Mini Molded Chip Power Inductor Linepri LMSH2012081R0MTA with Soft Magnetic Powder and Coil Construction
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Description
The LMSH2012081R0MTA is a Mini Molded Chip Power Inductor designed for energy storage or filtering in electronic circuits. Constructed with soft magnetic powder, a coil, and electrode pins, it offers a closed magnetic circuit, reducing leakage flux and providing excellent anti-electromagnetic interference properties. Its molded design allows for high installation density and is especially suitable for SMT processes. Key advantages include its metal material for high current and low loss, super low resistance, and ultra-high current rating.
Key Features
- Metal material for large current and low loss
- Closed magnetic circuit design reduces leakage flux
- Super low resistance, ultra-high current rating
- Halogen free, RoHS compliant
Typical Applications
- PDA, notebook, Smart phone, and server applications
- Battery powered devices
- DC/DC converters in distributed power systems
Outline Dimensions
| Type | A (mm) | B (mm) | C (Max mm) | D (Typ mm) | L (mm) | G (mm) | H (mm) |
| 201208 | 2.00.2 | 1.20.2 | 0.8 | 0.6 | 2.1 | 0.5 | 1.3 |
Electrical Characteristics
| Part Number | L (H) | Test Freq. (MHz) | DC Resistance (m) | Saturation Current (Isat) (A) | Temperature Rise Current (Irms) (A) | |||
| Typ. | Max. | Typ. | Max. | Typ. | Max. | |||
| LMSH2012081R0MTA | 1.0 | 1 | 46.0 | 50.0 | 3.5 | 3.3 | 3.5 | 3.2 |
Notes:
- Inductance Tolerance: 20%
- All test data is referenced to 25 ambient
- Test Condition: 1MHz, 1.0Vrms
- Idc: DC current (A) that will cause an approximate T of 40
- Isat: DC current (A) that will cause L0 to drop approximately 30%
- Operating Temperature Range: -40 to +125
- The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
- Rated Voltage Max: 20V
Reliability Test Items
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | 1. Appearance: no obvious damage. 2. Coverage area of new solder on electrode surface: > 95%. | 1. Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0); 2. Solder temperature: 2455; 3. Immersion time: 31 seconds. |
| Terminal Strength | 1. Sample shall not fall off test board. 2. No disconnection of leads or cracks on product matrix. 3. Inductance value change: 10%. | 1. Solder test samples onto test board using reflow soldering. Push perpendicular to sample side at 30mm/min until 5N is reached. 2. Duration: 101 seconds. 3. Push-head radius: 0.5mm. |
| Bending | 1. Sample must not drop off test board. 2. No disconnection of lead-out terminals or cracks on product matrix. | 1. Solder test samples onto test board using reflow soldering. Apply force until test board bending reaches 2mm. 2. PCB size: 100401.0 (or 0.8mm) mm. 3. Bending duration: 30s. 4. Test rate: 0.5mm/s. |
| Reflow | 1. Appearance: no obvious mechanical damage. 2. Inductance value change: 10%. | Max. 260, for 3 times. |
| Long-term humid heat | 1. Appearance: no hidden cracks, rust, or excessive glue. 2. Inductance value change: 10%. | 1. Temperature: 60. 2. Humidity: 95%RH. 3. Time: 1000H +24/-0 hours. 4. Test after standing for 1H. |
| Dropping | 1. Appearance: no obvious damage. 2. Inductance value change: 10%. | 1. Solder samples onto test boards using reflow soldering, then place into drop-test boxes. 2. Drop boxes from 1 meter height onto a marble floor. 3. Drop boxes onto each of the 6 faces three times (18 drops total). 4. Counterweight: 250g 20g. |
| Long-term high temperature and high humidity | 1. Appearance: no hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 852. 2. Humidity: 855%. 3. Duration: 1000H +24/0 hours. 4. Test after standing for 1H. |
| Low-temperature storage | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance value change: 10%. | 1. Temperature: -402. 2. Time: 1000 +24/-0 hours. 3. Test after standing for 1 hour. |
| High-temperature storage | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 125+2/-0. 2. Time: 1000+24/-0 hours. 3. Test after standing for 1 hour. |
| Long-term durability | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 85 2. 2. Duration: 1000 + 24 / -0 hours. 3. Applied current: Rated current. 4. Conduct test after standing for 1 hour. |
| Thermal Shock | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance value change: 10%. | 1. -55+0/-5 for 303 min room temp within 5 min 125+5/-0 for 303 min room temp. 2. Conversion time: 5 min Max. 3. Cycles: 100. 4. Conduct test after standing for 1 hour. |
| Vibration | 1. No parts falling off or cracks. 2. Inductance value change: 10%. | 1. Solder samples onto test board by reflow soldering. 2. Acceleration: 5g. 3. Sweep speed: 20 min/cycle. 4. Cycles: 12 cycles per axis (X, Y, Z), 36 total. 5. Frequency: 10 - 2000Hz. |
| Humid heat load (60/95%RH + loading) | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance value change: 10%. | 1. Temperature: 60. 2. Humidity: 95%RH. 3. Applied Current: Rated current. 4. Duration: 1000H +24/-0 hours. 5. Conduct test after standing for 1 hour. |
Packaging and Storage
Tape packaging dimensions
| Dimensions Code (mm) | A0 | B0 | K0 | T |
| 1.550.05 | 2.350.05 | 0.950.05 | 0.220.05 |
Reel Dimensions
Units/Reel: 3K
Peel force of top cover tape
The peel speed shall be about 300 mm/minute. The peel force of top cover tape shall be between 0.1 to 0.7N.
Storage Recommendations
- To maintain solderability and packing material condition, control temperature and humidity.
- Recommended conditions: -10~ 40, 70% RH (Max.).
- Solderability may decrease over time even under ideal conditions. Use within one year from delivery.
- If stored for over 6 months, check solderability before use.
Reflow Profile
Reflow Soldering Method
Pre-Heat: 150 ~ 200 (60~120 seconds)
Soak: 217 (60~150 seconds)
Peak: 255~260 (Max. 30 seconds)
Soldering iron Method
3505, max. 3 seconds
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina