Mini Molded Chip Power Inductor LMSC2012065R47MTA for DC DC Converters and Distributed Power Systems
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Description
The LMSC2012065R47MTA is a Mini Molded Chip Power Inductor. Its construction involves a coil and electrode pin embedded within soft magnetic powder, which is then pressed, formed, and solidified. This design offers a closed magnetic circuit, reducing electromagnetic interference and leakage flux, enabling high installation density, and is particularly suitable for SMT processes. It functions as an energy storage or filter component in electronic circuits.
Key Features
- Metal material for large current and low loss
- Closed magnetic circuit design reduces leakage flux
- Super low resistance, ultra high current rating
- Halogen free, RoHS compliant
Typical Applications
- PDA, notebook, Smart phone, and server applications
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
| Part Number | Inductance (H) | Test Freq. (MHz) | DC Resistance (m) Typ. | DC Resistance (m) Max. | Saturation Current (Isat) (A) Typ. | Saturation Current (Isat) (A) Max. | Temperature Rise Current (Irms) (A) Typ. | Temperature Rise Current (Irms) (A) Max. | Rated Voltage Max. (V) |
| LMSC2012065R47MTA | 0.47 | 1 | 55 | 60 | 2.4 | 2.2 | 2.2 | 1.9 | 20 |
Outline Dimensions
| Type | A (mm) | B (mm) | C (mm) | D (mm) | L (mm) | G (mm) | H (mm) |
| 2012065 | 2.00.2 | 1.20.2 | 0.65Max | 0.6Typ | 2.1 | 0.5 | 1.3 |
Reliability Test Items
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | 1. Appearance: No obvious damage. 2. Solder coverage: > 95% on electrode surface. | 1. Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0). 2. Temp: 2455. 3. Time: 31 sec. |
| Terminal Strength | 1. No sample detachment from test board. 2. No lead disconnection or cracks. 3. Inductance change: 10% max. | 1. Solder samples to test board via reflow. Apply perpendicular force (30mm/min) until 5N is reached. 2. Duration: 101 sec. 3. Push-head radius: 0.5mm. |
| Bending | 1. No sample detachment from test board. 2. No lead disconnection or cracks. | 1. Solder samples to test board via reflow. Apply force until board bends 2mm. 2. PCB size: 100401.0 (or 0.8mm) mm. 3. Duration: 30s. 4. Rate: 0.5mm/s. |
| Reflow | 1. Appearance: No obvious mechanical damage. 2. Inductance change: 10% max. | Max. 260, for 3 times. |
| Long-term humid heat | 1. Appearance: No hidden cracks, rust, or excessive glue. 2. Inductance change: 10% max. | 1. Temp: 60. 2. Humidity: 95%RH. 3. Time: 1000H +24/-0 hours. 4. Test after 1H standing. |
| Dropping | 1. Appearance: No obvious damage. 2. Inductance change: 10% max. | 1. Solder samples to test boards via reflow, place in drop-test boxes. 2. Drop from 1m onto marble floor. 3. Drop each of 6 faces three times (18 drops total). 4. Counterweight: 250g 20g. |
| Long-term high temperature and high humidity | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10% max. | 1. Temp: 852. 2. Humidity: 855%. 3. Duration: 1000H +24/0 hours. 4. Test after 1H standing. |
| Low-temperature storage | 1. Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance change: 10% max. | 1. Temp: -402. 2. Time: 1000 +24/-0 hours. 3. Test after 1H standing. |
| High-temperature storage | 1. Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance change: 10% max. | 1. Temp: 125+2/-0. 2. Time: 1000+24/-0 hours. 3. Test after 1H standing. |
| Long-term durability | 1. Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance change: 10% max. | 1. Temp: 85 2. 2. Duration: 1000 + 24 / -0 hours. 3. Applied current: Rated current. 4. Test after 1H standing. |
| Thermal Shock | 1. Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance change: 10% max. | 1. -55+0/-5 (303 min) Room temp (within 5 min) 125+5/-0 (303 min) Room temp. 2. Conversion time: 5 min Max. 3. Cycles: 100. 4. Test after 1H standing. |
| Vibration | 1. No parts falling off or cracks. 2. Inductance change: 10% max. | 1. Solder samples to test board via reflow. 2. Acceleration: 5g. 3. Sweep speed: 20 min/cycle. 4. Cycles: 12 per axis (X, Y, Z), 36 total. 5. Frequency: 10 - 2000Hz. |
| Humid heat load (60/95%RH + loading) | 1. Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. 2. Inductance change: 10% max. | 1. Temp: 60. 2. Humidity: 95%RH. 3. Applied Current: Rated current. 4. Duration: 1000H +24/-0 hours. 5. Test after 1H standing. |
Packaging and Storage
Tape Packaging Dimensions
| Dimensions Code (mm) | A0 | B0 | K0 | T |
| 1.500.05 | 2.300.05 | 0.750.05 | 0.220.05 |
Reel Dimensions
Units/Reel: 3K
Peel Force of Top Cover Tape
Peel speed: ~300 mm/minute. Peel force: 0.1 to 0.7N.
Storage Recommendations
- Controlled temperature and humidity to maintain solderability and packaging integrity.
- Recommended conditions: -10 to 40, 70% RH (Max.).
- Use within one year from delivery due to potential decrease in solderability over time.
- Check solderability before use if stored for over 6 months.
Reflow Profile
Reflow Soldering Method
- Pre-Heat: 150 ~ 200 (60~120 seconds)
- 217 (60~150 seconds)
- Peak Temp (Tp): 255~260 (Max. 30 seconds)
- Time 25 to peak temperature: 8 minutes max
Soldering Iron Method
- 3505 (max. 3 seconds)
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina