Mini Molded Chip Power Inductor Linepri LMSH2016101R0MTA with Ultra High Current Rating and Low Loss
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Description
The LMSH2016101R0MTA is a Mini Molded Chip Power Inductor designed for energy storage or filtering in electronic circuits. It is constructed from soft magnetic powder, a coil, and electrode pins, pressed and formed for a closed magnetic circuit. This design offers advantages such as anti-electromagnetic interference, high installation density, and suitability for SMT processes. Key features include metal material for high current and low loss, a closed magnetic circuit design to reduce leakage flux, super low resistance, and an ultra-high current rating. It is halogen-free and RoHS compliant.
Key Features
- Metal material for large current and low loss
- Closed magnetic circuit design reduces leakage flux
- Super low resistance, ultra high current rating
- Halogen free, RoHS compliant
Typical Application
- PDA, notebook, Smart phone, and server applications
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
| Part Number | Inductance (H) | Test Frequency (MHz) | DC Resistance (m) Typ. | DC Resistance (m) Max. | Saturation Current (Isat) (A) Typ. | Saturation Current (Isat) (A) Max. | Temperature Rise Current (Irms) (A) Typ. | Temperature Rise Current (Irms) (A) Max. | Rated Voltage Max. (V) |
| LMSH2016101R0MTA | 1.0 | 1 | 40 | 43 | 4.6 | 4.4 | 4.2 | 4.0 | 20 |
General Notes:
- Inductance Tolerance: 20%
- All test data is referenced to 25 ambient.
- Test Condition: 1MHz, 1.0Vrms.
- Idc: DC current (A) that will cause an approximate T of 40.
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -40 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Outline Dimensions (Unit: mm)
| Type | A | B | C (Max) | D (Typ) | L | G | H |
| 201610 | 2.00.2 | 1.60.2 | 1.0 | 0.6 | 2.1 | 0.5 | 1.7 |
Reliability Test Items
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | 1. Appearance: No obvious damage. 2. Solder coverage: > 95%. | Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0); Temp: 2455; Time: 31 sec. |
| Terminal Strength | 1. No sample detachment. 2. No lead disconnection or cracks. 3. Inductance change 10%. | Solder onto test board, push perpendicular to side at 30mm/min until 12.5N. Duration: 101 sec. Push-head radius: 0.5mm. |
| Bending | 1. No sample detachment. 2. No lead disconnection or cracks. | Solder onto test board, apply force until board bends 2mm. PCB size: 100401.0(or 0.8)mm. Duration: 30s. Rate: 0.5mm/s. |
| Reflow | 1. Appearance: No obvious mechanical damage. 2. Inductance change 10%. | Max. 260, for 3 times. |
| Long-term humid heat (60/95%RH) | 1. Appearance: No hidden cracks, rust, or excessive glue. 2. Inductance change 10%. | Temp: 60; Humidity: 95%RH; Time: 1000H +24/-0 hrs. Test after 1H standing. |
| Dropping | 1. Appearance: No obvious damage. 2. Inductance change 10%. | Solder onto test boards, place in drop-test boxes. Drop from 1m onto marble floor. 6 faces, 3 times each (18 drops total). Counterweight: 250g 20g. |
| Long-term high temperature and high humidity (85/85) | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change 10%. | Temp: 852; Humidity: 855%; Duration: 1000H +24/0 hrs. Test after 1H standing. |
| Low-temperature storage (-40) | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change 10%. | Temp: -402; Time: 1000 +24/-0 hrs. Test after 1 hour standing. |
| High-temperature storage (125) | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change 10%. | Temp: 125+2/-0; Time: 1000+24/-0 hrs. Test after 1 hour standing. |
| Long-term durability (85) | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change 10%. | Temp: 85 2; Duration: 1000 + 24 / -0 hrs; Applied current: Rated current. Test after 1 hour standing. |
| Thermal Shock | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change 10%. | -55+0/-5 (303 min) Room Temp (within 5 min) 125+5/-0 (303 min) Room Temp. Conversion time: 5 min Max. Cycles: 100. Test after 1 hour standing. |
| Vibration | 1. No parts falling off or cracks. 2. Inductance change 10%. | Solder onto test board. Acceleration: 5g; Sweep speed: 20 min/cycle; Cycles: 12 per axis (X, Y, Z), 36 total; Frequency: 10 - 2000Hz. |
| Humid heat load (60/95%RH + loading) | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change 10%. | Temp: 60; Humidity: 95%RH; Applied Current: Rated current; Duration: 1000H +24/-0 hrs. Test after 1 hour standing. |
Packaging and Storage
Tape Packaging Dimensions (mm)
| Dimensions | A0 | B0 | K0 | T |
| Code | 1.950.05 | 2.350.05 | 1.150.05 | 0.250.05 |
| Units/Reel | 3K | |||
Tape Direction
See Fig. 7-2 (Not provided in text).
Reel Dimensions (Unit: mm)
See Fig. 7-3 (Not provided in text).
Peel Force of Top Cover Tape
Peel speed: ~300 mm/minute. Peel force: 0.1 to 0.7N.
Storage Recommendations
- Storage area temperature and humidity should be controlled to maintain solderability and packaging condition.
- Recommended conditions: -10~40, 70% RH (Max.).
- Product should be used within one year from delivery.
- Check solderability before usage if stored over 6 months.
Reflow Profile
Reflow Soldering Method
- Pre-Heat: 150 ~ 200, 60~120 seconds.
- Soak: 217, 60~150 seconds.
- Peak: 255~260, Max. 30 seconds (tp).
- Time (25 to peak temperature): 8 minutes max.
Soldering Iron Method
- 3505, max. 3 seconds.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina