Mini Molded Chip Power Inductor Linepri LMSC201610R33MTA Designed for Energy Storage and Filtering

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Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The LMSC201610R33MTA is a Mini Molded Chip Power Inductor designed for energy storage or filtering in electronic circuits. It features a closed magnetic circuit design for excellent anti-electromagnetic interference, high installation density, and suitability for SMT processes. Constructed with soft magnetic powder, coil, and electrode pins, it offers magnetic circuit closure, reduced leakage flux, super low resistance, and ultra-high current rating.

Product Attributes

Brand: Not specified
Origin: Not specified
Material: Soft magnetic powder, coil, electrode pin
Color: Not specified
Certifications: Halogen free, RoHS compliant

Technical Specifications

Part Number	Inductance (H)	Test Freq. (MHz)	DC Resistance (m) Typ.	DC Resistance (m) Max.	Saturation Current (Isat) (A) Typ.	Saturation Current (Isat) (A) Max.	Temperature Rise Current (Irms) (A) Typ.	Temperature Rise Current (Irms) (A) Max.	Rated Voltage Max. (V)
LMSC201610R33MTA	0.33	1	13	16	7.6	6.8	5.3	4.8	20

Dimensions (Fig. 4-1)

Type	A (mm)	B (mm)	C (mm)	D (mm)	L (mm)	G (mm)	H (mm)
201610	2.00.2	1.60.2	1.0Max	0.6 Typ	2.1	0.5	1.7

Reliability Test Items

Test Item	Requirements	Test Methods and Remarks
Solderability	1. Appearance: No obvious damage. 2. Solder coverage: > 95%.	1. Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0); 2. Temp: 2455; 3. Time: 31 sec.
Terminal Strength	1. No falling off. 2. No disconnection/cracks. 3. Inductance change: 10%.	1. Solder onto test board. 2. Push perpendicular: 12.5N, 30mm/min. 3. Duration: 101 sec. 4. Push-head radius: 0.5mm.
Bending	1. No falling off. 2. No disconnection/cracks.	1. Solder onto test board. 2. Bend to 2mm. 3. PCB size: 100401.0 (or 0.8mm) mm. 4. Duration: 30s. 5. Rate: 0.5mm/s.
Reflow	1. Appearance: No mechanical damage. 2. Inductance change: 10%.	Max. 260, for 3 times.
Long-term humid heat	1. Appearance: No hidden cracks, rust, or excessive glue. 2. Inductance change: 10%.	1. Temp: 60. 2. Humidity: 95%RH. 3. Time: 1000H +24/-0 hours. 4. Test after 1H standing.
Dropping	1. Appearance: No obvious damage. 2. Inductance change: 10%.	1. Solder onto test boards. 2. Drop from 1m onto marble floor. 3. 6 faces, 3 times each (18 drops total). 4. Counterweight: 250g 20g.
Long-term high temperature and high humidity	1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%.	1. Temp: 852. 2. Humidity: 855%. 3. Duration: 1000H +24/0 hours. 4. Test after 1H standing.
Low-temperature storage	1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%.	1. Temp: -402. 2. Time: 1000 +24/-0 hours. 3. Test after 1 hour standing.
High-temperature storage	1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%.	1. Temp: 125+2/-0. 2. Time: 1000+24/-0 hours. 3. Test after 1 hour standing.
Long-term durability	1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%.	1. Temp: 85 2. 2. Duration: 1000 + 24 / -0 hours. 3. Applied current: Rated current. 4. Test after 1 hour standing.
Thermal Shock	1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%.	1. -55+0/-5 (303 min) Room Temp (5 min) 125+5/-0 (303 min) Room Temp. 2. Conversion time: 5 min Max. 3. Cycles: 100. 4. Test after 1 hour standing.
Vibration	1. No parts falling off or cracks. 2. Inductance change: 10%.	1. Solder onto test board. 2. Acceleration: 5g. 3. Sweep speed: 20 min/cycle. 4. Cycles: 12 per axis (X, Y, Z), 36 total. 5. Frequency: 10 - 2000Hz.
Humid heat load (60/95%RH + loading)	1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%.	1. Temp: 60. 2. Humidity: 95%RH. 3. Applied Current: Rated current. 4. Duration: 1000H +24/-0 hours. 5. Test after 1 hour standing.

Packaging and Storage

Section	Details
Tape packaging dimensions	Code (mm): A0=1.950.05, B0=2.350.05, K0=1.150.05, T=0.250.05
Units/Reel	3K
Tape Direction	See Fig. 7-2
Reel Dimensions	See Fig. 7-3
Peel force of top cover tape	Peel speed: ~300 mm/min. Force: 0.1 to 0.7N.
Storage Conditions	Recommended: -10~40, 70% RH (Max.). Use within one year of delivery. Check solderability if stored over 6 months.

Reflow Profile

Method	Parameters
Reflow Soldering	Tp: 255~260 Max. 30 seconds (tp); 217 60~150 seconds; Pre-Heat: 150 ~ 200 60~120 seconds; Time from 25 to peak: 8 minutes max.
Soldering iron	3505 max., 3 seconds.