, solderability shall be checked before actual usage.
Reflow Profile
Reflow Soldering Method:
- Pre-Heat: 150 ~ 200 (60~120 seconds)
- Soak: 217 (60~150 seconds)
- Peak: 255~260 (Max. 30 seconds)
- Time (25 to peak temperature): 8 minutes max
Soldering iron Method: 3505 (max. 3 seconds)
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina